Nanoscale Thermal and Thermoelectric Mapping of Semiconductor Devices and Interconnects (Englisch)
- Neue Suche nach: Shi, L.
- Neue Suche nach: Lyeo, H. K.
- Neue Suche nach: Shih, C. K.
- Neue Suche nach: Kim, P.
- Neue Suche nach: Bachtold, A.
- Neue Suche nach: Plyosunov, S.
- Neue Suche nach: McEuen, P. L.
- Neue Suche nach: Majumdar, A.
- Neue Suche nach: AIP
- Neue Suche nach: Shi, L.
- Neue Suche nach: Lyeo, H. K.
- Neue Suche nach: Shih, C. K.
- Neue Suche nach: Kim, P.
- Neue Suche nach: Bachtold, A.
- Neue Suche nach: Plyosunov, S.
- Neue Suche nach: McEuen, P. L.
- Neue Suche nach: Majumdar, A.
- Neue Suche nach: Seiler, David G
- Neue Suche nach: AIP
In:
Characterization and metrology for ULSI technology
;
462-468
;
2003
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Nanoscale Thermal and Thermoelectric Mapping of Semiconductor Devices and Interconnects
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Beteiligte:Shi, L. ( Autor:in ) / Lyeo, H. K. ( Autor:in ) / Shih, C. K. ( Autor:in ) / Kim, P. ( Autor:in ) / Bachtold, A. ( Autor:in ) / Plyosunov, S. ( Autor:in ) / McEuen, P. L. ( Autor:in ) / Majumdar, A. ( Autor:in ) / Seiler, David G / AIP
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Kongress:International conference, Characterization and metrology for ULSI technology
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Erschienen in:AIP CONFERENCE PROCEEDINGS ; 683 ; 462-468
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Verlag:
- Neue Suche nach: American Institute of Physics
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Erscheinungsort:Woodbury, NY
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Erscheinungsdatum:01.01.2003
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Format / Umfang:7 pages
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Anmerkungen:Includes bibliographical references and indexes. One CD ROM in pocket attached to inside back cover
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 3
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From the Lab to the Fab: Transistors to Integrated CircuitsHuff, H. R. / AIP et al. | 2003
- 40
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Diffused Silicon Transistors and Switches (1954-55): The Beginning of Integrated Circuit TechnologyHolonyak, N. / AIP et al. | 2003
- 63
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Semiconductor Technology and Manufacturing Status, Challenges, and Solutions-A New Paradigm in the MakingHelms, C. R. / AIP et al. | 2003
- 74
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CMOS Devices and Beyond: A Process Integration PerspectiveHutchby, J. A. / Zhirnov, V. / Cavin, R. / Bourianoff, G. / AIP et al. | 2003
- 81
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Metrology Requirements and the Limits of Measurement Technology for the Semiconductor IndustryDiebold, A. C. / AIP et al. | 2003
- 97
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Development of Metrology at NIST for the Semiconductor IndustryKnight, S. / AIP et al. | 2003
- 107
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The "Ultimate" CMOS Device: A 2003 Perspective (Implications for Front-End Characterization and Metrology)Huff, H. R. / Zeitzoff, P. M. / AIP et al. | 2003
- 124
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Optical Metrology for Ultrathin Oxide and High-kappa Gate DielectricsChism, W. W. / Diebold, A. C. / Price, J. / AIP et al. | 2003
- 129
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Critical Metrology for Ultrathin High-kappa DielectricsVandervorst, W. / Brijs, B. / Bender, H. / Conard, T. / Petry, J. / Richard, O. / Blasco, X. / Nafria, M. / AIP et al. | 2003
- 139
