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3D Stacked Chips [2016]
- 3
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Introduction to Electrical 3D Integration
- 9
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Copper-Based TSV: Interposer
- 29
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Energy Efficient Electrical Intra-Chip-Stack Communication
- 69
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Multi-TSV Crosstalk Channel Equalization with Non-uniform Quantization
- 85
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Energy Efficient TSV Based Communication Employing 1-Bit Quantization at the Receiver
- 101
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Clock Generators for Heterogeneous MPSoCs Within 3D Chip Stacks
- 129
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Two-nanometer Laser Synthesized Si-Nanoparticles for Low Power Memory Applications
- 157
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Accurate Temperature Measurement for 3D Thermal Management
- 175
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EDA Environments for 3D Chip Stacks
- 195
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Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias
- 213
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Introduction to Optical Inter- and Intraconnects
- 221
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Optical Through-Silicon Vias
- 235
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Integrated Optical Devices for 3D Photonic Transceivers
- 255
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Cantilever Design for Tunable WDM Filters Based on Silicon Microring Resonators
- 283
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Athermal Photonic Circuits for Optical On-Chip Interconnects
- 297
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Integrated Circuits for 3D Photonic Transceivers
- 309
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Review of Interdigitated Back Contacted Full Heterojunction Solar Cell (IBC-SHJ): A Simulation Approach