Determination of Shear Stress at a Solder Paste/Stencil Interface (Englisch)
- Neue Suche nach: Head, L. M.
- Neue Suche nach: Rogers, V.
- Neue Suche nach: Sahay, C.
- Neue Suche nach: Constable, J.
- Neue Suche nach: Materials Research Society
- Neue Suche nach: Head, L. M.
- Neue Suche nach: Rogers, V.
- Neue Suche nach: Sahay, C.
- Neue Suche nach: Constable, J.
- Neue Suche nach: Borgesen, P.
- Neue Suche nach: Jensen, K. F.
- Neue Suche nach: Pollak, R. A.
- Neue Suche nach: Materials Research Society
In:
Electronic packaging materials science VII
;
425-434
;
1994
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Determination of Shear Stress at a Solder Paste/Stencil Interface
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Beteiligte:Head, L. M. ( Autor:in ) / Rogers, V. ( Autor:in ) / Sahay, C. ( Autor:in ) / Constable, J. ( Autor:in ) / Borgesen, P. / Jensen, K. F. / Pollak, R. A. / Materials Research Society
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Kongress:Symposium, Electronic packaging materials science VII ; 1993 ; Boston; MA
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Erschienen in:MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS ; 323 ; 425-434
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Verlag:
- Neue Suche nach: Materials Research Society
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Erscheinungsdatum:01.01.1994
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Format / Umfang:10 pages
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Anmerkungen:Held as part of the 1993 Fall meeting
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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Inhaltsverzeichnis Konferenzband
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