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Advanced Characterization of High-kappa Materials Interfaces by High-Resolution Photoemission Using Synchrotron RadiationRenault, O. / Barrett, N. T. / Samour, D. / Damlencourt, J.-F. / Blin, D. / Quiais-Marthon, S. / AIP et al. | 2003
- 143
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Preparation and Characterizations of High-kappa Gate Dielectric CaZrO~3 Thin Films by Sol-Gel TechnologyYu, T. / Zhu, W. / Chen, C. / Chen, X. / Krishnan, R. G. / AIP et al. | 2003
- 148
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High-kappa Dielectric Characterization by VUV Spectroscopic Ellipsometry and X-Ray ReflectionBoher, P. / Evrard, P. / Piel, J. P. / Defranoux, C. / Fouere, J. C. / Bellandi, E. / Bender, H. / AIP et al. | 2003
- 154
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Non-destructive Characterization and Metrology for Ultrathin High-kappa Dielectric LayersChampaneria, R. / Mack, P. / White, R. / Wolstenholme, J. / AIP et al. | 2003
- 160
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Non-contact C-V Technique for High-kappa ApplicationsEdelman, P. / Savtchouk, A. / Wilson, M. / D Amico, J. / Kochey, J. N. / Marinskiy, D. / Lagowski, J. / AIP et al. | 2003
- 166
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A New Characterization Technique for Depth-Dependent Dielectric Properties of High-kappa Films by Open-Circuit Potential MeasurementKita, K. / Sasagawa, M. / Kyuno, K. / Toriumi, A. / AIP et al. | 2003
- 171
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Optical Properties of Silicon Oxynitride Thin Films Determined by Vacuum Ultraviolet Spectroscopic EllipsometryKim, H. J. / Cho, Y. J. / Cho, H. M. / Kim, S. Y. / Moon, C. / Cho, G. / Kwon, Y. / AIP et al. | 2003
- 176
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Characterization of Hafnium Oxide Thin Films Prepared by MOCVDChoy, S. F. / Lim, V. S. W. / Gopalakrishan, R. / Trigg, A. / Bera, L. K. / Matthew, S. / Balasubramanian, N. / Joo, M.-S. / Cho, B.-J. / Yeo, C. C. et al. | 2003
- 181
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Optical Properties of Jet-Vapor-Deposited TiAlO and HfAlO Determined by Vacuum Ultraviolet Spectroscopic EllipsometryNguyen, N. V. / Han, J.-P. / Kim, J. Y. / Wilcox, E. / Cho, Y. J. / Zhu, W. / Luo, Z. / Ma, T. P. / AIP et al. | 2003
- 186
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High-kappa Dielectric Stack-Ellipsometry and Electron Diffraction Measurements of Interfacial OxidesChoi, K. / Harris, H. R. / Nikishin, S. / Gangopadhyay, S. / Temkin, H. / AIP et al. | 2003
- 190
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Submillimeter-Wavelength Plasma Diagnostics for Semiconductor ManufacturingBenck, E. C. / Golubiatnikov, G. Y. / Fraser, G. T. / Pluesquelic, D. / Lavrich, R. / Ji, B. / Motika, S. A. / Karwacki, E. J. / AIP et al. | 2003
- 195
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Monitoring Sheath Voltages and Ion Energies in High-Density Plasmas Using Noninvasive Radio-Frequency Current and Voltage MeasurementsSobolewski, M. A. / AIP et al. | 2003
- 200
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Effects of Lightpipe Proximity on Si Wafer Temperature in Rapid Thermal Processing ToolsKreider, K. G. / Chen, D. H. / DeWitt, D. P. / Kimes, W. A. / Tsai, B. K. / AIP et al. | 2003
- 205
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Analytical Methodologies for Semiconductor Process Characterization- Novel Mass Spectrometric MethodsVartanian, V. H. / Goolsby, B. / AIP et al. | 2003
- 213
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Characterization of Si/SiGe Heterostructures for Strained Si CMOSMooney, P. M. / Koester, S. J. / Hovel, H. J. / Chu, J. O. / Chan, K. K. / Jordan-Sweet, J. L. / Ott, J. A. / Klymco, N. / Mocuta, D. M. / AIP et al. | 2003
