Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical Reactions (Englisch)
- Neue Suche nach: Siau, S.
- Neue Suche nach: Vervaet, A. A.
- Neue Suche nach: Electrochemical Society
- Neue Suche nach: Siau, S.
- Neue Suche nach: Vervaet, A. A.
- Neue Suche nach: Vereecken, P. M.
- Neue Suche nach: Electrochemical Society
In:
Electrochemical deposition onto non-metallic surfaces; patterned substrates, and templates
21
;
123-132
;
2007
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical Reactions
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Beteiligte:
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Kongress:SYMPOSIUM, Electrochemical deposition onto non-metallic surfaces; patterned substrates, and templates ; 2006 ; Cancun, Mexico
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Erschienen in:Electrochemical deposition onto non-metallic surfaces; patterned substrates, and templates , 21 ; 123-132ECS TRANSACTIONS ; 3, 21 ; 123-132
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Verlag:
- Neue Suche nach: Electrochemical Society
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Erscheinungsort:Pennington, N.J.
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Erscheinungsdatum:01.01.2007
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Format / Umfang:10 pages
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Anmerkungen:Includes bibliographical references and index; Held as part of the 210th Meeting of the Electrochemical Society
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical ReactionsSiau, S. / Vervaet, A. A. / Electrochemical Society et al. | 2007
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