Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applications [3874-52] (Englisch)
- Neue Suche nach: Gaiseanu, F.
- Neue Suche nach: Esteve, J.
- Neue Suche nach: Cane, C.
- Neue Suche nach: Perez-Rodriguez, A.
- Neue Suche nach: SPIE
- Neue Suche nach: Gaiseanu, F.
- Neue Suche nach: Esteve, J.
- Neue Suche nach: Cane, C.
- Neue Suche nach: Perez-Rodriguez, A.
- Neue Suche nach: Smith, J. H.
- Neue Suche nach: Karam, J.-M.
- Neue Suche nach: SPIE
In:
Micromachining and microfabrication process technology
3874
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412-421
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1999
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applications [3874-52]
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Beteiligte:Gaiseanu, F. ( Autor:in ) / Esteve, J. ( Autor:in ) / Cane, C. ( Autor:in ) / Perez-Rodriguez, A. ( Autor:in ) / Smith, J. H. / Karam, J.-M. / SPIE
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Kongress:Conference; 5th, Micromachining and microfabrication process technology ; 1999 ; Santa Clara; CA
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Erschienen in:Micromachining and microfabrication process technology , 3874 ; 412-421PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING , 3874 ; 412-421
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Verlag:
- Neue Suche nach: SPIE
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Erscheinungsdatum:01.01.1999
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Format / Umfang:10 pages
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 2
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Electrokinetic microfluidic systemsBousse, Luc J. et al. | 1999
- 2
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Electrokinetic microfluidic systems [3874-100]Bousse, L. J. / SPIE et al. | 1999
- 9
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3D silicon photonic lattices: cornerstone of an emerging photonics revolutionFleming, James G. / Lin, Shawn-Yu et al. | 1999
- 9
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3D silicon photonic lattices: cornerstone of an emerging photonics revolution [3874-200]Fleming, J. G. / Lin, S.-Y. / SPIE et al. | 1999
- 20
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Breaking the barriers to commercialization of MEMS: a firm's search for competitive advantageWalsh, Steven T. / Linton, Jonathan D. et al. | 1999
- 20
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Breaking the barriers to commercialization of MEMS: a firm's search for competitive advantage [3874-01]Walsh, S. T. / Linton, J. D. / SPIE et al. | 1999
- 32
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LIGA: metals, plastics, and ceramics (Invited Paper) [3874-02]Hruby, J. M. / Griffiths, S. K. / Domeier, U. A. / Morales, A. M. / SPIE et al. | 1999
- 32
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LIGA: metals, plastics, and ceramicsHruby, Jill M. / Griffiths, Stewart K. / Domeier, Linda A. / Morales, Alfredo M. / Boehme, Dale R. / Bankert, Michelle A. / Bonivert, William D. / Hachman, John T. / Skala, Dawn M. / Ting, Aili et al. | 1999
- 44
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Fabrication of plastic microparts on wafer levelWeber, Lutz / Ehrfeld, Wolfgang / Begemann, Marc / Berg, Udo / Michel, Frank et al. | 1999
- 44
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Fabrication of plastic microparts on wafer level [3874-03]Weber, L. / Ehrfeld, W. / Begemann, M. / Berg, U. / SPIE et al. | 1999
- 53
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Innovations in molding technologies for microfabricationBenzler, Tobias / Piotter, Volker / Hanemann, Thomas / Mueller, K. / Norajitra, Prachai / Ruprecht, Robert / Hausselt, Juergen H. et al. | 1999
- 53
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Innovations in molding technologies for microfabrication [3874-04]Benzler, T. / Piotter, V. / Hanemann, T. / Mueller, K. / SPIE et al. | 1999
- 62
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Submicron patterning of aluminum films by laser ablation [3874-08]Doerr, D. W. / Alexander, D. R. / SPIE et al. | 1999
- 62
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Submicron patterning of aluminum films by laser ablationDoerr, David W. / Alexander, Dennis R. et al. | 1999
- 68
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Femtosecond-pulse laser ablation and surface microstructuring of aluminum alloy 2024Dou, Kai / Parkhill, Robert L. / Knobbe, Edward T. et al. | 1999
- 68
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Femtosecond-pulse laser ablation and surface microstructuring of aluminum alloy 2024 [3874-09]Dou, K. / Parkhill, R. L. / Knobbe, E. T. / SPIE et al. | 1999
- 76
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Pulsed-laser-deposited coatings for stiction and wear reduction in MEMS devices [3874-10]Pelt, J. S. / Ramsey, M. E. / Maga�a, R. / Poindexter, E. / SPIE et al. | 1999
- 76
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Pulsed-laser-deposited coatings for stiction and wear reduction in MEMS devicesPelt, Jamey S. / Ramsey, M. E. / Magana, R. / Poindexter, E. / de Boer, Maarten P. / LaVan, David A. / Dugger, Michael T. / Smith, James H. / Durbin, Steven M. et al. | 1999