- 223
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Characterization Techniques for Evaluating Strained Si CMOS MaterialsXie, Q. / Liu, R. / Wang, X.-D. / Canonico, M. / Duda, E. / Lu, S. / Cook, C. / Volinsky, A. A. / Zollner, S. / Thomas, S. G. et al. | 2003
- 228
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Root-Cause Analysis and Statistical Process Control of Epilayers for SiGe:C Hetero-Structure Bipolar TransistorsXie, Q. / Duda, E. / Kottke, M. / Qin, W. / Wang, X.-D. / Lu, S. / Erickson, M. / Kretzschmar, H. / Cross, L. / Murphy, S. et al. | 2003
- 233
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Graded Si~1~-~X Ge~X Metrology Using a Multi-technology Optical SystemPois, H. / Huang, J. / Morris, S. / Peterlinz, K. / Zangooie, S. / Liu, J. P. / Tan, B. L. / Sohn, D. K. / Jones, R. / Scheirer, C. et al. | 2003
- 238
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Characterization of SiGe Bulk Compositional Standards with Electron Probe MicroanalysisMarinenko, R. B. / Armstrong, J. T. / Turner, S. / Steel, E. B. / Stevie, F. A. / AIP et al. | 2003
- 245
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Characterization of Organic Contaminants Outgassed from Materials Used in Semiconductor Fabs/ProcessingSun, P. / Ayre, C. / Wallace, M. / AIP et al. | 2003
- 254
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Direct to Digital Holography for High Aspect Ratio Inspection of Semiconductor WafersThomas, C. E. / Hunt, M. A. / Bahm, T. M. / Baylor, L. R. / Bingham, P. R. / Chidley, M. D. / Dai, X. / Delahanty, R. J. / El-Khashab, A. / Gilbert, J. M. et al. | 2003
- 271
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Challenges of Finer Particle Detection on Unpatterned Silicon WafersHattori, T. / Okamoto, A. / Kuniyasu, H. / AIP et al. | 2003
- 278
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Characterization of Missing-Poly Defects in Ion Implantation in ULSI ManufacturingDunham, B. / Anundson, R. / Zhao, Z. Y. / AIP et al. | 2003
- 284
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Full-Wafer Defect Identification Using X-Ray TopographyBowen, D. K. / Wormington, M. / Feichtinger, P. / Joyce, D. E. / AIP et al. | 2003
- 289
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Contamination-Free Manufacturing: Tool Component Qualification, Verification, and Correlation with WafersTan, S. H. / Chen, N. / Liu, S. / Wang, K. / AIP et al. | 2003
- 294
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TOFSIMS Characterization of Molecular Contamination Induced Resist ScummingLee, J. J. / Guenther, T. / Brownson, R. / Frezon, S. / AIP et al. | 2003
- 300
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Controlling Wafer Contamination Using Automated On-Line Metrology during Wet Chemical CleaningWang, J. / Kingston, S. / Han, Y. / Saini, H. / McDonald, R. / Mui, R. / AIP et al. | 2003
- 309
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Should We Analyze for Trace Metal Contamination at the Edge, Bevel, and Edge Exclusion of Wafers?Beebe, M. / Sparks, C. / Carpio, R. / AIP et al. | 2003
- 313
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NIST Calibration Facility for Sizing Spheres Suspended in LiquidsDonnelly, M. K. / Mulholland, G. W. / Winchester, M. R. / AIP et al. | 2003
- 321
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Measurement of Gate-Oxide Film Thicknesses by X-Ray Photoelectron SpectroscopyPowell, C. J. / Jablonski, A. / AIP et al. | 2003
- 326
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Assessment of Ultrathin SiO~2 Film Thickness Measurement Precision by EllipsometryChandler-Horowitz, D. / Nguyen, N. V. / Ehrstein, J. R. / AIP et al. | 2003
