E-Books durchsuchen
3D and Circuit Integration of MEMS [2021]
- 1
-
Overview
- 13
-
Bulk Micromachining
- 49
-
Enhanced Bulk Micromachining Based on <fc>MIS</fc> Process
- 61
-
Epitaxial Poly Si Surface Micromachining
- 69
-
Poly‐<fc>SiGe</fc> Surface Micromachining
- 99
-
Metal Surface Micromachining
- 113
-
Heterogeneously Integrated Aluminum Nitride <fc>MEMS</fc> Resonators and Filters
- 131
-
MEMS Using CMOS Wafer
- 221
-
Wafer Transfer
- 243
-
Piezoelectric MEMS
- 257
-
Anodic Bonding
- 279
-
Direct Bonding
- 289
-
Metal Bonding
- 309
-
Reactive Bonding
- 331
-
Polymer Bonding
- 361
-
Soldering by Local Heating
- 377
-
Packaging, Sealing, and Interconnection
- 409
-
Vacuum Packaging
- 423
-
Buried Channels in Monolithic <fc>Si</fc>
- 443
-
Through‐substrate Vias
- 493
-
Index
- i
-
Front Matter