- 85
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Excimer laser micromachining of structures using SU-8 [3874-11]Ghantasala, M. K. / Harvey, E. C. / Sood, D. K. / SPIE et al. | 1999
- 85
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Excimer laser micromachining of structures using SU-8Ghantasala, Muralihar K. / Harvey, Erol C. / Sood, Dinesh K. et al. | 1999
- 94
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Materials characterization for MEMS: a comparison of uniaxial and bending testsJohnson, George C. / Jones, Peter T. / Howe, Roger T. et al. | 1999
- 94
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Materials characterization for MEMS: a comparison of uniaxial and bending tests (Invited Paper) [3874-12]Johnson, G. C. / Jones, P. T. / Howe, R. T. / SPIE et al. | 1999
- 102
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Reproducibility data on SUMMIT [3874-13]Limary, S. / Stewart, H. / Irwin, L. W. / McBrayer, J. / SPIE et al. | 1999
- 102
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Reproducibility data on SUMMiTLimary, Siv / Stewart, Harold D. / Irwin, Lloyd W. / McBrayer, John / Sniegowski, Jeffry J. / Montague, Stephen / Smith, James H. / de Boer, Maarten P. / Jakubczak, Jerome F. et al. | 1999
- 113
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Processing variables for the reduction of stiction on MEMS devicesDenton, Heidi L. / Davison, Mike et al. | 1999
- 113
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Processing variables for the reduction of stiction on MEMS devices [3874-14]Denton, H. L. / Davison, M. / SPIE et al. | 1999
- 120
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Standard postprocessing technique for fabrication of large microsuspended structures in CMOSGhodsian, Bahram / Milanovic, Veljko / Villavicencio, Orlando et al. | 1999
- 120
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Standard postprocessing technique for fabrication of large microsuspended structures in CMOS [3874-15]Ghodsian, B. / Milanovic, V. / Villavicencio, O. / SPIE et al. | 1999
- 129
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Which etchant used and whether an etching mask exists: how they make differences on convex-corner undercutting configuration and compensation criteria [3874-16]Li, X. / Lin, R. / Miao, J. / Bao, M. / SPIE et al. | 1999
- 129
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Which etchant used and whether an etching mask exists: how they make differences on convex-corner undercutting configuration and compensation criteriaLi, Xinxin / Lin, Rongming / Miao, Jianmin / Bao, Minhang et al. | 1999
- 138
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Fabrication of counter electrodes for scanning atomic probeCampitelli, Andrew / Ziad, Hocine / Rogge, Frank / Vandervorst, Wilfried / Baert, Christiaan / Huang, Min / Cerezo, Alfred et al. | 1999
- 138
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Fabrication of counter electrodes for scanning atomic probe (Invited Paper) [3874-17]Campitelli, A. / Ziad, H. / Rogge, F. / Vandervorst, W. / SPIE et al. | 1999
- 150
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W-coating for MEMSMani, Sita S. / Fleming, James G. / Sniegowski, Jeffry J. et al. | 1999
- 150
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W-coating for MEMS [3874-18]Mani, S. S. / Fleming, J. G. / Sniegowski, J. J. / SPIE et al. | 1999
- 158
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Laser welding: providing alignment precision and accuracy to substrate-level packaging [3874-20]Brown, J. / Maier, N. / Lee, K. Y. / Ziegltrum, L. / SPIE et al. | 1999
- 158
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Laser welding: providing alignment precision and accuracy to substrate-level packagingBrown, Joe / Maier, Nikolaus / Lee, Kim Y. / Ziegltrum, Lorenz / St Leger, Jim et al. | 1999
- 165
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Ion beam sputter deposition of TiNi shape memory alloy thin films [3874-21]Davies, S. T. / Tsuchiya, K. / SPIE et al. | 1999
- 165
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Ion beam sputter deposition of TiNi shape memory alloy thin filmsDavies, Sam T. / Tsuchiya, Kazuyoshi et al. | 1999
- 174
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Integration issues for pressure sensorsGogoi, Bishnu P. / Monk, David J. / Maudie, Theresa / Miller, Todd F. / Torres, Jose et al. | 1999
- 174
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Integration issues for pressure sensors (Invited Paper) [3874-22]Gogoi, B. P. / Monk, D. J. / Maudie, T. / Miller, T. F. / SPIE et al. | 1999
- 188
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Novel fabrication and simple hybridization of exotic material MEMSRajic, Slobodan / Datskos, Panos G. / Datskou, Irene et al. | 1999
- 188
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Novel fabrication and simple hybridization of exotic material MEMS [3874-23]Rajic, S. / Datskos, P. G. / Datskou, I. / SPIE et al. | 1999
- 196
