Development of contact and wiring systems for high temperature sensor applications (Englisch)
- Neue Suche nach: Gessner, T.
- Neue Suche nach: Kaufmann, C.
- Neue Suche nach: Hoffmann, R.
- Neue Suche nach: Gottfried, K.
- Neue Suche nach: Wiemer, M.
- Neue Suche nach: Deutsche Verband fur Materialforschung und prufung (DVM)
- Neue Suche nach: Fraunhofer Institute for Reliability and Microintegration (IZM)
- Neue Suche nach: Gessner, T.
- Neue Suche nach: Kaufmann, C.
- Neue Suche nach: Hoffmann, R.
- Neue Suche nach: Gottfried, K.
- Neue Suche nach: Wiemer, M.
- Neue Suche nach: Michel, B.
- Neue Suche nach: Deutsche Verband fur Materialforschung und prufung (DVM)
- Neue Suche nach: Fraunhofer Institute for Reliability and Microintegration (IZM)
In:
Micro materials
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196-197
;
2000
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Development of contact and wiring systems for high temperature sensor applications
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Beteiligte:Gessner, T. ( Autor:in ) / Kaufmann, C. ( Autor:in ) / Hoffmann, R. ( Autor:in ) / Gottfried, K. ( Autor:in ) / Wiemer, M. ( Autor:in ) / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM)
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Kongress:International conference; 3rd, Micro materials ; 2000 ; Berlin
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Erschienen in:Micro materials ; 196-197MICRO MATERIALS -PROCEEDINGS- ; 196-197
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Verlag:
- Neue Suche nach: DDP
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Erscheinungsdatum:01.01.2000
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Format / Umfang:2 pages
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Materials science and engineering - A major topic in the future of microelectronic packagingReichl, H. / Michel, B. / Schubert, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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The future of microelectronics and photonics, and the role of mechanical, materials and reliability engineeringSuhir, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Production of high precision microparts for machines using metallic glassInoue, A. / Kawamura, Y. / Zhang, T. / Saotome, Y. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Internal stresses and lifetime evaluation of PECVD isolating layersDommann, A. / Herres, N. / Krink, M. / Galiano, J. J. / Stampfli, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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NDE for materials characterization in aeronautic and space applicationsBaaklini, G. Y. / Kautz, H. E. / Gyekenyesi, A. L. / Abdul-Aziz, A. / Martin, R. E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Package reliability studies by experimental and numerical analysisSchubert, A. / Dudek, R. / Michel, B. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Lead-free soldering - Are you ready for this global trend?Lee, N.-C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 127
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Micro- and nanostructures - preparation and applicationsKassing, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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New developments in nanomaterialsSiegel, R. W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Review of industrial applications of CVD diamondSussmann, R. S. / Brandon, J. R. / Pickles, C. S. J. / Whitehead, A. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS)Gatzen, H. H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Materials problems in high temperature electronicsSharp, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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BGA, flip-chip and CSP solder joint reliabilityClech, J.-P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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FEA modeling of FCOB assembly solder joint reliabilityPang, H. L. J. / Chong, Y. R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Properties, characterisation and challenges of semiconducting polymer applicationsKohler, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Non-equilibrium processing of thin Si films via pulsed laser irradiationIm, J. S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Study of thermal deformation in underfilled flip-chip packages using high-resolutin moire interferometryMiller, M.R. / Mohammed, I. / Dai, X. / Ho, P.S. et al. | 2000
- 174
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Study of thermal deformation in underfilled flip-chip packages using high-resolution Moire interferometryMiller, M. R. / Mohammed, I. / Dai, X. / Ho, P. S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 180
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Application of fracture mechanics for next-generation packaging structuresSitaraman, S. K. / Xie, W. / Sundararaman, V. / Harries, R. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Future developments in electrically conductive adhesives technologyMorris, J. E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Micromaterials: Materials science in small dimensionsArzt, E. / Kraft, O. / Dehm, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Highly parallel mass fabrication and assembly of microdevicesEhrfeld, W. / Begemann, M. / Berg, U. / Lohf, F. / Michel, F. / Nienhaus, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 196
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Development of contact and wiring systems for high temperature sensor applicationsGessner, T. / Kaufmann, C. / Hoffmann, R. / Gottfried, K. / Wiemer, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Process and mechanical behavior of micro and nano materialsLu, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Micromechanical actuators based on shape memory effectButtgenbach, S. / Butefisch, S. / Leester-Schadel, M. / Wogersien, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Thermo-mechanical reliability of microcomponentsDudek, R. / Schubert, A. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Thin-film metal cantilever springs by stress controlSmith, D. L. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packagesAuersperg, J. / Kieselstein, E. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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New MoCu and WCu MIM-materials designed for heat dissipation purposes in RF packagesMullers, J. / Knuwer, M. / Wichmann, K.-H. / Hager, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Manufacturing a CSP at wafer levelSimon, J. / Wolf, J. / Kallmayer, C. / Topper, M. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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3D wafer level packagingSavastiouk, S. / Siniaguine, O. / Korczynski, E. / Tilenschi, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Wafer level flip chip packagingTong, Q. K. / Ma, B. / Savoca, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Low cost bumping on waferlevel for 300 mm waferOppert, T. / Teutsch, T. / Zakel, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Microstructure characterization and mechanical properties of Mo-Cu composite for electronic packaging applicationsKocdemir, B. / Fecht, H.-J. / Wichmann, K.-H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Study of thermal deformation in BGA assemblies using FEM methodZhang, L. F. / Wang, W. N. / Wu, Y. P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Use of alternative materials for packaging of sensors and MCMsRentsch, A. / Wilde, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Powder injection moulded aluminium nitride for packaging of mm-wave circuitsFandel, M. / Hager, W. / Schafer, W. / Wichmann, K.-H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Mechanical characterisation and simulation of packaging polymer curingErnst, L. J. / van t Hof, C. / Yang, D. G. / Kiasat, M. S. / Zhang, G. Q. / Bressers, H. J. L. / Caers, J. F. J. / den Boer, A. W. J. / Janssen, J. / Deutsche Verband fur Materialforschung und prufung (DVM) et al. | 2000
