IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society

Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.

Inhaltsverzeichnis

662
Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High Performance Applications
Canavero, F. / Franzon, P.D. et al. | 2008
662
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications
Canavero, Flavio / Franzon, Paul D. et al. | 2008
664
Modal Vector Fitting: A Tool For Generating Rational Models of High Accuracy With Arbitrary Terminal Conditions
Gustavsen, B. / Heitz, C. et al. | 2008
664
SPECIAL SECTION PAPERS - Modal Vector Fitting: A Tool For Generating Rational Models of High Accuracy With Arbitrary Terminal Conditions
Gustavsen, B. et al. | 2008
673
A Comparative Study of Passivity Enforcement Schemes for Linear Lumped Macromodels
Grivet-Talocia, S. / Ubolli, A. et al. | 2008
684
Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid Underlayer
Quere, Y. / Le Gouguec, T. / Martin, P.-M. et al. | 2008
692
Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects
Maffucci, A. / Miano, G. / Villone, F. et al. | 2008
700
Locally-Stable Macromodels of Integrated Digital Devices for Multimedia Applications
Stievano, I.S. / Siviero, C. / Maio, I.A. et al. | 2008
711
Improving Behavioral IO Buffer Modeling Based on IBIS
Varma, A.K. / Steer, M. / Franzon, P.D. et al. | 2008
722
Accurate System Voltage and Timing Margin Simulation in High-Speed I/O System Designs
Kyung Suk Oh, / Lambrecht, F. / Sam Chang, et al. | 2008
731
Controlled Intersymbol Interference Design Techniques of Conventional Interconnect Systems for Data Rates Beyond 20 Gbps
Beyene, W.T. / Amirkhany, A. et al. | 2008
741
Multiple Edge Responses for Fast and Accurate System Simulations
JiHong Ren, / Kyung Suk Oh, et al. | 2008
749
Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling
Chandrasekar, K. / Wilson, J. / Erickson, E. et al. | 2008
759
Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications
Dangel, R. / Berger, C. / Beyeler, R. et al. | 2008
768
PEEC Modeling of Dispersive and Lossy Dielectrics
Antonini, G. / Ruehli, A.E. / Chuanyi Yang, et al. | 2008
768
PEEF Modeling of Dispersive and Lossy Dielectrics
Antonini, G. / Ruehli, A.E. / Yang, C. et al. | 2008
783
Interchannel Crosstalk Analysis in Parallel Optical Receiver up to 10 GHz
Sang Hyun Park, / Chul Soon Park, / Karppinen, M. et al. | 2008
794
A Frequency Triplexer for Ultra-Wideband Systems Utilizing Combined Broadside- and Edgee-Coupled Filters
Karlsson, M. et al. | 2008
794
A Frequency Triplexer for Ultra-Wideband Systems Utilizing Combined Broadside- and Edge-Coupled Filters
Karlsson, M. / Hakansson, P. / Shaofang Gong, et al. | 2008
802
Design and Manufacturing of Stretchable High-Frequency Interconnects
Huyghe, B. / Rogier, H. / Vanfleteren, J. et al. | 2008
809
A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines
Kyoungho Lee, / Hyun-Bae Lee, / Hae-Kang Jung, et al. | 2008
818
Full-Wave Analysis of Large-Scale Interconnects Using the Multilevel UV Method With the Sparse Matrix Iterative Approach (SMIA)
Chong-Jin Ong, / Leung Tsang, et al. | 2008
830
Full-Field 3-D Flip-Chip Solder Bumps Measurement Using DLP-Based Phase Shifting Technique
Hsu-Nan Yen, / Du-Ming Tsai, / Shang-Kai Feng, et al. | 2008
841
Comprehensive Electromagnetic Modeling of On-Chip Switching Noise Generation and Coupling
Jae-Yong Ihm, / In Jae Chung, / Manetas, G. et al. | 2008
855
Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees
Ho-Gyeong Yun, / Kwang-Seong Choi, / Yong-Hwan Kwon, et al. | 2008
861
Development of a Broadband Coplanar Waveguide-to-Microstrip Transition With Vias
Zhen Zhou, / Melde, K.L. et al. | 2008
873
A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures
Jianfang Zhu, / Dan Jiao, et al. | 2008
882
Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive Adhesives
Xiaowu Zhang, / Wong, E.H. / Rajoo, R. et al. | 2008
890
A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures
Dan Jiao, / Jianfang Zhu, / Chakravarty, S. et al. | 2008
900
Power Handling Capability of Substrate Integrated Waveguide Interconnects and Related Transmission Line Systems
Yu Jian Cheng, / Ke Wu, / Wei Hong, et al. | 2008
910
High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages
Heungkyu Kim, / Yungseon Eo, et al. | 2008
919
List of Reviewers
| 2008
921
Table of contents
| 2008
924
2008 Index IEEE Transactions on Advanced Packaging Vol. 31
| 2008
924
2008 Index
| 2008
C2
IEEE Transactions on Advanced Packaging publication information
| 2008
C4
IEEE Components, Packaging, and Manufacturing Technology Society Information
| 2008
C4
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
| 2008
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