MCM-D Manufacturing for the 21st Century: The Facility, The Product, The Cost (Englisch)
- Neue Suche nach: Dieffenbach, J. R.
- Neue Suche nach: Adams, B. B.
- Neue Suche nach: Dieffenbach, J. R.
- Neue Suche nach: Adams, B. B.
In:
Multichip modules
2794
;
339-344
;
1996
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:MCM-D Manufacturing for the 21st Century: The Facility, The Product, The Cost
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Beteiligte:Dieffenbach, J. R. ( Autor:in ) / Adams, B. B. ( Autor:in )
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Kongress:International conference; 5th, Multichip modules ; 1996 ; Denver; CO
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Erschienen in:Multichip modules , 2794 ; 339-344PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING , 2794 ; 339-344
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Verlag:
- Neue Suche nach: ISHM - The Microelectronics Society
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Erscheinungsdatum:01.01.1996
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Format / Umfang:6 pages
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Anmerkungen:Also known as ICEMCM '96
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 001
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A Pentium[R] Processor Based L/D MCM Test Vehicle: A Subsystem for Portable ApplicationsCherukuri, N. / Liao, J.-M. / Denuit, R. V. / Kawano, K. et al. | 1996
- 006
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Casting Light on Recent Advancements in Laser Based MCM-L ProcessingTessier, T. G. / Aday, J. G. et al. | 1996
- 015
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Comparing Costs for Various PWB Build-Up TechnologiesHolden, H. et al. | 1996
- 022
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Development and Characterization of a Few-Chip Module Housing a DC-DC Power SupplyHashemi, H. / Walshak, D. / Mehrotra, P. et al. | 1996
- 028
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A Low Cost Multichip Module Using Flex Substrate and Ball Grid ArrayArnn, D. A. / Parkerson, J. P. / Schaper, L. W. / Ang, S. S. et al. | 1996
- 033
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Design Trade-Offs of MCM-C vs. Ball Grid Array on Printed Wiring BoardHorowitz, S. J. / Amey, D. I. / Page, J. P. / Ladd, S. K. et al. | 1996
- 039
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Stressing the Need for Improved Pricing Metrics for MCM-D and MCM-D on C ProductsBerger, D. G. / Clearfield, H. M. / O'Donnell, W. J. / Miller, W. R. et al. | 1996
- 039
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Stressing the Need for Improve Pricing Metrics for MCM-D and MCM-D on C ProductsBerger, D. G. / Clearfield, H. M. / O'Donnell, W. J. / Miller, W. R. et al. | 1996
- 045
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Thermal Management Approach for a Scalable, MCM-Based SystemBartilson, B. / Hokanson, K. E. et al. | 1996
- 052
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Hermetic Thick Film Multichip ModulesKeusseyan, R. L. / Sawhill, H. / Horowitz, S. / Horne, G. et al. | 1996
- 058
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Testing Probe for Multichip Modules with High-Speed VLSIsKasukabe, S. / Mizuuchi, Y. / Numata, K. et al. | 1996
- 063
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Line Impedance Control in MCM-Cs with Meshed Ground-/Power PlanesMuller, J. / Badstubner, O. / Thust, H. / Exner, M. et al. | 1996
- 069
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MCM-D/C Applications for a High Performance ModulePerfecto, E. D. / McEntee, K. / Lidestri, K. / Longworth, H. et al. | 1996
- 075
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Twinstar - Dual Pentium[R] Processor ModuleSkinner, M. P. / Garrou, P. E. / Castillo, D. / Cummings, S. et al. | 1996
- 082
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Advanced MCM-Ds Break the I/O Bottleneck with Embedded Area-Array Integrated CircuitsGravrok, R. / Scheid, D. / Ficke, J. T. / VanGoor, K. A. et al. | 1996
- 088
