Yield enhancement strategies for start-up of a high-volume 8-inch wafer fab (Englisch)
- Neue Suche nach: Lee, F.
- Neue Suche nach: Wang, P.
- Neue Suche nach: Ceton, R.
- Neue Suche nach: Goodner, R.
- Neue Suche nach: Chan, M.
- Neue Suche nach: Lee, F.
- Neue Suche nach: Wang, P.
- Neue Suche nach: Ceton, R.
- Neue Suche nach: Goodner, R.
- Neue Suche nach: Chan, M.
In:
IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, 1995
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272-275
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1995
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Yield enhancement strategies for start-up of a high-volume 8-inch wafer fab
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Weitere Titelangaben:Ausbeuteverbesserungsstrategien für das Anfahren einer 8-Inch-Wafer-Anlage mit großem Durchsatz
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Beteiligte:Lee, F. ( Autor:in ) / Wang, P. ( Autor:in ) / Ceton, R. ( Autor:in ) / Goodner, R. ( Autor:in ) / Chan, M. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE Service Center
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Erscheinungsort:Piscataway
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Erscheinungsdatum:1995
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Format / Umfang:4 Seiten, 3 Bilder, 5 Quellen
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:Halbleitertechnologie , Betriebsdatenerfassung , Messdatenverarbeitung , Produktivität , Inbetriebnahme , Fehlererkennung , Fehlerortung , Strategie , Anlagenplanung , integrierte Halbleiterschaltung , Inspektion , Fertigungsüberwachung , Prozessüberwachung , Qualitätssicherung , Qualitätsverbesserung , Serienfertigung
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Advanced Dielectric Etching with a High Density Plasma Tool: Issues and Challenges in ManufacturingCook, J. M. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 2
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Implementation of CMP-based Design Rules and Patterning PracticesCamilletti, L. E. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 5
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Rapid thermal processing (RTP) applied to ion implant anneal for 0.25 micron technologyHossain, S.D. / Pas, M.F. / Miner, G. / Cleavelin, C.R. et al. | 1995
- 5
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Rapid Thermal Processing (RTP) Applied to Ion Implant Anneal for 0.25m TechnologyHossain, S. D. / Pas, M. F. / Cleavelin, C. R. / Miner, G. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 8
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- 16
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Advancements in Wafer Finishing Manufacturing Technology Involving PlatingLowry, K. / VanHorn, C. / Shawhan, G. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 17
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ISPM Characterization of Gas Phase Nucleation in a Novellus C1 WCVD Process ChamberWinter, T. / Colston, D. / Mickler, E. / Woodward, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 23
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Capital Productivity - Challenge and OpportunityRowe, W. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 24
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- 29
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Plasma Etch Tool Selection Criteria for Minimizing Cost of OwnershipMautz, K. / Bloom, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 32
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Implementing Activity-Based Costing (ABC) is Easy! (As long as people aren't involved...)Devost, D. / Miller, P. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 35
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Facility Fluids Cost ModelsPatel, N. / Bosswell, T. / Nelson, T. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 42
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Cost Reduction in a Manufacturing Fabricator: From the Bottom UpCogley, S. M. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 45
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Transport and Storage Wafer Carrier Cost of OwnershipMikkelsen, K. J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 50
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Overview of Metrology Requirements based on the 1994 National Technology Roadmap for SemiconductorsDiebold, A. C. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 61
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- 62
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Networked Analysis SystemsDiebold, A. C. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 63
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COS-Based Q-V Testing: In-line Options for Oxide Charge MonitoringHorner, G. S. / Verkuil, R. L. / Miller, T. G. / Fung, M.-S. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 76
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In-Line Electrical Probe for CD Metrology Below 0.5mChain, E. E. / Harris, T. A. / Singh, B. P. / Nagy, T. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 76
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In-line electrical probe for CD metrology below 0.5 micronChain, E.E. / Harris, T.A. / Sing, B.P. / Nagy, T. / Merkel, W. et al. | 1995
- 81
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Economic Impact of a New Interferometer Providing Improved Overlay for Advanced MicrolithographyHenshaw, P. D. / Lis, S. A. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 81
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Economic impact of a new interferometer providing improved overlay for advanced microphotolithographyHenshaw, P.D. / Lis, S.A. et al. | 1995
- 89
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Determination of Emissions and Evaluation of Abatement Equipment for Selected Semiconductor ProcessesRidgeway, R. G. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 90
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Simulation of emergent behavior in manufacturing systemsSpier, J. / Kempf, K. et al. | 1995
- 90
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Simulation of Emergent Behavior in Manufacturing SystemSpier, J. / Kempf, K. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 95
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A Methodology for Improving On-Time Delivery and Load Leveling StartsLiu, C. / Thongmee, S. / Hepburn, P. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 101
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Partnering for the Integration of Equipment Recipe Services into an Automated FactoryAchacoso, J. / Pisapia, G. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 105
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Cycle Time Metrics for R&D Semiconductor Wafer FabricationPierce, N. G. / Yost, A. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 111