- 331
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Thickness Evaluation for 2nm SiO~2 Films, a Comparison of Ellipsometric, Capacitance-Voltage, and HRTEM MeasurementsEhrstein, J. / Richter, C. / Chandler-Horowitz, D. / Vogel, E. / Ricks, D. / Young, C. / Spencer, S. / Shah, S. / Maher, D. / Foran, B. et al. | 2003
- 337
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Uncertainties Caused by Surface Adsorbates in Estimates of the Thickness of SiO~2 Ultrathin FilmsAzuma, Y. / Tan, R. / Fujimoto, T. / Kojima, I. / Shinozaki, A. / Morita, M. / AIP et al. | 2003
- 343
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Quantification of Local Elastic Properties Using Ultrasonic Force MicroscopyKraatz, M. / Geisler, H. / Zschech, E. / AIP et al. | 2003
- 348
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Determination of Factors Affecting HRTEM Gate Dielectric Thickness Measurement UncertaintyScott, J. H. J. / AIP et al. | 2003
- 353
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Microtensile Testing of Thin Films in the Optical and Scanning Electron MicroscopesRead, D. T. / McColskey, J. D. / Geiss, R. / Cheng, Y.-W. / AIP et al. | 2003
- 357
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Non-destructive Surface Profile Measurement of a Thin Film Deposited on a Patterned SampleKim, D. / Chegal, W. / Kim, S. / Kong, H. J. / Lee, Y. / AIP et al. | 2003
- 365
-
Overview of Lithography: Challenges and MetrologiesLevinson, H. J. / AIP et al. | 2003
- 371
-
EUV Mask Blank Fabrication and MetrologySeidel, P. / AIP et al. | 2003
- 381
-
Review of CD Measurement and ScatterometryThony, P. / Herisson, D. / Henry, D. / Severgnini, E. / Vasconi, M. / AIP et al. | 2003
- 389
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Advanced Mask Inspection and MetrologyYoshioka, N. / Terasawa, T. / AIP et al. | 2003
- 396
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Application of High-Pressure/Environmental Scanning Electron Microscopy to Photomask Dimensional MetrologyPostek, M. T. / Vladar, A. E. / AIP et al. | 2003
- 400
-
A Model for Step Height, Edge Slope, and Linewidth Measurements Using AFMZhao, X. / Vorburger, T. V. / Fu, J. / Song, J. / Nguyen, C. V. / AIP et al. | 2003
- 409
-
A Primary Standard for 157 nm Excimer Laser MeasurementsCromer, C. L. / Dowell, M. L. / Jones, R. D. / Keenan, D. A. / Yang, S. / AIP et al. | 2003
- 413
-
The Transition to Optical Wafer Flatness MetrologyValley, J. F. / Poduje, N. / AIP et al. | 2003
- 421
-
Critical Dimension Calibration Standards for ULSI MetrologyAllen, R. A. / Cresswell, M. W. / Murabito, C. E. / Dixson, R. G. / Bogardus, E. H. / AIP et al. | 2003
- 429
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Form of Deprotection in Chemically Amplified ResistsJones, R. L. / Hu, T. / Prabhu, V. M. / Soles, C. L. / Lin, E. K. / Wu, W.-l. / Goldfarb, D. L. / Angelopoulos, M. / AIP et al. | 2003
- 434
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3-Dimensional Lineshape Metrology Using Small Angle X-Ray ScatteringJones, R. L. / Hu, T. / Lin, E. K. / Wu, W.-l. / Casa, D. M. / Barclay, G. G. / AIP et al. | 2003
- 439
-
NEXAFS Measurements of the Surface Chemistry of Chemically Amplified PhotoresistsJablonski, E. L. / Lenhart, J. L. / Sambasivan, S. / Fischer, D. A. / Jones, R. L. / Lin, E. K. / Wu, W.-l. / Goldfarb, D. L. / Temple, K. / Angelopoulos, M. et al. | 2003
- 444
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Facility for Pulsed Extreme Ultraviolet Detector CalibrationGrantham, S. / Vest, R. / Tarrio, C. / Lucatorto, T. B. / AIP et al. | 2003
- 448
