Modeling The Effect of Microstructure in BGA Joints (Englisch)
- Neue Suche nach: Holden, S. J.
- Neue Suche nach: Wallach, E. R.
- Neue Suche nach: Holden, S. J.
- Neue Suche nach: Wallach, E. R.
In:
INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING
;
22
, 2
;
80-85
;
1999
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Modeling The Effect of Microstructure in BGA Joints
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Beteiligte:Holden, S. J. ( Autor:in ) / Wallach, E. R. ( Autor:in )
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Erschienen in:INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING ; 22, 2 ; 80-85
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Verlag:
- Neue Suche nach: INTERNATIONAL SOCIETY FOR HYBRID MICROELECTRONICS
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Erscheinungsdatum:01.01.1999
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Format / Umfang:6 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 621.3815
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 621.3815 -
Datenquelle:
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Modeling The Effect of Microstructure in BGA JointsHolden, S. J. / Wallach, E. R. et al. | 1999
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- 99
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Breakdown Verification for Fault Transients in Laminate Microstrip ConductorsJorgenson, J. / Hassoun, M. / Han, H. et al. | 1999
- 99
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- 104
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The Role of Case-Rigidity in Drop-Tolerance of Portable ProductsGoyal, S. / Upasani, S. / Patel, D. et al. | 1999
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Best Paper of ISPS '99 - "The Role of Case-Rigidity in Drop-Tolerance of Portable Products"Goyal, Suresh et al. | 1999
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EditorialElshabini, A. et al. | 1999