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A Hermetic Thin Film Sealing Technology for MCM-DMcHerron, D. / Toy, H. / Cammarano, A. et al. | 1996
- 088
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A Hermetic Thin Films Sealing Technology for MCM-DMcHerron, D. / Toy, H. / Cammarano, A. et al. | 1996
- 094
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Thermally Stable Thin Film Tantalum Pentoxide CapacitorPeters, M. G. / Lee, M. G. / Takahashi, Y. / Beilin, S. et al. | 1996
- 100
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Design and Fabrication of a High Speed Multichip ModulePeltier, J. / Hansford, W. / Emerling, M. / Parrish, P. et al. | 1996
- 108
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A 480-MFLOP MCM Based on the Sharp DSP Chip, Breaks the MCM Cost BarrierScannell, R. K. et al. | 1996
- 108
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A 480-MFLOP MCM Based on the SHARC DSP Chip, Breaks the MCM Cost BarrierScannell, R. K. et al. | 1996
- 113
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High-Bandwidth Low-Latency 3D Memory ModuleFicke, J. / Gravrok, R. J. / Hokanson, K. E. / Berry, C. J. et al. | 1996
- 119
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The Modular Design and Realization of a 35 GHz Phase Shifter ReceiverOppermann, M. / Feurer, E. / Hall, B. / Schroth, J. et al. | 1996
- 125
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A Set of Multichip Modules for High Speed Telecom ApplicationsLicciardi, L. / Peretti, M. / Pilati, L. / Ichai, J. J. et al. | 1996
- 131
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HAM: A Cost Effective, High Speed ATM Switching Matrix Using MCM-L and Bumpless TABJoly, J. / Lambert, D. / Plaza, P. et al. | 1996
- 137
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MCM Application: Automotive Case StudiesDall'Agnese, P. et al. | 1996
- 142
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Low Cost MCM-L for Vehicle Applications: Innerlayer Materials and ProcessFuner, R. E. / Sullivan, C. / Rust, R. D. / Witty, M. et al. | 1996
- 147
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Fault and Yield Modeling of MCMs for Automotive ApplicationsWilliamson, S. T. / Singh, A. D. / Nelson, V. P. et al. | 1996
- 147
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Fault and Yield Modelling of MCMs for Automotive ApplicationsWilliamson, S. T. / Singh, A. D. / Nelson, V. P. et al. | 1996
- 155
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Thermo-Mechanical Design of Flip Chips for Harsh EnvironmentsMichaelides, S. / Sitaraman, S. et al. | 1996
- 155
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Thermo-Mechnical Design of Flip Chips for Harsh EnvironmentsMichaelides, S. / Sitaraman, S. et al. | 1996
- 161
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Significance of Design Parameters on the Thermal Fatique Life of Plastic Ball Grid ArraysSyed, A. R. et al. | 1996
- 167
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Lid Deflection for MCMs in Airborne ApplicationHuey, K. / Hodges, C. R. / Benson, D. / Nguyen, S. et al. | 1996
- 173
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Environmentally Protected Chip On Board for Military and Aerospace ApplicationsPlite, G. J. et al. | 1996
- 179
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Pushing the State-of-the-Art in MCM-L Design: Ultra Dense, Low-Cost "Smart Gasket" ApplicationsLadd, S. et al. | 1996
- 183
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Clay Field Configurable Multi-Chip Module (FCMCM)Nguyen, L. / Garverick, T. / Field, C. et al. | 1996
- 187
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Summary of Results from the Known Good Devices ProgramMango, S. / Palmer, N. et al. | 1996
- 193
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Reliability Modeling of MCMs - RELTECH Lessons LearnedNewell, J. M. / Larson, T. W. / Gersch, G. R. / Stoklosa, M. et al. | 1996
- 199
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System Level Functional Test Generation Methodology for Multichip ModulesWenzel, J. / Foster, S. / Hui, C. S. / Green, M. et al. | 1996
- 205
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MCM Test Vectors from Logic SimulationFlint, A. et al. | 1996