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Materials for molding processes in microsystems technologyPiotter, V. / Gietzelt, T. / Hanemann, T. / Ruprecht, R. / Hausselt, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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BGA packaging technology for rapid prototyping supported by advanced analyticsBecker, K.-F. / Ehrlich, R. / Ansorge, F. / Aschenbrenner, R. / Krause, F. / Kampfe, B. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Investigation of interface cracking in electronic packagesKieselstein, E. / Seiler, B. / Winkler, T. / Dudek, R. / Auersperg, J. / Schubert, A. / Schneider, W. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Flex, rigid, and ceramic CSP - lifetime behaviorAlbrecht, H.-J. / Jendrny, J. / Muller, W. H. / Schwarz, B. / Teichmann, H. / Tilgner, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Reliability risk assessment of organic flip chip pin grid array package under thermal and mechanical loading conditionsGoh, T. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Modeling of the deformation behavior of a flip chip underfill for finite element analysesFeustel, F. / Meusel, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Modelling of material properties for advanced packagingBitz, C. / Becker, K. / Wilde, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Modeling of material properties for advanced packagingBitz, C. / Becker, K. / Wilde, J. et al. | 2000
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microDAC strain measurement for FEA supportVogel, D. / Gollhardt, A. / Schubert, A. / Kuhnert, R. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Nanostructured materials for microtechniquesSchmidt, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Nano- and microscale materials in microreactorsHessel, V. / Ehrfeld, W. / Lowe, H. / Schiewe, J. / Donnet, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Sol-gel pastes for conductive fine line printingKalleder, A. / Kreutzer, R. / Mennig, M. / Schmidt, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Preparation of micro patterns with profile heights up to 100 mum by sol gel technologyMennig, M. / Gier, A. / Schmidt, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Nanoparticles for sensors: Technology, basic understanding and applicationsWeimar, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Nanocrystalline hydride electrode materialsJurczyk, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Local scanning probe methodsGuntherodt, H.-J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Scanning probe microscopy in semiconductor failure analysisEbersberger, B. / Olbrich, A. / Boit, C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Sensors for scanning probe microscopy (SPM)Oesterschulze, E. / Kassing, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Voltage contrast measurements with an electric force microscope based test systemBehnke, U. / Mertin, W. / Kubalek, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Quantitative contact spectroscopy by atomic-force acoustic microscopyAmelio, S. / Rabe, U. / Kester, E. / Hirsekorn, S. / Arnold, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Thermomicroscopy of materials and devices at nanometer dimensionsFiege, G. B. M. / Becker, G. / Engemann, J. / Boit, C. / Balk, L. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Thermal management with novel materialsJohnston, C. / Young, R. / Crossley, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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High temperature fiber optic thermal deviceHerringer, J. H. / Djeu, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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A review of fully-depleted SOI CMOS technology for microsystemsDemeus, L. / Delatte, P. / Dessard, V. / Adriaensen, S. / Renaux, C. / Flandre, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Modelling of thermal aspects of power electronic assembliesPoech, M. H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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The fictitious indendation depth-load trajectory as a new approach for determining thin film mechanical properties without substrate effectsHuber, N. / Tsakmakis, C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Silicon three-axial tactile sensor for micromaterial characterisationButefisch, S. / Buttgenbach, S. / Kleine-Besten, T. / Loheide, S. / Brand, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Investigations and development of tactile ferropiezoelectric array sensorsTodorova, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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The influence of surface oxide films on hardness and thermosonic wire bonding of Al bondpadsPetzold, M. / Berthold, L. / Katzer, D. / Knoll, H. / Memhard, D. / Meier, P. / Lang, K.-D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Patterning of SOI-materials for fabrication of resonator systems using waferbonding approachesWiemer, M. / Hiller, K. / Gessner, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Laser beam micro joining for electronics industryOlowinsky, A. / Legewie, F. / Kramer, T. / Bosse, L. / Gillner, A. / Poprawe, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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An assessment of mechanical properties of heterogeneous weld joint with thin layerRanatowski, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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Magnitude and location of strain in SMT solder jointsGrossmann, G. / Affolter, C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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A constutive material model of eutectic SnPb flip chip solder for ANSYS®Wiese, S. / Feustel, F. / Rzepka, S. / Meusel, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
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A constitutive material model of eutectic SnPb flip chip solder for ANSYSWiese, S. / Feustel, F. / Rzepka, S. / Meusel, E. et al. | 2000
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- 459
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Development and application of ultrafinepitch solder paste for advanced microelectronic packagingEinenkel, A. / Paproth, A. / Schneider, W. / Berek, H. / Pachschwoll, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 464
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Non self-similar crack extension: to >>kink<< or not to >>kink<Lo, K. W. / Zhong, K. / Tamilselvan, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 471
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Modeling and testing of strength and fracture of microelectronic materials and componentsGoldstein, R. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 472
-
Fracture electronics and thermo-mechanical compatibility (TMC) of microcomponents in high tech systemsMichel, B. / Winkler, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 476
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Stress-induced lateral deflections of microstructuresKuchler, M. / Knofler, R. / Steiniger, C. / Raschke, T. / Gessner, T. / Dudek, R. / Doring, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 480
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On a deformation of the polycrystalline structureBerka, L. / Horecka, L. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 488
-
Finite element techniques for flaw analyses in piezoelectric micro-componentsKuna, M. / Scherzer, M. / Ricoeur, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 496
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Fatigue testing of thin metal films on substratesKraft, O. / Schwaiger, R. / Wellner, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 497
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A resonance method for the determination of Young's modulus and residual stress of thin microstructuresMehner, J. / Kehr, K. / Schroter, B. / Kaufmann, C. / Dotzel, W. / Gessner, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 501
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R-curve behavior of BaTiO~3- and PZT-ceramics under the influence of an electric fieldNiefanger, R. / Kolleck, A. / Schneider, G. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 506