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Mechanical properties of boron-doped single-crystal silicon microstructures (Invited Paper) [3874-26]Putty, M. W. / Chang, S.-C. / SPIE et al. | 1999
- 196
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Mechanical properties of boron-doped single-crystal silicon microstructuresPutty, Michael W. / Chang, Shih-Chia et al. | 1999
- 205
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New sensor for real-time trench depth monitoring in micromachining applications [3874-27]Amary, P. / Benferhat, R. / Liddane, K. J. / Ostrovsky, A. / SPIE et al. | 1999
- 205
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New sensor for real-time trench depth monitoring in micromachining applicationsAmary, Pascal / Benferhat, Ramdane / Liddane, Kevin J. / Ostrovsky, Alain et al. | 1999
- 218
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Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturingYu, Keven / Feldbaum, Michael / Pandhumsoporn, Tam / Gadgil, Prashant et al. | 1999
- 218
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Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing [3874-28]Yu, K. / Feldbaum, M. / Pandhumsoporn, T. / Gadgil, P. / SPIE et al. | 1999
- 227
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High-speed laser chemical vapor deposition of amorphous carbon fibers, stacked conductive coils, and folded helical springs [3874-29]Maxwell, J. L. / Boman, M. / Williams, K. / Larsson, K. / SPIE et al. | 1999
- 227
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High-speed laser chemical vapor deposition of amorphous carbon fibers, stacked conductive coils, and folded helical springsMaxwell, James L. / Boman, Mats / Williams, Kirk / Larsson, Kajsa / Jaikumar, N. / Saiprasanna, G. et al. | 1999
- 236
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EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3D microstructuresCohen, Adam L. / Frodis, Uri / Tseng, Fan-Gang / Zhang, Gang / Mansfeld, Florian / Will, Peter M. et al. | 1999
- 236
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EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3D microstructures [3874-30]Cohen, A. L. / Frodis, U. / Tseng, F.-G. / Zhang, G. / SPIE et al. | 1999
- 248
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SCALPEL mask blank fabrication [3874-31]Saunders, T. E. / Blakey, M. I. / Caminos, C. / Bogard, G. R. / SPIE et al. | 1999
- 248
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SCALPEL mask blank fabricationSaunders, Thomas E. / Blakey, Myrtle I. / Caminos, Carlos / Bogart, Gregory R. / Farrow, Reginald C. / Knurek, Chester S. / Kornblit, Avi / Liddle, James A. / Novembre, Anthony E. / Peabody, Milton L. et al. | 1999
- 258
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Porous silicon process for encapsulated single-crystal surface-micromachined microstructures [3874-32]Seefeldt, J. D. / Gianchandani, Y. B. / Mattes, M. / Reimer, L. / SPIE et al. | 1999
- 258
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Porous silicon process for encapsulated single-crystal surface-micromachined microstructuresSeefeldt, James D. / Gianchandani, Yogesh B. / Mattes, Michael / Reimer, Larry et al. | 1999
- 269
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Various uses of ion chromatography in the manufacture of MEMSNewton, Beverly et al. | 1999
- 269
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Various uses of ion chromatography in the manufacture of MEMS [3874-33]Newton, B. / SPIE et al. | 1999
- 276
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Effects of metal impuritites on the etch rate selectivity of (110)/(111) in (110) Si anisotropic etchingHirata, Yoshiaki / Tsugai, Masahiro / Tanimoto, Koji / Usami, Teruo / Yamaguchi, Yasuo / Otani, Hiroshi / Nakamura, Kunihiro et al. | 1999
- 276
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Effects of metal impuritites on the etch rate selectivity of (110)/(111) in (110) Si anisotropic etching [3874-34]Hirata, Y. / Tsugai, M. / Tanimoto, K. / Usami, T. / SPIE et al. | 1999
- 284
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Fabrication and reliability testing of Ti/TiN heatersDe Moor, Piet / Witvrouw, Ann / Simons, Veerle / De Wolf, Ingrid et al. | 1999
- 284
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Fabrication and reliability testing of Ti/TiN heaters [3874-35]De Moor, P. / Witvrouw, A. / Simons, V. / De Wolf, I. / SPIE et al. | 1999
- 296
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Resolution enhancement techniques for submicron deep trench processes [3874-36]Tong, L. / Hsiang, J. / Lin, K. / Newman, G. / SPIE et al. | 1999
- 296
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Resolution enhancement techniques for submicron deep trench processesTong, Lijun / Hsiang, Joyce / Lin, Kuanchih / Newman, Gary et al. | 1999
- 305
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Economic fabrication of microscale features in thick resists using scanning projection lithography [3874-37]Kilgo, M. M. / Williams, C. N. / Constantinide, D. / SPIE et al. | 1999
- 305
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Economic fabrication of microscale features in thick resists using scanning projection lithographyKilgo, Marvin M. / Williams, Charles N. / Constantinide, Dan et al. | 1999
