Used Consumer Electronics: A Comparative Analysis of Materials Recycling Technologies (Englisch)
- Neue Suche nach: Kang, H.-Y.
- Neue Suche nach: Schoenung, J. M.
- Neue Suche nach: Kang, H.-Y.
- Neue Suche nach: Schoenung, J. M.
In:
Electronics and the environment
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226-230
;
2004
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Print
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Titel:Used Consumer Electronics: A Comparative Analysis of Materials Recycling Technologies
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Beteiligte:Kang, H.-Y. ( Autor:in ) / Schoenung, J. M. ( Autor:in )
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Kongress:International Symposium, Electronics and the environment ; 2004 ; Scottsdale, AZ
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Erschienen in:Electronics and the environment ; 226-230
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Verlag:
- Neue Suche nach: IEEE,
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Erscheinungsdatum:01.01.2004
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Format / Umfang:5 pages
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Anmerkungen:IEEE cat. no 04CH37511
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ISBN:
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ISSN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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IEEE International Symposium on Electronics and the Environment| 2004
- 1
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Economic sustainability of reuse as an end-of-life management tool for computers and televisionsRubinstein, L. et al. | 2004
- 7
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Making sustainability accountable: a valuation model for corporate performanceLing Wang, / Li Lin, et al. | 2004
- 13
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Environmental impact of information and communication technologies including rebound effectsTakahashi, K.I. / Tatemichi, H. / Tanaka, T. / Nishi, S. / Kunioka, T. et al. | 2004
- 17
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A macroeconomic analysis of the relationship between IT industries and environmental policiesMatsumoto, M. / Fujimoto, J. / Tekawa, M. / Tamura, T. et al. | 2004
- 23
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Life cycle tools for future product sustainabilityPrzekop, L.A. / Kerr, S. et al. | 2004
- 27
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Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packagesStinson-Bagby, K. / Huff, D. / Katsis, D. / Van Wyk, D. / Lu, G.Q. et al. | 2004
- 33
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Environmental leadership in electronics manufacturing: lead-free and beyondShangguan, D. et al. | 2004
- 40
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Environmental assessment of halogen-free printed circuit boards, a design for environment (DfE) project with the high density packaging user group (HDPUG)O'Connell, S. / Whitley, A. / Brady, T. / Ching, S. / Fong, A. / Bergman, R. / Burkitt, J. et al. | 2004
- 46
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End-of-life and regulatory issues for flame retardant plastics used in electrical and electronic equipment applicationsDawson, R.B. / Landry, S.D. et al. | 2004
- 51
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A decision-support tool for the take-back of plastics from end-of-life electronicsMasanet, E.R. / Horvath, A. et al. | 2004
- 57
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An economic model for end-of-life management of printed circuit boardsRao, N.U. / Yuan, C.Y. / Zhang, H.C. et al. | 2004
- 63
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Developing product recovery services: a case study from the electrical power network construction industryHerold, M. et al. | 2004
- 68
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Methodology for recycling potential evaluation criterion of waste home appliances considering environmental and economic factorJunbeum Kim, / Yongwoo Hwang, / Matthews, H.S. / Kwangho Park, et al. | 2004
- 74
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Environmental and economic trade-offs in consumer electronic products recycling: a case study of cell phones and computersBhuie, A.K. / Ogunseitan, O.A. / Saphores, J.-D.M. / Shapiro, A.A. et al. | 2004
- 80
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Revisiting energy used to manufacture a desktop computer: hybrid analysis combining process and economic input-output methodsWilliams, E.D. et al. | 2004
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Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impactsKrishnan, N. / Boyd, S. / Rosales, J. / Dornfeld, D. / Raoux, S. / Smati, R. et al. | 2004
- 91
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- 97
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Comparative analysis of the manufacturing and consumer use phases of two generations of semiconductors [microprocessors]Yao, M.A. / Wilson, A.R. / McManus, T.J. / Shadman, F. et al. | 2004