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Mechanical and thermomechanical properties of Al-SiC-MMCLefranc, G. / Degischer, H. P. / Mitic, G. / Licht, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 510
-
Lifetime investigations of directly wafer-bonded samples under static and cyclic loadingBagdahn, J. / Petzold, M. / Sommer, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 514
-
Database for materials in micro systemsVillain, J. / Muller, T. / Michel, B. / Totzauer, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 518
-
Determination of mechanical and tribological properties in the nm-range with the Hysitron TriboScopeHangen, U. D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 522
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A study of heel crack failures in wire bonds under mechanical cyclingSeliger, N. / Ramminger, S. / Franke, T. / Wachutka, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 526
-
Fatigue life and crack growth properties of micro-sized Ni-P amorphous alloy specimensTakashima, K. / Maekawa, S. / Ichikawa, Y. / Shimojo, M. / Higo, Y. / Sugiura, S. / Swain, M. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 530
-
Relation between accelerated ageing tests and actual operation: finite element simulation evaluationThebaud, J.-M. / Woirgard, E. / Zardini, C. / Sommer, K.-H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 536
-
A study on rupture behavior of SMT solder joint with mechanical heterogeneityWang, L. / Fang, H. / Qian, Y. / Wang, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 537
-
Fracture mechanics characterisation of epoxy resins with Mini-Compact Tension (CT)-specimensWalter, H. / Bierogel, C. / Grellmann, W. / Fedtke, M. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 542
-
Cohesive surface modeling of fractureNeedleman, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 548
-
Damage modelling via bi-modal surface energiesDel Piero, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 549
-
Environmentally assistant damage of metals with coveringBalueva, A. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 550
-
Multi-level modelling of heterogeneous micro materialsKouznetsova, V. / Brekelmans, W. A. M. / Geers, M. G. D. / Baaijens, F. P. T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 554
-
FE-Simulation of anisotropic damage development in creep processQi, W. / Brocks, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 558
-
The >>size effect<< on the fatigue- and fracture properties of thin metallic foils and wiresHadrboletz, A. / Weiss, B. / Khatibi, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 560
-
Effect of intermetallic compound layer development on mechanical strength of 63Sn-37Pb solder jointsKishimoto, K. / Masuda, K. / Omiya, M. / Shibuya, T. / Amagai, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 566
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Submicrometer notch machining by FIB and fracture and fatigue behavior in silicon microelementsMinoshima, K. / Terada, T. / Komai, K. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 570
-
Fracture strength of GaAs wafersSchaper, M. / Jurisch, M. / Klauss, H.-J. / Balke, H. / Bergner, F. / Hammer, R. / Winkler, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 574
-
Fracture toughness measurements of micro-sized Ni-P amorphous alloy specimensOgura, A. / Ichikawa, Y. / Shimojo, M. / Takashima, K. / Higo, Y. / Swain, M. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 578
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Measurement of strain fields in the micron rangeOnraet, S. / Luff, D. / Geers, M. / Vellinga, W. P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 582
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Numerical analysis of an electronic structure bearing deep cracksEberle, A. / Sievert, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 588
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Grating and Moire methods for micro-measurementAsundi, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 589
-
Recovery of fringe pattern in holographic interferometryTatasciore, P. / Meyer-Piening, H.-R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 595
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New investigations in materials research by Confocal Laser Scanning MicroscopyKunath-Fandrei, G. / Faust, W. / Ullmann, P. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 599
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A method of transfer relations - new perspectives in physical grounds of near-field opticsBarabanenkov, Y. N. / Barabanenkov, M. Y. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 604
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Monitoring of surface homogeneity of optical parameters of thin filmsUrbanek, M. / Spousta, J. / Jiruse, J. / Zlamal, J. / Chmelik, R. / Dittrichova, L. / Nebojsa, A. / Sikola, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 610
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UNIDAC - cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MSTDost, M. / Kieselstein, E. / Erb, R. / Seiler, B. / Vogel, J. / Bombach, C. / Grosser, V. / Vogel, D. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) et al. | 2000
- 615
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3D-microscope-ESPI: potential for displacement analysis of micromechanic componentsYang, L. / Schubach, H. / Wegner, R. / Ettemeyer, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 618
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Optical crack tracing - A new method for the automatic determination of fracture toughness for crack initiation and propagationUhlig, C. / Kahle, O. / Wieneke, B. / Bauer, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 630
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The measurement of thermal deformation in BGA assemblies using real-time holographic interferometryWang, W. N. / Wu, Y. P. / Zhang, L. F. / Ai, L. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 634
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Evaluation and testing of microsystems using optical methodsGrosser, V. / Bombach, C. / Gentzsch, S. / Hillmann, V. / Sommer, J.-P. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 640
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Conducting Atomic Force Microscopy - A new tool for the quantitative electrical characterization of thin oxides at a nanometer scale lengthOlbrich, A. / Ebersberger, B. / Boit, C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 644
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Analysis of the injection level and temperature dependence of carrier lifetime by microwave photoconductivity decayFrohnmeyer, A. / Niedernostheide, F.-J. / Schulze, H.-J. / Tutto, P. / Pavelka, T. / Wachutka, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 648
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Contactless, spatially resolved current detection at megahertz bandwidth via the implementation of the heterodyne mixing techniqueBae, S. / Schiemann, K. / Mertin, W. / Kubalek, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 652
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Nondestructive evaluation of fracture characteristics by quantification of Barkhausen noise method and microstructure analysisKim, D.-W. / Kwon, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 656
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Characterization of transition metal oxides by ultrasonic microscopyMaurer, D. / Leue, A. / Heichele, R. / Muller, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 660
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Microstructural characterization of SiC/Al interface after quenching X-ray diffraction, TEM and AFMConiglione, S. / Patuelli, C. / Tognato, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 666
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Tensile testing of MEMS materialsSharpe, W. N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 667
-
Nanotribological characterization of brittle surfacesEnders, S. / Grau, P. / Berg, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 671
