Dynamic response of mode III interface crack in bonded materials [1999-25] (Englisch)
- Neue Suche nach: Zhao, Y.-P.
- Neue Suche nach: Fang, J.
- Neue Suche nach: SPIE the International Society for Optical Engineering
- Neue Suche nach: Zhao, Y.-P.
- Neue Suche nach: Fang, J.
- Neue Suche nach: Norland, E. A.
- Neue Suche nach: Liechti, K. M.
- Neue Suche nach: SPIE the International Society for Optical Engineering
In:
Adhesives engineering
1999
;
214-219
;
1993
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Dynamic response of mode III interface crack in bonded materials [1999-25]
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Beteiligte:Zhao, Y.-P. ( Autor:in ) / Fang, J. ( Autor:in ) / Norland, E. A. / Liechti, K. M. / SPIE the International Society for Optical Engineering
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Kongress:Conference, Adhesives engineering ; 1993 ; San Diego; CA
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Erschienen in:Adhesives engineering , 1999 ; 214-219PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING , 1999 ; 214-219
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Verlag:
- Neue Suche nach: The Society
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Erscheinungsdatum:01.01.1993
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Format / Umfang:6 pages
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 6
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New perspectives in polymer adhesion mechanisms--importance of diffusion and molecular bonding in adhesionLee, Lieng-Huang et al. | 1993
- 6
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New perspectives in polymer adhesion mechanisms: importance of diffusion and molecular bonding in adhesion (Keynote Address) [1999-01]Lee, L.-H. / SPIE the International Society for Optical Engineering et al. | 1993
- 22
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Minimizing cement strain while cementing thin lenses using ultraviolet lightGreen, Donald R. et al. | 1993
- 22
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Minimizing cement strain while assembling thin lenses using ultraviolet light [1999-03]Green, D. R. / SPIE the International Society for Optical Engineering et al. | 1993
- 25
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Mechanisms relating to reducing stress in curing thick sections of UV adhesivesNorland, Eric A. / Martin, Frank S. et al. | 1993
- 25
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Mechanisms relating to reducing stress in curing thick sections of UV adhesives [1999-04]Norland, E. A. / Martin, F. S. / SPIE the International Society for Optical Engineering et al. | 1993
- 30
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Cold lens blocking methods [1999-05]Novak, R. F. / Marro, M. A. / Tipps, J. D. / Czajkowski, W. C. / SPIE the International Society for Optical Engineering et al. | 1993
- 30
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Cold lens blocking methodsNovak, Robert F. / Marro, Marlene A. / Tipps, Joe D. / Czajkowski, Walter C. et al. | 1993
- 36
-
Effects of military environments on optical adhesives [1999-06]Krevor, D. H. / Vazirani, H. N. / Xu, A. / SPIE the International Society for Optical Engineering et al. | 1993
- 36
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Effects of military environments on optical adhesivesKrevor, David H. / Vazirani, Hargovind N. / Xu, Antai et al. | 1993
- 43
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Outgassing: an atypical approachMartin, Frank S. / Norland, Eric A. et al. | 1993
- 43
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Outgassing: an atypical approach [1999-07]Martin, F. S. / Norland, E. A. / SPIE the International Society for Optical Engineering et al. | 1993
- 48
-
Finite-element analysis of adhesive butt joints in fiber optic devices [1999-08]Sultana, J. A. / O'Brien, D. R. / Forman, S. E. / SPIE the International Society for Optical Engineering et al. | 1993
- 48
-
Finite-element analysis of adhesive butt joints in fiber optic devicesSultana, John A. / O'Brien, Daniel R. / Forman, Steven E. et al. | 1993
- 59
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Causes for separation in UV adhesive-bonded optical assemblies [1999-09]Woods, H. F. / SPIE the International Society for Optical Engineering et al. | 1993
- 59
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Causes for separation in UV adhesive bonded optical assembliesWoods, H. F. et al. | 1993
- 63
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Glass-on-chip package for CCDs [1999-11]Karpman, M. S. / Reiche, C. / SPIE the International Society for Optical Engineering et al. | 1993
- 63
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Glass-on-chip package for CCDsKarpman, Maurice S. / Reiche, Christopher et al. | 1993
- 68
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Inverted microscope refitted for the testing of epoxy coating debonding induced by indenters on the glass substratesChen, Ruiyi et al. | 1993
- 68
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Inverted microscope refitted for the testing of epoxy coating debonding induced by indenters on the glass substrates [1999-13]Chen, R. / SPIE the International Society for Optical Engineering et al. | 1993
- 80
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Dual cracking at polymer/glass interfacesRitter, John E. / Lardner, T. J. / Prakash, G. C. / Stewart, A. J. / Surorova, V. et al. | 1993
- 80
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Dual cracking at polymer/glass interfaces [1999-14]Ritter, J. E. / Lardner, T. J. / Prakash, G. C. / Stewart, A. J. / SPIE the International Society for Optical Engineering et al. | 1993
- 87
-