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Combinatorial Methods Study of Confinement Effects on the Reaction Front in Ultrathin Chemically Amplified PhotoresistsWang, M. X. / Lin, E. K. / Karim, A. / Fasolka, M. J. / AIP et al. | 2003
- 455
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Correlation of Surface and Film Chemistry with Mechanical Properties in InterconnectsZhou, Y. / Xu, G. / Scherban, T. / Leu, J. / Kloster, G. / Wu, C.-I. / AIP et al. | 2003
- 462
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Nanoscale Thermal and Thermoelectric Mapping of Semiconductor Devices and InterconnectsShi, L. / Lyeo, H. K. / Shih, C. K. / Kim, P. / Bachtold, A. / Plyosunov, S. / McEuen, P. L. / Majumdar, A. / AIP et al. | 2003
- 469
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Potential and Limits of Texture Measurement Techniques for Inlaid Copper Process OptimizationGeisler, H. / Zienert, I. / Prinz, H. / Meyer, M.-A. / Zschech, E. / AIP et al. | 2003
- 480
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In Situ X-Ray Microscopy Studies of Electromigration in Copper InterconnectsSchneider, G. / Meyer, A. M. / Zschech, E. / Denbeaux, G. / Neuhausler, U. / Guttmann, P. / AIP et al. | 2003
- 485
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Room Temperature Electroplated Copper Recrystallization: In Situ Mapping on 200/300 mm Patterned WafersKozaczek, K. J. / Martin, R. I. / Huang, L.-Y. / Kurtz, D. S. / Moran, P. R. / AIP et al. | 2003
- 490
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Metrology Tool for Microstructure Control on 300 mm Wafers during Damascene Copper ProcessingKozaczek, K. J. / Kurtz, D. S. / Moran, P. R. / Martin, R. I. / Huang, L.-Y. / Stratilatov, A. / AIP et al. | 2003
- 494
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Texture and Stress Analysis in As-Deposited and Annealed Damascene Cu Interconnects Using XRD and OIMMirpuri, K. / Szpunar, J. / Kozaczek, K. / AIP et al. | 2003
- 499
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Microstructure Analysis in As-Deposited and Annealed Damascene Cu Interconnects Using OIMMirpuri, K. / Szpunar, J. / Kozaczek, K. / AIP et al. | 2003
- 504
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Controlling Copper Electrochemical Deposition (ECD)West, M. / McDonald, R. / Anderson, M. / Kingston, S. / Mui, R. / AIP et al. | 2003
- 514
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Analysis and Control of Copper Plating Bath Additives and By-ProductsNewton, B. / Kaiser, E. / AIP et al. | 2003
- 519
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Characterization of Barrier Layer Phase and Morphology as a Function of Differing Dielectric Substrate Conditions by AFM and Grazing Angle XRDWang, C. C. / Lai, G. / Brundle, C. R. / Uritsky, Y. / AIP et al. | 2003
- 525
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Nanoindentation Study of the Mechanical Behavior of Silicon Nano-SpringsLi, B. / Luo, Z. / Ho, P. S. / Lu, T.-M. / AIP et al. | 2003
- 533
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Impact of Low-kappa Dielectrics on Electromigration Reliability for Cu InterconnectsHo, P. S. / Lee, K.-D. / Ogawa, E. T. / Yoon, S. / Lu, X. / AIP et al. | 2003
- 540
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New Infrared Spectroscopic Ellipsometer for Low-kappa Dielectric CharacterizationBoher, P. / Bucchia, M. / Guillotin, C. / Defranoux, C. / Fouere, J. C. / AIP et al. | 2003
- 546
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Pore Size Distribution Measurement of Porous Low-kappa Dielectrics Using TR-SAXSTerada, S. / Kinashi, T. / Spear, J. / AIP et al. | 2003
- 551