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Determination of mechanical parameters of solder materials using the miniature measuring method >>Small Punch Test<<Nguyen, V. S. / Herrmann, K. P. / Muller, W. H. / Albrecht, H.-J. / Foulds, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 675
-
Reliability investigations of vibration excited circuit boardsRummler, N. / Schnitzer, R. / Doring, R. / Kaulfersch, E. / Faust, W. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 679
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Breakdown of elasticity in Copper and Aluminium interconnectsSchreiber, J. / Melov, V. G. / Herms, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 683
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Nano-writing with atomic force microscopyCrossley, A. / Mapledoram, L. / Sofield, C. / Johnston, C. / Myhra, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 689
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mu-XRF - A new powerful analytic tool for microstructuresHaschke, M. / Kampfe, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 690
-
Modular loading and measuring system for material characterisation of microcomponentsVogel, J. / Dost, M. / Seebacher, S. / Fassler, R. / Kopp, N. / Doring, R. / Sommer, J.-P. / Osten, W. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) et al. | 2000
- 696
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Residual stress determination in microsystems using X-ray diffractionKampfe, B. / Kampfe, A. / Auerswald, E. / Kassem, M. E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 700
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Nanofocus CT - A new dimension in radioscopic inspection on micro materialsHanke, R. / Baumbach, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 704
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Investigation of microshaped samples of metallic materials and carbon fibersSchneider, H. / Huber, K. / Aktaa, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 705
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Electromechanical transducer and stochastic damagesWill, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 710
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Influence of specimen dimensions on creep behavior of solder materialVillain, J. / Brueller, O. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 714
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State-of-the-art micro materials models in MINIMOS-NTPalankovski, P. / Selberherr, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 718
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An analysis of crack nucleation in fibre-reinforced concreteBayard, O. / Ple, O. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 722
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Some remarks about indentation tests with spherical indentersBramer, K. / Chudoba, T. / Hermann, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 728
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Thermal-fatigue kinetics in SMC solder joints by SEM/EDS fractographyGlickman, E. / Davidson, J. / Ichilov, O. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 734
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Gradient-enhanced macroscopic constitutive principles for the mechanical description of microstructuresGeers, M. G. D. / Kouznetsova, V. / Brekelmans, W. A. M. / Peerlings, R. H. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 738
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Stability of flat boundary under surface diffusionMorozov, N. / Pitkin, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 739
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The aluminium film plastic deformation analysis during local anodic oxidationVrublevsky, I. / Parkoun, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 740
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Characterization and aging of optical fiber Bragg gratingsNellen, P. M. / Sennhauser, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 744
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Properties of nanocrystalline diamond films deposited in argon microwave plasmaPageler, A. / Busmann, H.-G. / Boseck, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 748
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Development of lubricious DLC coatings for microdevicesGarcia, A. / Viviente, J. L. / Brizuela, M. / Alonso, F. / Braceras, I. / Onate, J. I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 752
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Mechanical properties of electroplated NickelFritz, T. / Leuerer, T. / Krueger, C. / Mokwa, W. / Schnakenberg, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 756
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Nanocrystalline wear resistant Ni-W deposited by an environmentally cleaner electroplating processAuerswald, J. / Croopnick, G. A. / Wanderka, N. / Fecht, H.-J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 760
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Analytical simulation tools to determine the behavior of bulk and layered substratesHolbery, J. D. / Consiglio, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 762
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Giant magnetoresistance: basics and applicationsShull, R. D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 763
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Qualification of different standard photo resins and new laser sources for micro-stereolithographyTonshoff, H. K. / von Alvensleben, F. / Korber, K. / Beil, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 767
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Design optimization for electroplated micro-springsLeuerer, T. / Krueger, C. / Fritz, T. / Mokwa, W. / Schnakenberg, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 771
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Electroless metallization of non-metallic materials and ductility of Ni-P coatingKhoperia, T. N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 788
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Optical properties and film stress behavior of Silver reflection coatings for micro mirrorsKrujatz, J. / Werner, T. / Kaufmann, C. / Gessner, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 792
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KOH etch rate and optical properties of ICPECVD silicon nitrideWolf, R. / Gruska, B. / Wandel, K. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 796
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Reliability of soldered Nickel bumps for high temperature applicationAnhock, S. / Ostmann, A. / Aschenbrenner, R. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 802
-
Ion assisted growth of ultrathin diffusion barriers on low dielectric constant polymersKiene, M. / Abramowitz, P. / Ho, P. S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 806
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Large area surface-relief microstructures for optical applicationsBoerner, V. / Blasi, B. / Gombert, A. / Heinzel, A. / Kubler, V. / Niggemann, M. / Popp, P. / Wittwer, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 810
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Thermographical characterisation of the piezoresistive cantilever for scanning probe microscopySzeloch, R. F. / Gotszalk, T. P. / Rangelow, I. W. / Grabiec, P. / Radojewski, J. / Janus, P. / Orawski, W. / Pedrak, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 816
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High performance thermosets for microelectronicsBauer, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 818
-
Fabrication and characterization of plastic (PMMA) for inexpensive MEMS componentsMietke, S. / Ilgner, J. / Kohler, T. / Wehnert, C. / Becker, H. / Gluche, P. / Fecht, H.-J. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 822
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Condensation and nucleation of noble metals on low-k polymersZaporojtchenko, V. / Thran, A. / Behnke, K. / Kiene, M. / Strunskus, T. / Faupel, F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 824
