A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines (Englisch)
- Neue Suche nach: Lee, K.
- Neue Suche nach: Lee, K.
- Neue Suche nach: Lee, H.-B.
- Neue Suche nach: Jung, H.-K.
- Neue Suche nach: Sim, J.-Y.
- Neue Suche nach: Park, H.-J.
In:
IEEE transactions on advanced packaging
;
31
, 4
; 809-817
;
2008
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines
-
Beteiligte:
-
Erschienen in:IEEE transactions on advanced packaging ; 31, 4 ; 809-817
-
Verlag:
- Neue Suche nach: IEEE
-
Erscheinungsort:New York, NY
-
Erscheinungsdatum:2008
-
ISSN:
-
ZDBID:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Print
-
Sprache:Englisch
-
Schlagwörter:
-
Klassifikation:
-
Datenquelle:
Inhaltsverzeichnis – Band 31, Ausgabe 4
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 662
-
Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High Performance ApplicationsCanavero, F. / Franzon, P.D. et al. | 2008
- 662
-
Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance ApplicationsCanavero, Flavio / Franzon, Paul D. et al. | 2008
- 664
-
Modal Vector Fitting: A Tool For Generating Rational Models of High Accuracy With Arbitrary Terminal ConditionsGustavsen, B. / Heitz, C. et al. | 2008
- 664
-
SPECIAL SECTION PAPERS - Modal Vector Fitting: A Tool For Generating Rational Models of High Accuracy With Arbitrary Terminal ConditionsGustavsen, B. et al. | 2008
- 673
-
A Comparative Study of Passivity Enforcement Schemes for Linear Lumped MacromodelsGrivet-Talocia, S. / Ubolli, A. et al. | 2008
- 684
-
Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid UnderlayerQuere, Y. / Le Gouguec, T. / Martin, P.-M. / Le Berre, D. / Huret, F. et al. | 2008
- 692
-
Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-InterconnectsMaffucci, A. / Miano, G. / Villone, F. et al. | 2008
- 700
-
Locally-Stable Macromodels of Integrated Digital Devices for Multimedia ApplicationsStievano, I.S. / Siviero, C. / Maio, I.A. / Canavero, F.G. et al. | 2008
- 711
-
Improving Behavioral IO Buffer Modeling Based on IBISVarma, A.K. / Steer, M. / Franzon, P.D. et al. | 2008
- 722
-
Accurate System Voltage and Timing Margin Simulation in High-Speed I/O System DesignsKyung Suk Oh, / Lambrecht, F. / Sam Chang, / Qi Lin, / Jihong Ren, / Chuck Yuan, / Zerbe, J. / Stojanovic, V. et al. | 2008
- 731
-
Controlled Intersymbol Interference Design Techniques of Conventional Interconnect Systems for Data Rates Beyond 20 GbpsBeyene, W.T. / Amirkhany, A. et al. | 2008
- 741
-
Multiple Edge Responses for Fast and Accurate System SimulationsJiHong Ren, / Kyung Suk Oh, et al. | 2008
- 749
-
Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse SignalingChandrasekar, K. / Wilson, J. / Erickson, E. / Zhiping Feng, / Jian Xu, / Mick, S. / Franzon, P. et al. | 2008
- 759
-
Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom ApplicationsDangel, R. / Berger, C. / Beyeler, R. / Dellmann, L. / Gmur, M. / Hamelin, R. / Horst, F. / Lamprecht, T. / Morf, T. / Oggioni, S. et al. | 2008
- 768
-
PEEC Modeling of Dispersive and Lossy DielectricsAntonini, G. / Ruehli, A.E. / Chuanyi Yang, et al. | 2008
- 768
-
PEEF Modeling of Dispersive and Lossy DielectricsAntonini, G. / Ruehli, A.E. / Yang, C. et al. | 2008
- 783
-
Interchannel Crosstalk Analysis in Parallel Optical Receiver up to 10 GHzSang Hyun Park, / Chul Soon Park, / Karppinen, M. / Tanskanen, A. / Kautio, K. / Karioja, P. et al. | 2008
- 794
-
A Frequency Triplexer for Ultra-Wideband Systems Utilizing Combined Broadside- and Edgee-Coupled FiltersKarlsson, M. et al. | 2008
- 794
-
A Frequency Triplexer for Ultra-Wideband Systems Utilizing Combined Broadside- and Edge-Coupled FiltersKarlsson, M. / Hakansson, P. / Shaofang Gong, et al. | 2008
- 802
-
Design and Manufacturing of Stretchable High-Frequency InterconnectsHuyghe, B. / Rogier, H. / Vanfleteren, J. / Axisa, F. et al. | 2008
- 809
-
A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip LinesKyoungho Lee, / Hyun-Bae Lee, / Hae-Kang Jung, / Jae-Yoon Sim, / Hong-June Park, et al. | 2008
- 818
-
Full-Wave Analysis of Large-Scale Interconnects Using the Multilevel UV Method With the Sparse Matrix Iterative Approach (SMIA)Chong-Jin Ong, / Leung Tsang, et al. | 2008
- 830
-
Full-Field 3-D Flip-Chip Solder Bumps Measurement Using DLP-Based Phase Shifting TechniqueHsu-Nan Yen, / Du-Ming Tsai, / Shang-Kai Feng, et al. | 2008
- 841
-
Comprehensive Electromagnetic Modeling of On-Chip Switching Noise Generation and CouplingJae-Yong Ihm, / In Jae Chung, / Manetas, G. / Cangellaris, A. et al. | 2008
- 855
-
Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias TeesHo-Gyeong Yun, / Kwang-Seong Choi, / Yong-Hwan Kwon, / Joong-Seon Choe, / Jong-Tae Moon, et al. | 2008
- 861
-
Development of a Broadband Coplanar Waveguide-to-Microstrip Transition With ViasZhen Zhou, / Melde, K.L. et al. | 2008
- 873
-
A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect StructuresJianfang Zhu, / Dan Jiao, et al. | 2008
- 882
-
Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive AdhesivesXiaowu Zhang, / Wong, E.H. / Rajoo, R. / Iyer, M.K. / Caers, J. / Zhao, X.J. et al. | 2008
- 890
-
A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect StructuresDan Jiao, / Jianfang Zhu, / Chakravarty, S. et al. | 2008
- 900
-
Power Handling Capability of Substrate Integrated Waveguide Interconnects and Related Transmission Line SystemsYu Jian Cheng, / Ke Wu, / Wei Hong, et al. | 2008
- 910
-
High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit PackagesHeungkyu Kim, / Yungseon Eo, et al. | 2008
- 919
-
List of Reviewers| 2008
- 921
-
Table of contents| 2008
- 924
-
2008 Index IEEE Transactions on Advanced Packaging Vol. 31| 2008
- 924
-
2008 Index| 2008
- C2
-
IEEE Transactions on Advanced Packaging publication information| 2008
- C4
-
IEEE Components, Packaging, and Manufacturing Technology Society Information| 2008
- C4
-
IEEE Components, Packaging, and Manufacturing Technology Society information for authors| 2008