Designing and Modeling for Power Integrity (Englisch)
- Neue Suche nach: Swaminathan, M.
- Neue Suche nach: Chung, D.
- Neue Suche nach: Grivet-Talocia, S.
- Neue Suche nach: Bharath, K.
- Neue Suche nach: Laddha, V.
- Neue Suche nach: Xie, J.
- Neue Suche nach: Swaminathan, M.
- Neue Suche nach: Chung, D.
- Neue Suche nach: Grivet-Talocia, S.
- Neue Suche nach: Bharath, K.
- Neue Suche nach: Laddha, V.
- Neue Suche nach: Xie, J.
In:
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
;
52
, 2
;
288-310
;
2010
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Designing and Modeling for Power Integrity
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Beteiligte:Swaminathan, M. ( Autor:in ) / Chung, D. ( Autor:in ) / Grivet-Talocia, S. ( Autor:in ) / Bharath, K. ( Autor:in ) / Laddha, V. ( Autor:in ) / Xie, J. ( Autor:in )
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Erschienen in:IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY ; 52, 2 ; 288-310
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Verlag:
- Neue Suche nach: IEEE INSTITUTE OF ELECTRICAL AND ELECTRONICS
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Erscheinungsdatum:01.01.2010
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Format / Umfang:23 pages
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ISSN:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 621.3
- Weitere Informationen zu Dewey Decimal Classification
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Klassifikation:
DDC: 621.3 -
Datenquelle:
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Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC| 2010
- 248
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Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel InterconnectsEr-Ping Li, / Xing-Chang Wei, / Cangellaris, Andreas C / En-Xiao Liu, / Yao-Jiang Zhang, / D'Amore, Marcello / Joungho Kim, / Sudo, Toshio et al. | 2010
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Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect TechnologiesDeutsch, Alina / Krabbenhoft, Roger S / Melde, Kathleen L / Surovic, Christopher W / Katopis, George A / Kopcsay, Gerard V / Zhen Zhou, / Zhaoqing Chen, / Kwark, Young H / Winkel, Thomas-Michael et al. | 2010
- 288
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Designing and Modeling for Power IntegritySwaminathan, Madhavan / Daehyun Chung, / Grivet-Talocia, Stefano / Bharath, Krishna / Laddha, Vishal / Jianyong Xie, et al. | 2010
- 311
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Estimation of Power Switching Current by Chip-Package-PCB CosimulationHyun Ho Park, / Seung-Hyun Song, / Sang-Tae Han, / Tae-Sun Jang, / Jin-Hwan Jung, / Hark-Byeong Park, et al. | 2010
- 320
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A Domain Decomposition Approach for Efficient Electromagnetic Analysis of the Power Distribution Network of Packaged Electronic SystemsKollia, Varvara / Cangellaris, Andreas C et al. | 2010
- 332
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Efficient Sensitivity Calculations for Optimization of Power Delivery Network ImpedanceEngin, A Ege et al. | 2010
- 340
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A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow SlotsGuo-Ping Zou, / Er-Ping Li, / Xing-Chang Wei, / Guang-Xiao Luo, / Xiang Cui, et al. | 2010
- 346
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Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG IsolationTzong-Lin Wu, / Hao-Hsiang Chuang, / Ting-Kuang Wang, et al. | 2010
- 357
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Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap StructuresScogna, Antonio Ciccomancini / Orlandi, Antonio / Ricchiuti, Vittorio et al. | 2010
- 365
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Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed SignalsJong Hwa Kwon, / Dong Uk Sim, / Sang Il Kwak, / Jong Gwan Yook, et al. | 2010
- 373
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A Localized Enhanced Power Plane Topology for Wideband Suppression of Simultaneous Switching NoiseHee-do Kang, / Hyun Kim, / Sang-Gyu Kim, / Jong-Gwan Yook, et al. | 2010
- 381
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Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board CoanalysisHao-Hsiang Chuang, / Wei-Da Guo, / Yu-Hsiang Lin, / Hsin-Shu Chen, / Yi-Chang Lu, / Yung-Shou Cheng, / Ming-Zhang Hong, / Chun-Huang Yu, / Wen-Chang Cheng, / Yen-Ping Chou, et al. | 2010
- 392
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Signal Integrity Design for High-Speed Digital Circuits: Progress and DirectionsJun Fan, / Xiaoning Ye, / Jingook Kim, / Archambeault, Bruce / Orlandi, Antonio et al. | 2010
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Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling CapacitorsYao-Jiang Zhang, / Zaw Zaw Oo, / Xing-Chang Wei, / En-Xiao Liu, / Jun Fan, / Er-Ping Li, et al. | 2010
- 410
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Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data TransmissionEakhwan Song, / Jeonghyeon Cho, / Jiseong Kim, / Yujeong Shim, / Gawon Kim, / Joungho Kim, et al. | 2010
- 421
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Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and BoardsNdip, Ivan / Ohnimus, Florian / Löbbicke, Kai / Bierwirth, Micha / Tschoban, Christian / Guttowski, Stephan / Reichl, Herbert / Lang, Klaus-Dieter / Henke, Heino et al. | 2010
- 436
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Analytical Approach for Crosstalk Characterization of Multiconductor Transmission Lines Using Mode Decomposition Technique in the Time DomainSangWook Park, / Fengchao Xiao, / Kami, Yoshio et al. | 2010
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Advanced Models for Signal Integrity and Electromagnetic Compatibility-Oriented Analysis of NanointerconnectsAntonini, Giulio / Orlandi, Antonio / Raimondo, Leo et al. | 2010
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Review of Printed-Circuit-Board Level EMI/EMC Issues and ToolsArchambeault, Bruce / Brench, Colin / Connor, Sam et al. | 2010
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Modeling Electromagnetic Emissions From Printed Circuit Boards in Closed Environments Using Equivalent DipolesXin Tong, / Thomas, David W P / Nothofer, Angela / Sewell, Phillip / Christopoulos, Christos et al. | 2010
- 471
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Geometrically Parameterized Circuit Models of Printed Circuit Board Traces Inclusive of Antenna CouplingTriverio, Piero / Grivet-Talocia, Stefano / Bandinu, Michelangelo / Canavero, Flavio G et al. | 2010
- 479
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Comparison of Radiation Modeling Techniques Up to 10 GHz—Application on a Microstrip PCB TraceRogard, Eric / Azanowsky, Béatrice / Ney, Michel M et al. | 2010
- 487
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A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit BoardsXiaomin Duan, / Rimolo-Donadio, Renato / Brüns, Heinz-Dietrich / Schuster, Christian et al. | 2010
- 496
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Fast Transient Analysis of Next-Generation Interconnects Based on Carbon NanotubesD'Amore, Marcello / Sarto, Maria Sabrina / Tamburrano, Alessio et al. | 2010
- 504
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IEEE Foundation| 2010
- C1
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Table of contents| 2010
- C2
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IEEE Transactions on Electromagnetic Compatibility publication information| 2010
- C3
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IEEE Transactions on Electromagnetic Compatibility information for authors| 2010
- C4
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IEEE Transactions on Electromagnetic Compatibility institutional listings| 2010