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Thermo-mechanical testing of polymeric materials under rates of deformation between 10^-^2 m/s - 10^+^2 m/sJedicke, O. / Eisenreich, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 828
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Lyotropic liquid crystalline polymers-a new thermotropic materialSeeboth, A. / Schneider, J. / Fischer, T. / Holzbauer, H.-R. / Kriwanek, J. / Lotzsch, D. / Patzak, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 829
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Measurement of material properties by a modified microDAC approachVogel, D. / Luczak, F. / Wittler, O. / Gollhardt, A. / Walter, H. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 834
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CLP-lamination: A new lamination technique to join ceramic green tapes in multilayer processingRoosen, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 838
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Photostructurable glasses with integrated wave guidesHecht-Mijic, S. / Christ, V. / Straube, B. / Harnisch, A. / Mrotzek, S. / Kucera, U. / Hulsenberg, D. / Mollenhauer, O. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 845
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Thermal matching of a glass-ceramic-interface for a carbon dioxide sensorLuniak, M. / Wolter, K.-J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 851
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Distributed crack propagation in porous ceramic materialsSadowski, T. / Samborski, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 856
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Properties of diamond for sensor applicationsJackman, R. B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 857
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The material properties, growth technology and applications of wide bandgap semiconductors for sensors and electronicsChalker, P. R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 858
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Temperature dependence of Young's modulus and degradation of chemical vapor deposited diamondMahlich, M. / Fecht, H.-J. / Szuecs, F. / Werner, M. / Sussmann, R. S. / Pickles, C. S. J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 863
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Performance of high speed diamond micro switchAdamschik, M. / Schmid, P. / Ertl, S. / Gluche, P. / Floter, A. / Kohn, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 867
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B-doping and piezoresistivity of CVD diamondJohnston, C. / Crossley, A. / Chalker, P. R. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 873
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CVD diamond and its application in medical technologiesGluche, P. / Floter, A. / Ertl, S. / Rosch, R. / Lingenfelder, C. / Adamschik, M. / Dambacher, J. / Kusterer, J. / Kohn, E. / Spraul, C. et al. | 2000
- 875
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High-strain rate superplasticity due to Newtonian flow of supercooled liquid in bulk glassy alloysInoue, A. / Kawamura, Y. / Zhang, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 876
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Superhard and ultrasmooth carbon films for micromechanical componentsSchultrich, B. / Scheibe, H.-J. / Siemroth, P. / Witke, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 880
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Surface characterization of thermochemically polished CVD diamond filmsWeima, J. A. / Fahrner, W. R. / Zaitsev, A. M. / Blum, F. / Kosaca, G. C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 884
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Determination of critical interfacial energy release rate in hard coatings on ductile substrateJeong, J.-H. / Kim, J.-J. / Jeong, A. / Lee, K.-R. / Kwon, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 890
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Large area 4H-SiC power Schottky diodeRang, T. / Korolkov, O. / Pikkov, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 894
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Impact of a single grain boundary and the surrounding crystallites on the electronic properties of MOS-transistorsSeifert, W. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 898
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Electrothermal interaction in power semiconductorsUhlenbrock, R. / Melbert, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 902
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Electrical conductivity model of excimer laser treaded polyimideSzilassi, Z. / Paszti, Z. / Hopp, B. / Chichak, S. / Ripka, G. / Mojzes, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 903
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Anomalous trends in electronic properties of boron compounds BP, BAs, and BSbBouhafs, B. / Aourag, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 904
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BaTiO~3 - ceramics cluster intergranular impedance modelMitic, V. V. / Petkovic, P. / Mitrovic, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 910
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Stress and fatigue life modeling in thin attach layersMcCluskey, P. / Iyengar, R. / Parthasarthy, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 911
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Materials properties with respect to microsystem technologiesMrosk, J. W. / Mahlich, M. / Kocdemir, B. / Fecht, H.-J. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 915
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Migration-resistant amorphous AIY metallizations for SAW devicesBerger, L. / Mrosk, J. W. / Ettl, C. / Fecht, H.-J. / Wolff, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 919
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Etching of microstructures and modification of solid surfaces by low energy ion beamsLopour, F. / Babor, P. / Sikola, T. / Spousta, J. / Dittrichova, L. / Matejka, F. / Duarte, J. C. C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 924
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Sensors and smart electronics in harsh environment applicationsFahrner, W. R. / Job, R. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 930
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Lead free alternatives: An analysis of performance characteristicsHuang, B. / Lee, N.-C. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 941
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Experiments for the assessment of biological effects of LCD material on the environmentHeinze, L. / Kalnowski, G. / Heppke, G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 947
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Corrosion protection with conducting polymers: mechanism, stability and durability of the protective componentLux, F. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 949
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Metal recycling as renewable resource of clean energy and raw materialsKassem, M. E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 952
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Nano-scale machining of single-crystal silicon using a friction force microscope and identification of affected layerAshida, K. / Chen, L. / Morita, N. / Yoshida, Y. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 956
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Micro-metalforming with silicon diesBohm, J. / Schubert, A. / Otto, T. / Burkhardt, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 960
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Porous silicon as new micro material for actuated 3D flip-up structures and its applications in microopticsLammel, G. / Renaud, P. et al. | 2000
- 960
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Porous silicon as new micro material for actuated 3D flip-up structuresLammel, G. / Renaud, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 964
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Materials characterization on a nanometer scale at BESSYJung, C. / Weiss, M. R. / Gudat, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 967