- 312
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Development behavior of irradiated foils and microstructuresMeyer, Pascal / El-Kholi, Aida / Mohr, Juergen / Cremers, Clifford / Bouamrane, Faycal / Megtert, Stephan et al. | 1999
- 312
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Development behavior of irradiated foils and microstructures [3874-38]Meyer, P. / El-Kholi, A. / Mohr, J. / Cremers, C. / SPIE et al. | 1999
- 321
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New fabrication methodology for fine-feature high-aspect-ratio structures made from high-Z materials [3874-39]Desai, U. D. / Orwig, L. E. / Clark, D. / Appleby, M. / SPIE et al. | 1999
- 321
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New fabrication methodology for fine-feature high-aspect-ratio structures made from high-Z materialsDesai, Upendra D. / Orwig, Larry E. / Clark, David / Appleby, Michael et al. | 1999
- 330
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Thick photoresist imaging using a three-wavelength exposure stepper [3874-40]Todd, B. / Flack, W. W. / White, S. / SPIE et al. | 1999
- 330
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Thick photoresist imaging using a three-wavelength exposure stepperTodd, Bradley / Flack, Warren W. / White, Sylvia et al. | 1999
- 345
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High-aspect-ratio two-dimensional silicon subwavelength gratings fabricated by fast atom beam etchingKanamori, Yoshiaki / Sasaki, Minoru / Hane, Kazuhiro et al. | 1999
- 345
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High-aspect-ratio two-dimensional silicon subwavelength gratings fabricated by fast atom beam etching [3874-41]Kanamori, Y. / Sasaki, M. / Hane, K. / SPIE et al. | 1999
- 356
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New electromagnetic micromotor with a large torqueLiang, Jingqiu / Yao, Jingshong et al. | 1999
- 356
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New electromagnetic micromotor with a large torque [3874-45]Liang, J. / Yao, J. / SPIE et al. | 1999
- 365
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Micropattern fabrication by a specially designed microtoolAoki, Isamu / Takahashi, Toshinori et al. | 1999
- 365
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Micropattern fabrication by a specially designed microtool [3874-47]Aoki, I. / Takahashi, T. / SPIE et al. | 1999
- 373
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Multidimensional calculation of coupled flow and electrodeposition in microscopic trenchesXia, Chunmei / Murthy, Jayathi Y. / Chyu, Minking K. / Cheng, Yao et al. | 1999
- 373
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Multidimensional calculation of coupled flow and electrodeposition in microscopic trenches [3874-48]Xia, C. / Murthy, J. Y. / Chyu, M. K. / Cheng, Y. / SPIE et al. | 1999
- 384
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New design methodologies in < 111 >-oriented silicon wafers [3874-49]Oosterbroek, R. E. / Berenschot, J. W. / Nijdam, A. J. / Pandraud, G. / SPIE et al. | 1999
- 384
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New design methodologies in (111)-oriented silicon wafersOosterbroek, R. E. / Berenschot, J. W. / Nijdam, A. J. / Pandraud, Gregory / Elwenspoek, Miko C. / van den Berg, Albert et al. | 1999
- 395
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Evidence of dislocations for the control of roughness of highly thermal boron-doped diffused silicon layers [3874-50]Manea, E. / Divan, R. / Cernica, I. / SPIE et al. | 1999
- 395
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Evidence of dislocations for the control of roughness of highly thermal boron-doped diffused silicon layersManea, Elena / Divan, Ralu / Cernica, Ileana et al. | 1999
- 403
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Etch-stop in germanium induced by ion implantation for bulk micromachining applications in the IR domainDivan, Ralu / Cernica, Ileana / Manea, Elena et al. | 1999
- 403
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Etch-stop in germanium induced by ion implantation for bulk micromachining applications in the IR domain [3874-51]Divan, R. / Cernica, I. / Manea, E. / SPIE et al. | 1999
- 412
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Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applications [3874-52]Gaiseanu, F. / Esteve, J. / Cane, C. / Perez-Rodriguez, A. / SPIE et al. | 1999
- 412
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Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applicationsGaiseanu, Florin / Esteve, Jaume / Cane, Carles / Perez-Rodriguez, Alejandro / Morante, Juan R. / Serre, Christoph et al. | 1999
- 422
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Fabrication of pop-up detector arrays on Si wafersLi, Mary J. / Allen, Christine A. / Gordon, Scott A. / Kuhn, Jonathan L. / Mott, David B. / Stahle, Caroline K. / Wang, Liqin L. et al. | 1999
- 422
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Fabrication of pop-up detector arrays on Si wafers [3874-54]Li, M. J. / Allen, C. A. / Gordon, S. A. / Kuhn, J. L. / SPIE et al. | 1999