Comparison of diffusibility of Cu in the rapid-solidifying Al-Cu solder to that in ordinary Al-Cu solder (Unbekannt)
- Neue Suche nach: Lu, W.-j.
- Neue Suche nach: Wang, Y.-h.
- Neue Suche nach: Yu, W.-y.
- Neue Suche nach: Jin, Y.-f.
- Neue Suche nach: Zhang, J.
- Neue Suche nach: Lu, W.-j.
- Neue Suche nach: Wang, Y.-h.
- Neue Suche nach: Yu, W.-y.
- Neue Suche nach: Jin, Y.-f.
- Neue Suche nach: Zhang, J.
In:
LANZHOU LIGONG DAXUE XUEBAO
;
32
, 2
;
9-13
;
2006
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Comparison of diffusibility of Cu in the rapid-solidifying Al-Cu solder to that in ordinary Al-Cu solder
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Beteiligte:Lu, W.-j. ( Autor:in ) / Wang, Y.-h. ( Autor:in ) / Yu, W.-y. ( Autor:in ) / Jin, Y.-f. ( Autor:in ) / Zhang, J. ( Autor:in )
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Erschienen in:LANZHOU LIGONG DAXUE XUEBAO ; 32, 2 ; 9-13
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Verlag:
- Neue Suche nach: Lanzhou li gong da xue xue bao bian ji bu
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Erscheinungsdatum:01.01.2006
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Format / Umfang:5 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Unbekannt
- Neue Suche nach: 600
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 600 -
Datenquelle:
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