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Fritting contacts utilized for micromachined wafer probe cardKataoka, K. / Itoh, T. / Suga, T. / Engelmann, G. / Wolf, J. / Ehrmann, O. / Reichl, H. et al. | 2000
- 967
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Fritting contacts utilized for micromachined wafer probe cardsKataoka, K. / Itoh, T. / Suga, T. / Engelmann, G. / Wolf, J. / Ehrmann, O. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 972
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Ion implantation for micromaterial fabrication - fabrication and material propertiesNakano, S. / Ogiso, H. / Nakagawa, S. / Ishikawa, H. / Sato, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 976
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Determination of heat treatment states fit for microcutting of steelsPeichl, A. / Huntrup, V. / Schulze, V. / Spath, D. / Lohe, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 980
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Superplastic microforming of amorphous alloy with microdies fabricated by UV-LIGA processSaotome, Y. / Kurosawa, Y. / Kinuta, S. / Inoue, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 981
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Microforging of ZrTiCuNiBe-bulk glass in the supercooled liquid stateSeidel, M. / Macht, M.-P. / Mechler, S. / Wanderka, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 982
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Superplastic extrusion of microgear shaft with photochemically machinable glass diesSaotome, Y. / Iwazaki, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 984
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Micromechatronics - a foundation for future productsKallenbach, E. / Schilling, C. / Frank, T. / Kallenbach, M. / Wurmus, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 986
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Integration of micro-mechatronics in automotive applicationsAnsorge, F. / Becker, K.-F. / Michel, B. / Leutenbauer, R. / Grosser, V. / Aschenbrenner, R. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 987
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Advanced measurement techniques for microstructured surfacesFries, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 993
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Modeling piezoelectric composites for adaptronicsKreher, W. S. / Beckert, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 997
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New equipment for evaluating performance of microelements on MEMSHigo, Y. / Takashima, K. / Shimojo, M. / Sugiura, S. / Swain, M. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1002
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Dicing of silicon wafersInasaki, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1018
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Developing polymer based micromaterials using reclaimed micro-balloonsShukla, A. / Parameswaran, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1021
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Development of a high-k composite for integral capacitors and the electrical propertyOgitani, S. / Silvestrov, V. / Bidstrup-Allen, S. A. / Kohl, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1023
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Simulation of ferroelectric nonvolatile memory cells with MINIMOS-NTDragosits, K. / Selberherr, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1027
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Properties and integration study of oxazole dielectric OxDSezi, R. / Schmid, G. / Engelhardt, M. / Helneder, H. / Schrenk, M. / Schwerd, M. / Seidel, U. / Korner, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1031
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New perspectives of microtribology - methods and applicationsScherer, V. / Kullenberg, E. / Arnold, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1035
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Real-time monitoring and measurement of mechanical properties of polymeric films using resonant string structuresKim, Y.-J. / Allen, M. G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1041
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Preparation and modeling of fine-scaled 1-3 piezoelectric compositesSchonecker, A. / Gebhardt, S. / Seffner, L. / Steinhausen, R. / Hauke, T. / Seifert, W. / Beige, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1042
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The origin of the short stripe effect and creep controlled behavior in electromigrationGlickman, E. E. / Nathan, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1048
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Experimental determination of the correlation between conductivity and mechanical stress of a silver-filled electrically conductive adhesiveBornemann, J. / Schlimmer, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1052
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Metal/polymer interfaces and composite materials prepared by vapor phase depositionBehnke, K. / Strunskus, T. / Zaporojtchenko, V. / Faupel, F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1056
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Sol gel derived PZT thin films for MEMS applicationsMaeda, R. / Wang, Z. / Chu, J. R. / Lin, W. M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1062
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Property profiles of materials for micro-structuring by hot-embossingKrabe, D. / Ebling, F. / Lang, G. / Arndt-Staufenbiel, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1063
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Modelling the cure-dependent viscoelastic behaviour of a thermosetting resin and residual curing stressesKiasat, M. S. / Marissen, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1067
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Mechanical design support by means of FEA for advanced millimeter wave communication devicesSommer, J.-P. / Michel, B. / Doring, R. / Hager, W. / Rehme, F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1071
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Delay-time sensors for electrodiffusion measurementsBouabdallah, A. / Zizi, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1073
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Rapid prototyping of mesoscopic devicesStampfl, J. / Liu, H.-C. / Nam, S. W. / Kang, S. / Prinz, F. B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1079
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Thermographic testing methods with high temporal and spatial resolutionNetzelmann, U. / Walle, G. / Karpen, W. / Meyendorf, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1082
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Application of new materials for integrated low-energy ignition elements in airbag systems - characterization and simulationWeiss, U. / Lobner, B. / Gessner, T. / Hoyer, W. / Grambole, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1084
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Nanostructured shock-wave consolidated intermetallicsVarin, R. A. / Bystrzycki, J. / Paszula, J. / Song, Y. K. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1086
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Characteristics of micro-metallic powders intended to be used in the production of electrochemical supplies currentVasilescu, E. / Vasilescu, I. / Brenoaie, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1087
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Control of electroplating depositions in MEMS-fabricationLutke Notarp, D. / Becker, M. / Benecke, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1092
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Microelectronics and fiber-optics packaging: physical design for reliabilitySuhir, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1094
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Non-destructive characterization of magnetic layers and layer systemsMeyendorf, N. / Altpeter, I. / Netzelmann, U. / Rosner, H. / Hoffmann, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1100