Measurement of mixed mode (I,II) stress intensity factors (SIFs) of an interface crack by the optical method of causticsEdwards, Lyndon / Ahmad, H. Y. et al. | 1993
- 87
-
Measurement of mixed mode (I, II) stress intensity factors (SIFs) of an interface crack by the optical method of caustics [1999-15]Edwards, L. / Ahmad, H. Y. / SPIE the International Society for Optical Engineering et al. | 1993
- 98
-
Measurement of bimaterial interface fracture parameters using modified SEN beam specimens and coherent gradient sensingTippur, Hareesh V. / Ramaswamy, Sreeganesh et al. | 1993
- 98
-
Measurement of bimaterial interface fracture parameters using modified SEN beam specimens and coherent gradient sensing [1999-16]Tippur, H. V. / Ramaswamy, S. / SPIE the International Society for Optical Engineering et al. | 1993
- 109
-
Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesivesMix, Devin E. / Bar-Cohen, Avram et al. | 1993
- 109
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Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives [1999-17]Mix, D. E. / Bar-Cohen, A. / SPIE the International Society for Optical Engineering et al. | 1993
- 126
-
Fracture energy of ice/metal interfaces [1999-18]Wei, Y. / Adamson, R. M. / Dempsey, J. P. / SPIE the International Society for Optical Engineering et al. | 1993
- 126
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Fracture energy of ice/metal interfacesWei, Yingchang / Adamson, Robert M. / Dempsey, John P. et al. | 1993
- 138
-
Testing and computer modeling of adhesives in bulk and bonded statesRoy, Samit / Spigel, Barry S. et al. | 1993
- 138
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Testing and computer modeling of adhesives in bulk and bonded states [1999-19]Roy, S. / Spigel, B. S. / SPIE the International Society for Optical Engineering et al. | 1993
- 150
-
Calibration of the plane-strain mixed-mode pullout delamination specimen [1999-20]Charalambides, P. G. / Srikantan, S. / SPIE the International Society for Optical Engineering et al. | 1993
- 150
-
Calibration of the plane-strain mixed-mode pullout delamination specimenCharalambides, Panos G. / Srikantan, S. et al. | 1993
- 162
-
Test efficiency: a simple parameter for comparing adhesive fracture tests for adhesion measurement [1999-21]Lai, Y.-H. / Dillard, D. A. / SPIE the International Society for Optical Engineering et al. | 1993
- 162
-
Test efficiency: a simple parameter for comparing adhesive fracture tests for adhesion measurementLai, Yeh-Hung / Dillard, David A. et al. | 1993
- 174
-
Nondestructive testing of bonded structures with Reverse Geometry X-ray[R] imaging [1999-23]Albert, T. M. / SPIE the International Society for Optical Engineering et al. | 1993
- 174
-
Nondestructive testing of bonded structures with Reverse Geometry X-ray imagingAlbert, Thomas M. et al. | 1993
- 185
-
Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds [1999-24]Bischof, T. / Jueptner, W. P. / SPIE the International Society for Optical Engineering et al. | 1993
- 185
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Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bondsBischof, Thomas / Jueptner, Werner P. O. et al. | 1993
- 198
-
Comparison of numerous lap joint theories for adhesively bonded jointsCarpenter, William C. et al. | 1993
- 198
-
Comparison of numerous lap joint theories for adhesively bonded joints [1999-28]Carpenter, W. C. / SPIE the International Society for Optical Engineering et al. | 1993
- 205
-
Suitability of various blister tests for thin film adhesionLiechti, Kenneth M. / Shirani, A. et al. | 1993
- 205
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Suitability of various blister tests for thin film adhesion [1999-29]Liechti, K. M. / Shirani, A. / SPIE the International Society for Optical Engineering et al. | 1993
- 214
-
Dynamic response of mode III interface crack in bonded materialsZhao, Ya-Pu / Fang, Jing et al. | 1993
- 214
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Dynamic response of mode III interface crack in bonded materials [1999-25]Zhao, Y.-P. / Fang, J. / SPIE the International Society for Optical Engineering et al. | 1993
- 220
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Effect of dislocations in multilayer mediaPan, Kelin / Fang, Jing et al. | 1993
- 220
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Effects of dislocations in multilayer media [1999-26]Pan, K. L. / Fang, J. / SPIE the International Society for Optical Engineering et al. | 1993
- 229
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Dynamic failure analysis of bimaterial beam with crack tip terminating interfaceFang, Jing / Jiang, Z. D. / Qi, Jiang / Zhao, Ya-Pu et al. | 1993
- 229
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Dynamic failure analysis of bimaterial beam with crack tip terminating interface [1999-27]Fang, J. / Jiang, Z. D. / Qi, J. / Zhao, Y.-P. / SPIE the International Society for Optical Engineering et al. | 1993
- 238
-
Failure analysis of adhesively bonded composite joint: an elastoplastic approach [1999-30]Pradhan, S. C. / Kishore, N. N. / Iyengar, N. G. R. / SPIE the International Society for Optical Engineering et al. | 1993
- 238
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Failure analysis of adhesively bonded composite joint: an elasto-plastic approachPradhan, S. C. / Kishore, N. N. / Iyengar, N. G. R. et al. | 1993
- 248
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Application of holographic interferometry to the characterization of the dynamics of a complex bonded structureFein, Howard et al. | 1993
- 248
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Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure [1999-31]Fein, H. / SPIE the International Society for Optical Engineering et al. | 1993