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3D Stacked Chips [2016]

3
Introduction to Electrical 3D Integration
9
Copper-Based TSV: Interposer
29
Energy Efficient Electrical Intra-Chip-Stack Communication
69
Multi-TSV Crosstalk Channel Equalization with Non-uniform Quantization
85
Energy Efficient TSV Based Communication Employing 1-Bit Quantization at the Receiver
101
Clock Generators for Heterogeneous MPSoCs Within 3D Chip Stacks
129
Two-nanometer Laser Synthesized Si-Nanoparticles for Low Power Memory Applications
157
Accurate Temperature Measurement for 3D Thermal Management
175
EDA Environments for 3D Chip Stacks
195
Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias
213
Introduction to Optical Inter- and Intraconnects
221
Optical Through-Silicon Vias
235
Integrated Optical Devices for 3D Photonic Transceivers
255
Cantilever Design for Tunable WDM Filters Based on Silicon Microring Resonators
283
Athermal Photonic Circuits for Optical On-Chip Interconnects
297
Integrated Circuits for 3D Photonic Transceivers
309
Review of Interdigitated Back Contacted Full Heterojunction Solar Cell (IBC-SHJ): A Simulation Approach
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