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Noncontacting laser based techniques for the determination of elastic constants of thin foilsAnwander, M. / Kaindl, G. / Klein, M. / Weiss, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1104
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Multi chip power packaging - reliability assessmentHauck, T. / Paulasto, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1112
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Micromaterials topics in the German Materials Research Program MaTechSeitz, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1116
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Microproduction technology - key for micromaterials, innovative products, and new marketsMikosch, F. / Scherr, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1117
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Technologies and materials for microsystemsJohn, L.-G. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1120
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The impact of research and market on the economic success of small and medium sized companiesIlgner, J. / Kohler, T. / Mietke, S. / Werner, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1124
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Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solderingAnhock, S. / Ostmann, A. / Auerswald, E. / Nieland, C. / Reichl, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1127
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X-ray diffraction at elevated temperatures in the microsystem technologyAuerswald, E. / Anhock, S. / Kieselstein, E. / Vogel, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1130
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Dy~xO~y film formation on the InP substrateBabushkina, N. V. / Malyshev, S. A. / Romanova, L. I. / Bykova, L. N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1133
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Stength analysis of a micromechanical acceleration sensor by fracture mechanical approachesBagdahn, J. / Petzold, M. / Seidel, H. et al. | 2000
- 1133
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Strength analysis of a micromechanical acceleration sensor by fracture mechanical approachesBagdahn, J. / Petzold, M. / Seidel, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1136
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Deformation and cracking at microindentations in GaAsBergner, F. / Bergmann, U. / Schaper, M. / Hammer, R. / Jurisch, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1139
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Elastic modules of solid C~6~0: Measurement and relationship with nanostructureBlank, V. D. / Prokhorov, V. M. / Levin, V. M. / Soifer, J. M. / Kobelev, N. P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1140
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Reflactive bistable liquid crystal displays on flexible substratesBoeffel, C. / Bauer, M. / Kuschel, F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1141
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Dynamic Mechanical Analysis (DMA) of an highly-filled epoxy resin in thin layersBraun, T. / Miessner, R. / Becker, K.-F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1144
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Thermotropic metal-containing liquid crystal polyurethanes, possessing the high electric conductivityDavletbaeva, I. M. / Ismagilova, A. I. / Davletbaev, R. S. / Parfenov, V. V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1145
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Humidity sorption in subnanometer-size local free volumes of polyimides: A positron lifetime studyDlubek, G. / Buchhold, R. / Hubner, C. / Nakladal, A. / Meyendorf, N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1148
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Atomic scale structure changes during decomposition of Al alloys: A positron annihilation studyDlubek, G. / Depetasse, S. / Sourkov, A. / Meyendorf, N. / Krause-Rehberg, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1151
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Lead-free solders - rapidly reflowed under the laser beamDorn, L. / Herbert, F. / Shrestha, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1153
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In situ measurements of deformations on microelectronic components by microscopic methodsFaust, W. / Bombach, C. / Michel, M. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1158
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Influence of different modeling approaches for solder and underfill on the reliability assessment of flip chip assembliesFeustel, F. / Wiese, S. / Meusel, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1158
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Influence of different modelling approaches for solder and underfill on the reliability assessment of flip chip assembliesFeustel, F. / Wiese, S. / Meusel, E. et al. | 2000
- 1161
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Rapid Prototyping of components and demonstrators in microsystem technologyVogel, J. / Doring, R. / Fleischer, L. / Faust, W. / Dost, M. / Michel, B. / Zeidler, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1164
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The thermo-mechanical analysis of twin-chips silicon piezoresistive pressure sensorsFriedel, K. / Wymyslowski, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1165
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Plastic reshaping of silicon microstructures: process, characterization and applicationGartner, E. / Fruhauf, J. / Jansch, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1168
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Dielectric strength of ceramic substratesGemeinert, M. / Guther, W. / Mucke, U. / Schiller, W. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1170
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Analysis of structure and dimension of electronic parts with high resolution X-ray tomographyWeidemann, G. / Habel, W. / Illerhaus, B. / Riesemeier, H. / Goebbels, J. / Seifried, S. / Winterer, M. / Hahn, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1173
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Strain measurement in solder interconnects of advanced electronics packagesGollhardt, A. / Vogel, D. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1174
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Spectroscopic ellipsometry and dark conductivity measurements on p- and n-type microcrystalline silicon filmsGrabosch, G. / Fahrner, W. R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1175
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About the accuracy of the determination of mechanical properties of thin layers with the nanoindentation methodHerrmann, K. / Hasche, K. / Pohlenz, F. / Seemann, R. / Menelao, F. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1179
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Automated optical measurements under vacuumHillmann, V. / Grosser, V. / Gentzsch, S. / Bloch, H. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1183
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The micro stereoimage strain analysis by the microscope Zeiss Neophot 21 with Praktica Scan 2000Horecka, L. / Berka, L. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1185
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Patterning of thin plasma polymerized fluorcarbon filmsIanev, V. / Schwesinger, N. / Wurmus, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1185
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Patterning of thin plasma polymerised fluorocarbon filmsIanev, V. / Schwesinger, N. / Wurmus, H. et al. | 2000
- 1189
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Combination of electroless and electroplating methods in electronics and instrument makingKhoperia, T. N. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1192
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Mechanical properties of micro-injection moulded componentsKoch, T. / Seidler, S. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1195