- 97
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Comparative Analysis of the Manufacturing and Consumer Use Phases of Two Generations of SemiconductorsYao, M. A. / Wilson, A. R. / McManus, T. J. / Shadman, F. et al. | 2004
- 104
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Recycling and extended life of electric home appliances: hybrid analysis based on the waste input-output modelNakmura, S. / Kondo, Y. et al. | 2004
- 106
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Comparative analysis of traditional telephone and voice-over-Internet protocol (VoIP) systemsHui Min Chong, / Matthews, H.S. et al. | 2004
- 112
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- 117
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Peak-shift method for notebook computers - a power management approach for load levelingHatori, M. et al. | 2004
- 122
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- 128
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Power management of computersKorn, D. / Huang, R. / Beavers, D. / Bolioli, T. / Walker, M. et al. | 2004
- 128
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Power Management of Computers - $ 1.5 Billion in Potential Energy Savings AnnuallyKorn, D. / Huang, R. / Beavers, D. / Bolioli, T. / Walker, M. et al. | 2004
- 132
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Sustainability and end-of-life product management: a case study of electronics collection scenariosCaudill, R.J. / Dickinson, D.A. et al. | 2004
- 138
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An overview of environmental product performance measurement in the Asian electronics industryPascual, O. / Boks, C. et al. | 2004
- 144
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Operational sustainability metrics - assessing performance of electronics recycling systemsKirchain, R. / Atlee, J. et al. | 2004
- 150
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A review of environmental accounting practices in the Asian electronics industryPascual, O. / Boks, C. et al. | 2004
- 156
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Environmental implications of PCB manufacturing in ChinaJingwei Wang, / Jinqiu Xu, et al. | 2004
- 159
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The environmental impacts of electronics. Going beyond the walls of semiconductor fabsPlepys, A. et al. | 2004
- 166
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Smart disassembly [joint separation method]Hosoda, N. / Halada, K. / Suga, T. et al. | 2004
- 166
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Smart DisassemblyHosoda, N. / Halada, K. / Suga, T. et al. | 2004
- 168
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Life cycle process management for environmentally sound and cost effective semiconductor manufacturingDietrich, J.M. et al. | 2004
- 173
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Reuse and Lifetime Extension Strategies in the Context of Technology Innovations, Global Markets, and Environmental LegislationGriese, H. / Poetter, H. / Schischke, K. / Ness, O. / Reichl, H. et al. | 2004
- 173
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Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation [electronics]Griese, H. / Poetter, H. / Schischke, K. / Ness, O. / Reichl, H. et al. | 2004
- 179
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- 183
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Mathematical model of reusabilityMurayama, T. / Yamamoto, S. / Oba, F. et al. | 2004
- 189
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Baseline study of noncommercial computer reuse in the United StatesLynch, J. et al. | 2004
- 195
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A decade of processing end of life IT equipment - lessons learned at the IBM/sub /spl trade// Endicott asset recovery centerGrenchus, E.J. / Keene, R.A. / Nobs, C.R. et al. | 2004
- 195
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A Decade of Processing End of Life IT Equipment - Lessons Learned at the IBM~(~™~) Endicott Asset Recovery CenterGrenchus, E. J. / Keene, R. A. / Nobs, C. R. et al. | 2004
- 199
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- 199
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Complying with Extended Producer Responsibility Requirements: Business Impacts, Tools and StrategiesMcCracken, J. / Bell, V. et al. | 2004
- 204
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Global mandate, national policies, and local responses: scale conflicts in China's management of imported e-wasteTong, X. et al. | 2004
- 208
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The role of success factors and obstacles in design for environment: a survey among Asian electronics companiesBoks, C. / Pascual, O. et al. | 2004
- 214
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A distributed design methodology for extensible product life cycle strategy [electronic products]Jianzhi Li, / Shrivastava, P. / Zhang, H.C. et al. | 2004
- 214