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Material Characterization and the Formation of Nanoporous PMSSQ Low-kappa DielectricsLazzeri, P. / Vanzetti, L. / Iacob, E. / Bersani, M. / Anderle, M. / Park, J. J. / Lin, Z. / Briber, R. M. / Rubloff, G. W. / Miller, R. D. et al. | 2003
- 556
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Determination of Pore-Size Distributions in Low-kappa Dielectric Films by Transmission Electron MicroscopyForan, B. J. / Kastenmeier, B. / Bright, D. S. / AIP et al. | 2003
- 562
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Porosity Characterization of Porous SiLK™ Low-kappa Dielectric FilmsMohler, C. E. / Landes, B. G. / Meyers, G. F. / Kern, B. J. / Ouellette, K. B. / Magonov, S. / AIP et al. | 2003
- 567
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Measurement of Pore Size and Matrix Characteristics in Low-kappa Dielectrics by Neutron Contrast VariationHedden, R. C. / Lee, H.-J. / Bauer, B. J. / Soles, C. L. / Wu, W.-l. / Lin, E. K. / AIP et al. | 2003
- 572
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The Structural Evolution of Pore Formation in Low-kappa Dielectric Thin FilmsSilverstein, M. S. / Bauer, B. J. / Lee, H.-J. / Hedden, R. C. / Landes, B. / Lyons, J. / Kern, B. / Niu, J. / Kalantar, T. / AIP et al. | 2003
- 576
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X-Ray Porosimetry as a Metrology to Characterize the Pore Structure of Low-kappa Dielectric FilmsSoles, C. L. / Lee, H.-J. / Hedden, R. C. / Liu, D.-W. / Bauer, B. J. / Wu, W.-l. / AIP et al. | 2003
- 583
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In Situ Metrology: The Path to Real-Time Advanced Process ControlRubloff, G. W. / AIP et al. | 2003
- 592
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Automated, On-Line, Trace Contamination and Chemical Species Analysis for the Semiconductor IndustryKingston, S. / McDonald, R. / Han, Y. / Wang, J. / West, M. / Stewart, L. / Ormond, B. / Mui, R. / AIP et al. | 2003
- 606
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On-Line Analysis of Process Chemicals by Inductively Coupled Plasma Mass Spectrometry (ICP-MS)Kishi, Y. / Kawabata, K. / Palsulich, D. / Wiederin, D. / AIP et al. | 2003
- 611
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Novel Applications of Gas-Phase Analytical Methods to Semiconductor Process EmissionsGoolsby, B. / Vartanian, V. H. / AIP et al. | 2003
- 619
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Overview of CD-SEM-And BeyondJoy, D. C. / AIP et al. | 2003
- 627
-
Transmission Electron Microscopy: Overview and ChallengesPennycook, S. J. / Lupini, A. R. / Borisevich, A. / Varela, M. / Peng, Y. / Nellist, P. D. / Duscher, G. / Buczko, R. / Pantelides, S. T. / AIP et al. | 2003
- 634
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High-Resolution X-Ray Scattering Methods for ULSI Materials CharacterizationMatyi, R. J. / AIP et al. | 2003
- 646
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Advances in X-Ray Reflectivity (XRR) and X-Ray Fluorescence (XRF) Measurements Provide Unique Advantages for Semiconductor ApplicationsSpear, J. / Murakami, H. / Terada, S. / AIP et al. | 2003
- 651
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Characterization of Porous, Low-kappa Dielectric Thin-Films Using X-Ray ReflectivityWormington, M. / Russell, C. / AIP et al. | 2003
- 656
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Ultra-shallow Junction Metrology Using the Therma-Probe ToolBakshi, M. / Nicolaides, L. / Cherekdjian, S. / Tichy, R. / AIP et al. | 2003
- 660
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Practical Fab Applications of X-Ray MetrologyAgnihotri, D. / Formica, J. / Gallegos, J. / O Dell, J. / AIP et al. | 2003
- 667
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Study of Oxide Quality for Scanning Capacitance Microscope MeasurementsLim, V. S. W. / Jiang, Y. / Trigg, A. / AIP et al. | 2003