- 210
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Lessons Learned from Two Complex MCM DesignsCampinell, B. / Mango, S. / Scire, J. et al. | 1996
- 216
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A Signal Noise Comparison of the Interconnected Mesh Power System (IMPS) with a Standard Four-Layer MCM TopologyGlover, M. D. / Parkerson, J. P. / Schaper, L. W. et al. | 1996
- 220
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Integrated SystemsBartelink, D. J. et al. | 1996
- 226
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MCM Market: New Applications in a Mature Industry?Vardaman, E. J. / Crowley, R. T. et al. | 1996
- 230
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MCM Design Methodology for Portable Wireless Communication Systems DesignGoyal, R. / Tripathi, V. et al. | 1996
- 234
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Slimcase - An Ultra Thin Chip Size Integrated Circuit PackageBadihi, A. / Schlomovich, N. / De-La-Vega, M. / Karligano, N. et al. | 1996
- 239
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A Comparative Analysis of High Density PWB TechnologiesAday, J. G. / Tessier, T. G. / Crews, H. / Rasul, J. et al. | 1996
- 245
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A Silicon-on-Silicon MCM Base-Band Controller for a Spread-Spectrum RadioSimmons, W. D. / Johnson, M. G. / Han, B. J. / Frye, R. C. et al. | 1996
- 245
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A Silicon-on-Silicon MCM Base-Band Controller for a Spread-Sprectrum RadioSimmons, W. D. / Johnson, M. G. / Han, B. J. / Frye, R. C. et al. | 1996
- 250
-
Novel Low-Cost Process Technologies for Application and Curing of Polyimide FilmsBagen, S. / Newquist, C. / Gibson, G. / Melgaard, H. et al. | 1996
- 257
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Chip Scale Packaging with High Reliability for MCM ApplicationsLoboda, M. / Camilletti, R. C. / Goodman, L. A. / White, G. L. et al. | 1996
- 263
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High Density Thin Film Flexible InterconnectorPeters, M. G. / Chou, W. / Lee, M. / Mansingh, V. et al. | 1996
- 269
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Low Cost Copper Plating MCM-D TechnologyFinardi, C. A. / Almeida, A. M. / Barnett, M. / Flacker, A. et al. | 1996
- 275
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Wafer Level Membrane Probe Testing of Area Array Die for Manufacturing High Performance MCMsBlossfield, K. / Brotman, A. / Gravrok, R. / VanGoor, K. et al. | 1996
- 281
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SRMA Known Good Die Test ExperienceMoberg, P. et al. | 1996
- 281
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SRAM Known Good Die Test ExperienceMoberg, P. et al. | 1996
- 287
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A Pragmatic Look at Wafer Level Burn-In: The Wafer-Level Known Good Die ConsortiumFlynn, W. G. / Gilg, L. et al. | 1996
- 293
-
Known Good Die Program Implementation Case Study: Intel SmartDie[TM] ProductsAvalos, J. / Agahdel, F. et al. | 1996
- 299
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Extension of the Chip-Flex Technology to Known Good DieBurdick, W. E. / Fillion, R. et al. | 1996
- 299
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Extension of the Chip-on-Flex Technology to Known Good DieBurdick, W. E. / Fillion, R. et al. | 1996
- 305
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Using Tape and Reel for High Volume Packaging of Bare DieBird, G. et al. | 1996
- 310
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Using Topological Die Mapping with Electrical Fault Detection to Improve Yield in Known Good Die MCMsArnold, R. / Prevedel, D. et al. | 1996
- 310
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Using Topological Die Mapping with Electrical Fault Detection to Improve Process Yield in Known Good Die MCMsArnold, R. / Prevedel, D. et al. | 1996
- 317
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Thermo-Mechanical Analysis and Fatique Life Prediction of MCM-D InterconnectsLarson, T. W. / Newell, J. M. / Cornford, S. L. et al. | 1996