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Simulation of resonant interference of light by thin filmsKosobutskyy, Y. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1201
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Surface modification due to technological treatment evaluated by SPM and XPS techniquesKrause, F. / Halser, K. / Topper, M. / Scherpinski, K. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1205
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Synthesis, dielectrical and dynamic mechanical characterisation of new thermoplastic polyurethanes for pyro- and piezoelectric applicationsKruger, H. / Frubing, P. / Gerhard-Multhaupt, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1208
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Temperature influence on current suppressing effect in SiC Schottky diodeKurel, R. / Rang, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1210
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Deformation behavior of micromirror arrays under optical powerKurth, S. / Kehr, K. / Faust, W. / Kaufmann, C. / Dotzel, W. / Gessner, T. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1213
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Lead-free solders for flipchip-technologyLeonhard, W. / Gemmler, A. / Heck, W. / Jordan, M. / Gust, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1216
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Development of micro scanning devices actuated with PZT thin filmsLin, W. M. / Lee, C. / Schroth, A. / Matsumoto, S. / Maeda, R. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1219
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The application of cluster intergranular impedance model for different BaTiO~3-ceramics cluster structuresMitic, V. V. / Petkovic, P. / Mitrovic, I. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1222
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Synthesis and optical properties of diamond crystalsMudryi, A. V. / Shakin, I. A. / Solovyev, V. S. / Gusakov, G. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1223
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High aspect ratio structuring by ICP etching and metals and ceramics micro forming with powder injection moldingMurakoshi, Y. / Shimizu, T. / Maeda, R. / Sano, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1225
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Humidity ceramic sensor materials on the basic of TiO~2Nenov, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1228
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Catalytic application of sol-gel deposited YSZ/Pd,Pt,RuO~x and YSZ/Pd,Pt,Rh layers on Corning™ catalytic substratesLabus, S. / Oblakowski, J. / Gajerski, R. / Fuc, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1231
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Degradation of Pt electrodes and micro-heaters of NO~x sensorsOblakowski, J. / Gajerski, R. / Labus, S. / Malecki, A. / Prochowska-Klisch, B. / Fuc, P. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1232
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Measurement of the Young's modulus of ceramic substrates in the range of 20 - 300^oCRehmer, B. / Finn, M. / Gemeinert, M. / Schiller, W. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1234
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Mode shape analysis of microstructures by means of laser-optical methodsRummler, N. / Schnitzer, R. / Grosser, V. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1236
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Micro/nano formability of amorphous alloys in the supercooled liquid stateSaotome, Y. / Inoue, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1237
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Development of in-situ nanoindentation system in a scanning electron microscopySaotome, Y. / Yanagisawa, T. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1238
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Mechanical characterization of thin and ultrathin films by laser induced surface waves (Laser acoustics)Schneider, D. / Schwarz, T. / Witke, T. / Schultrich, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1239
-
Glob Top-materials Technical demands, properties, principles of material selectionSchneider, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1242
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Researching of an ordered structure of porous anodic aluminum oxidesShulgov, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1243
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Analysis of micromaterialsSchwencke, B. / Muller, J. / Griese, H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1247
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Characterisation of micro materials and micro components by combination of the micro-bending test and UNIDACSeiler, B. / Kieselstein, E. / Dost, M. / Wielage, B. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1250
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Micropillared layers based on porous aluminaSokol, V. A. / Vorobyova, A. I. / Outkina, E. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1252
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Semi-additive and fully additive copper deposition on ORMOCER - a comparisonStolle, T. / Valizadeh, S. / Lambert, D. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1257
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Near-field and far-field thermography in characterisation of microsystemsSzeloch, R. F. / Gotszalk, T. P. / Radojewski, J. / Janus, P. / Pedrak, R. / Orawski, W. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1260
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Microstructure at indented thin GaN (0001) epilayers grown on 6H-SiC substratesTrampert, A. / Wagner, T. / Thamm, A. / Brandt, O. / Ploog, K. H. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1261
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Effect of inhomogeneity on the instrumented indentation testUllner, C. / Beckmann, J. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1264
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Experimental and numerical investigations of micro-electroplated sensorsVogel, J. / Sommer, J.-P. / Noack, E. / Kieselstein, E. / Auerswald, E. / Gentzsch, S. / Grosser, V. / Winkler, T. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) et al. | 2000
- 1268
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Pillared microstructures of Al and Ta anodic oxides - advanced system for display technologyVorobyova, A. I. / Outkina, E. A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1269
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Evaluation of Glob Top Materials for Chip-on-Board (COB) applicationsWalter, H. / Schneider, W. / Dudek, R. / Auerswald, E. / Schubert, A. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1272
-
Tensile and fatigue testing for electronic materials with Microforce Testing System Tytron™ 250 (MTS)Walter, H. / Schubert, A. / Priesnitz, U. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1273
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Crack propagation in flip chip solder jointsWiese, S. / Jakschik, S. / Feustel, F. / Heeg, J. / Meusel, E. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1276
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Application of electroplating in MEMS-micromachining exemplified by a microrelayBecker, M. / Lutke Notarp, D. / Vogel, J. / Noack, E. / Grosser, V. / Benecke, W. / Michel, B. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1280
-
Investigation of bonding behaviour of different borosilicate glassesWiemer, M. / Hiller, K. / Gessner, T. / Kloss, T. / Schneider, K. / Leipold-Haas, U. / Bagdahn, J. / Petzold, M. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000
- 1283
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Application of the zinc-silicat glass and GeO~2 thin films as diffusion sources and encapsulants for GaAs and InPShiolashvili, Z. / Jishiashvili, D. / Eterashvili, T. / Gobronidze, V. / Deutsche Verband fur Materialforschung und prufung (DVM) / Fraunhofer Institute for Reliability and Microintegration (IZM) et al. | 2000