- 672
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Application of SCM to Process Development of Novel DevicesDuhayon, N. / Vandervorst, W. / Hellemans, L. / AIP et al. | 2003
- 678
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Assessing the Resolution Limits of Scanning Spreading Resistance Microscopy and Scanning Capacitance MicroscopyEyben, P. / Duhayon, N. / Alvarez, D. / Vandervorst, W. / AIP et al. | 2003
- 685
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Recent Progress and Insights in Two-Dimensional Carrier Profiling Using Scanning Spreading Resistance MicroscopyEyben, P. / Alvarez, D. / Clarysse, T. / Denis, S. / Vandervorst, W. / AIP et al. | 2003
- 695
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Ultra-shallow Depth Profiling by Secondary Ion Mass Spectrometry TechniquesAnderle, M. / Barozzi, M. / Bersani, M. / Giubertoni, D. / Lazzeri, P. / AIP et al. | 2003
- 705
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In Situ Sputtering Rate Measurement by Laser Interferometer Applied to SIMS AnalysesBersani, M. / Giubertoni, D. / Barozzi, M. / Bertoldi, S. / Vanzetti, L. / Iacob, E. / Anderle, M. / AIP et al. | 2003
- 710
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Bevel Depth Profiling SIMS for Analysis of Layer StructuresGillen, G. / Wight, S. / Chi, P. / Fahey, A. / Verkouteren, J. / Windsor, E. / Fenner, D. B. / AIP et al. | 2003
- 715
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Using Direct Solid Sampling ICP-MS to Complement SEM-EDX and SIMS in Characterizing Semiconductor MaterialsLi, F. / Anderson, S. / AIP et al. | 2003
- 723
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Status and Prospects for VUV Ellipsometry (Applied to High-kappa and Low-kappa Materials)Edwards, N. V. / AIP et al. | 2003
- 738
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Applications of UV-Raman Spectroscopy to Microelectronic Materials and DevicesLiu, R. / Canonico, M. / AIP et al. | 2003
- 744
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Characterization of Ion-Implantation in Silicon by Using Laser Infrared Photo-Thermal Radiometry (PTR)Garcia, J. A. / Guo, X. / Mandelis, A. / Simmons, A. / Li, B. / AIP et al. | 2003
- 748
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In Situ Optical Diagnostics of Silicon Chemical Vapor Deposition Gas-Phase ProcessesMaslar, J. E. / Hurst, W. S. / AIP et al. | 2003
- 753
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One-Dimensional Spectroscopic Measurement of Patterned Structures Using a Custom-Built Spectral Imaging EllipsometerChegal, W. / Kim, D. / Kim, S. / Cho, Y. J. / Cho, H. M. / Lee, Y. W. / AIP et al. | 2003
- 758
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Carrier Illumination as a Tool to Probe Implant Dose and Electrical ActivationVandervorst, W. / Clarysse, T. / Brijs, B. / Loo, R. / Peytier, Y. / Pawlak, B. J. / Budiarto, E. / Borden, P. / AIP et al. | 2003
- 764
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Fiber Optic Fourier Transform Infrared Spectroscopic Techniques for Advanced On-Line Chemical Analysis in Semiconductor Fabrication ToolsKester, M. / Trygstad, M. / Chabot, P. / AIP et al. | 2003
- 771
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Challenges of Electrical Measurements of Advanced Gate Dielectrics in Metal-Oxide-Semiconductor DevicesVogel, E. M. / Brown, G. A. / AIP et al. | 2003
- 782
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Status of Non-contact Electrical MeasurementsKomin, V. V. / Bello, A. F. / Brundle, C. R. / Uritsky, Y. S. / AIP et al. | 2003
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