- 323
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Refining MCM Thermal Simulation Models with Test VehiclesBennett, D. / DeMuth, B. T. / Pines, B. E. et al. | 1996
- 329
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Modeling Interconnect Coupling Between Analog, Digital and RF Layout Components for MCM DesignsTripathi, V. / Seo, Y. / Tripathi, A. / Lutz, R. D. et al. | 1996
- 333
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Performance Comparison of Discrete and Buried CapacitorsSen, B. K. / Liou, J.-Y. / Adachi, H. / Wheeler, R. et al. | 1996
- 339
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MCM-D Manufacturing for the 21st Century: The Facility, The Product, The CostDieffenbach, J. R. / Adams, B. B. et al. | 1996
- 345
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Low-Cost Flip Chip ConsortiumNguyen, L. et al. | 1996
- 351
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Demonstration of a Chip Scale, Chip-on-Flex TechnologyFillion, R. A. / Wojnarowski, R. / Saia, R. / Kuk, D. et al. | 1996
- 352
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Design Trade-Offs of MCM-C versus. Ball Grid Array on Printed Wiring BoardHorowitz, S. / Amey, D. / Page, J. / Ladd, S. et al. | 1996
- 357
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Wire Button Contact Retainer Board for 3-D Interconnected MCM'sAckerman, R. E. / Schaefer, D. A. et al. | 1996
- 362
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Reverse Beam-Lead Interconnections for Ultra High-Speed Multichip ApplicationsNohr, W.-D. / Hanke, G. et al. | 1996
- 369
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A Fine-Pitch Leadless Chip Assembly Technology with the Built-Up PCBTanaka, K. / Bonkohara, M. / Dohya, A. / Shimada, T. et al. | 1996
- 375
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Jedi (J-90) System Upgrade: A Case Study of the Memory Bar ModuleGlass, C. / Nelson, D. F. / Rao, V. B. et al. | 1996
- 380
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New Olefinic Interlevel Dielectric Materials for Multi-Chip ModulesKohl, P. / Bidstrup-Allen, S. A. / Grove, N. R. / Schick, R. A. et al. | 1996
- 385
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A Low Cost Near-Hermetic Multichip Module Based on Liquid Crystal Polymer DielectricsNoll, T. E. / Jayaraj, K. / Farrell, B. / Larmouth, R. S. et al. | 1996
- 391
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On the Effective Intergration of Resistors and Capacitors into a MCM-Si DesignLernout, J. / Van Calster, A. / Schols, G. et al. | 1996
- 392
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CLAy Field Configurable Multichip ModuleNguyen, L. / Garverick, T. / Field, C. et al. | 1996
- 397
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Ultrasonic Bonding Tools for Fine Pitch, High Reliability InterconnectDemmin, J. C. et al. | 1996
- 398
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The Transformation of Multichip Module Logic Simulation Results into Test Vectors Suitable for Application on Automatic Test EquipmentFlint, A. et al. | 1996
- 403
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A Novel Aluminum on Quartz Mask for Excimer Laser Projection AblationPatel, R. S. / Speidell, J. / Cordes, S. et al. | 1996
- 409
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Stress-Free Thermoplastic Adhesives for High Reliability Microelectronics ApplicationsMonti, C. T. / Chung, K. et al. | 1996
- 462
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A Fine Pitch, Lead-Less Chip Assembly Technology on the Built-Up PCBTanaka, K. / Bonkohara, M. / Dohya, A. / Shimada, T. et al. | 1996
- 475
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High Frequency Performance Comparison of MCM-C MaterialsMuller, J. / Thust, H. / Schwanke, D. et al. | 1996
- 483
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Passive Components in Electronic Applications: Requirements and Prospects for IntegrationFrye, R. C. et al. | 1996
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A New Low Cost - HIgh Performance MCM Substrate TechnologyNeftin, S. / Mirsky, U. et al. | 1996