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A Distributed Design Methodology for Extensible Product Life Cycle StrategyLi, J. / Shrivastava, P. / Zhang, H. C. et al. | 2004
- 220
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- 226
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Used consumer electronics: a comparative analysis of materials recycling technologiesHai-Yong Kang, / Schoenung, J.M. et al. | 2004
- 231
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Investigations on the Metallurgical Use of CRT and LCD GlassSamuelsson, C. / Lehner, T. et al. | 2004
- 231
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Investigations on the metallurgical use of CRT and LCD glass [smelting flux applications]Samuelsson, C. / Lehner, T. et al. | 2004
- 237
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A physical process for recycling and reusing waste printed circuit boardsMou Peng, / Wa Layiding, / Xiang Dong, / Gao Jiangang, / Duan Guanghong, et al. | 2004
- 243
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Eco-efficient implementation of electronic waste policies in practiceHuisman, J. / Stevels, A. et al. | 2004
- 249
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A business-mapping approach to multi-criteria group selection of collection centers and recovery facilitiesPochampally, K.K. / Gupta, S.M. et al. | 2004
- 255
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Environmentally effective policy directions for computersKuehr, R. et al. | 2004
- 258
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The silence of silicon lambs: speaking out health and environmental impacts within Taiwan's Hsinchu Science-based industrial parkShenglin Chang, / Hua-mei Chiu, / Wenling Tu, et al. | 2004
- 264
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Evaluating supply line sustainability and business environmental riskSwarr, T.E. / Cline, H.J. / Soontae Jeong, / Dickinson, D.A. / Caudill, R.J. et al. | 2004
- 270
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Customer perception of buying new but unpacked electronics productsBoks, C. / Galjaard, S. / Huisman, M. / Wever, R. et al. | 2004
- 275
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Bridging the information gap: material tracking and consumer labels to encourage sustainable computingMcCullar, N. / Blackmore, B. / Goh, A. / King, G. / Kowalski, N. / Rau, M. et al. | 2004
- 281
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Development of XML industry standards for information exchange and commerce [electronics recycling industry example]Tucker, J. / Alcorn, W. / Kaplan, K. et al. | 2004
- 281
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Development of XML Industry Standards for Information Exchange and CommerceTucker, J. / Alcorn, W. / Kaplan, K. et al. | 2004
- 287
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New product development challenges of design for environmental compliance and design for electromagnetic complianceArnold, R.R. et al. | 2004
- 292
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Sustainable electrical and electronic plastics recyclingFisher, M. / Kingsbury, T. / Headley, L. et al. | 2004
- 298
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Absence of free, unbound carbon black in printer toners: a California Proposition 65 studyFong, A. / Balstad, E. / Barakat, A. / Brooks, B. et al. | 2004
- 304
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Case Study: Multi Life Cycle CenterKnoth, R. / Brandstotter, M. / Kopacek, B. / Kopacek, P. et al. | 2004
- 304
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Case study: multi life cycle center [waste electric and electronic equipment recycling]Knoth, R. / Brandstotter, M. / Kopacek, B. / Kopacek, P. et al. | 2004
- 309
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GPS and radio tracking of end-of-life products [recycling and waste disposal applications]Lee, J.A. / Thomas, V.M. et al. | 2004
- 309
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GPS and Radio Tracking of End-of-Life ProductsLee, J. A. / Thomas, V. M. et al. | 2004
- 313
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Linking bar codes to recycling information for mobile phonesStutz, M. / Thomas, V.M. / Saar, S. et al. | 2004
- 317
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Data security issues relating to end of life equipmentBennison, P.F. / Lasher, P.J. et al. | 2004
- 321
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Efficient design and effective marketing of a reverse supply chain: a fuzzy logic approachPochampally, K.K. / Gupta, S.M. et al. | 2004
- 327
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Author index| 2004
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Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment Copyright Page| 2004
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Scope and format| 2004
- v
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IEEE International Symposium on Electronics and the Environment Table of Contents| 2004
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Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment (IEEE Cat. No.04CH37511)| 2004