A method for on-chip interconnect characterization (Englisch)
- Neue Suche nach: Glaser, A.W.
- Neue Suche nach: Steer, M.B.
- Neue Suche nach: Shedd, G.M.
- Neue Suche nach: Russell, P.E.
- Neue Suche nach: Franzon, P.D.
- Neue Suche nach: Glaser, A.W.
- Neue Suche nach: Steer, M.B.
- Neue Suche nach: Shedd, G.M.
- Neue Suche nach: Russell, P.E.
- Neue Suche nach: Franzon, P.D.
In:
Electrical Performance of Electronic Packaging, IEEE Topical Meeting, 4
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108-110
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1995
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:A method for on-chip interconnect characterization
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Weitere Titelangaben:Eine Methode zur Charakterisierung von On-Chip Verbindungselementen
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Beteiligte:Glaser, A.W. ( Autor:in ) / Steer, M.B. ( Autor:in ) / Shedd, G.M. ( Autor:in ) / Russell, P.E. ( Autor:in ) / Franzon, P.D. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE Service Center
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Erscheinungsort:Piscataway
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Erscheinungsdatum:1995
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Format / Umfang:3 Seiten, 5 Bilder, 3 Quellen
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
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Proceedings of Electrical Performance of Electronic Packaging| 1995