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Evaluating Workcell LayoutsNehme, D. / McKiddie, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 115
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Closed-Loop Measurement of Equipment Efficiency and Equipment CapacityLeachman, R. C. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 127
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A Logistical Management System Using Calculated Raw-Process-Time Factors for Production ControlHolmes, J. W. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 131
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Using Simulation-Based Finite Capacity Planning and Scheduling Software to Improve Cycle Time in Front End OperationsThompson, M. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 136
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Reconvergent Specular Detection of Material Defects on SiliconFerrara, M. B. / Welch, K. A. / Clementi, L. D. / Hunt, J. D. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 141
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An Experimental Analysis of Cl~2/BCl~3 Gas Flows on Submicron Al-Cu Plasma EtchingGonzalez, J. / Fujinohara, T. / Szettella, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 142
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A Model of CIMAardal, M. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 159
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- 167
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Partitioning Yield Loss via Test Pattern Structures and Critical AreasEvans, W. M. / Cyr, R. / Wilson, D. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Development of Cost of Ownership Modeling at a Semiconductor Production FacilityNa�ez, R. / Iturralde, A. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 178
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RTP Installed Based Productivity Improvement ProjectSperanza, T. / Tomlinson, D. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 179
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Partnering Relationships With Suppliers Result in Improved Cost, Quality and Delivery PerformanceWasmund, P. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 182
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- 183
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Current Realities and Future Opportunities for Russia's Semiconductor IndustrySukhoparov, A. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 190
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A Semiconductor Device Manufacturer's Efforts for Controlling and Evaluating Atmospheric PollutionKanzawa, K. / Kitano, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 201
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Practical Issues in Run by Run Process ControlBoning, D. / Moyne, W. / Smith, T. / Moyne, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 209
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- 216
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Process Control Methodology for PSG and PETEOS Films in a Highly Interactive Multiprocess CVD SystemBenson-Woodward, H. / Hanson, E. / Moreau, S. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 229
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PM Effectiveness as a High Leverage Output Improvement MethodologySaha, S. / Kuppuswamy, C. / Kraus, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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A Practical Approach to Equipment Reliability EnhancementAzzano, L. / Gay, D. / Pasumamula, A. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Resource Allocation for Yield Learning in Semiconductor ManufacturingWang, E. / Akella, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Factory Start-up and Production Ramp: Yield Improvement through Signature Analysis and Visual/Electrical CorrelationLee, F. / Wang, P. / Goodner, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Defect Sampling Methodology: The Development of an Effective Defect Sampling Strategy During the Initial Start-up Phase of a 0.35m Fabrication FacilityCappel, R. / Hilton, R. / Lim, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 272
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Yield Enhancement Strategies for Start-up of a High-Volume 8 inch Wafer FabLee, F. / Wang, P. / Ceton, R. / Goodner, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 276
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Spatial Yield Modeling for Semiconductor WafersMirza, A. I. / Drake, A. W. / Graves, S. C. / O'Donoghue, G. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Yield Enhancement Using a Memory Expert System Linked to the Wafer Inspection ToolSugimoto, M. / Hamada, H. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 293
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Customer Supplier Partnering to Provide Statistical Models to Predict New Hardware and Process Interactions and LimitationsBrennan, B. / Mitchell, T. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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- 302
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- 309
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Non-Destructive Detection of Ion Implant Contamination: A SEMATECH/AMD StudyWenner, V. / Lowell, J. / Shi, J. / Larson, L. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
- 315
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Study of Heavy Metal Contamination from Dry Etching Process and Its Effects on Subsequent Wet ProcessingGil, J. I. / Chun, P. K. / Chae, S. K. / Chun, S. M. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Passive Evaluation of Surface and Bulk Ionic Deposition From Resist Removal Using Surface PhotovoltageBrown, S. / Ackmann, P. / Wenner, V. / Lowell, J. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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The Effect of Airborne Contaminants in the Cleanroom for ULSI Manufacturing ProcessTamaoki, M. / Nishiki, K. / Shimazaki, A. / Sasaki, Y. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Inter-discipline Cross-shift Teams for Station Improvements: A Case StudyPrendergast, B. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Development of an Optimal Inspection Strategy for Chemical Mechanical Polished (CMP) WafersSacco, R. / Cappel, R. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Defect Characterisation and Reduction on a Multi-Chamber Inter Layer Dielectric (ILD) ToolPrendergast, B. / Hudson, P. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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Implementation of an In-Situ Particle Monitor system on an Oxide Plasma Process systemKong, G. Y. / Stager, C. W. / Campbell, A. C. / IEEE| Semiconductor Equipment and Materials International et al. | 1995
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