Designing and Modeling for Power Integrity (English)
- New search for: Swaminathan, M.
- New search for: Chung, D.
- New search for: Grivet-Talocia, S.
- New search for: Bharath, K.
- New search for: Laddha, V.
- New search for: Xie, J.
- New search for: Swaminathan, M.
- New search for: Chung, D.
- New search for: Grivet-Talocia, S.
- New search for: Bharath, K.
- New search for: Laddha, V.
- New search for: Xie, J.
In:
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
;
52
, 2
;
288-310
;
2010
-
ISSN:
- Article (Journal) / Print
-
Title:Designing and Modeling for Power Integrity
-
Contributors:Swaminathan, M. ( author ) / Chung, D. ( author ) / Grivet-Talocia, S. ( author ) / Bharath, K. ( author ) / Laddha, V. ( author ) / Xie, J. ( author )
-
Published in:IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY ; 52, 2 ; 288-310
-
Publisher:
- New search for: IEEE INSTITUTE OF ELECTRICAL AND ELECTRONICS
-
Publication date:2010-01-01
-
Size:23 pages
-
ISSN:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
- New search for: 621.3
- Further information on Dewey Decimal Classification
-
Classification:
DDC: 621.3 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 52, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 246
-
Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC| 2010
- 248
-
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel InterconnectsEr-Ping Li, / Xing-Chang Wei, / Cangellaris, Andreas C / En-Xiao Liu, / Yao-Jiang Zhang, / D'Amore, Marcello / Joungho Kim, / Sudo, Toshio et al. | 2010
- 266
-
Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect TechnologiesDeutsch, Alina / Krabbenhoft, Roger S / Melde, Kathleen L / Surovic, Christopher W / Katopis, George A / Kopcsay, Gerard V / Zhen Zhou, / Zhaoqing Chen, / Kwark, Young H / Winkel, Thomas-Michael et al. | 2010
- 288
-
Designing and Modeling for Power IntegritySwaminathan, Madhavan / Daehyun Chung, / Grivet-Talocia, Stefano / Bharath, Krishna / Laddha, Vishal / Jianyong Xie, et al. | 2010
- 311
-
Estimation of Power Switching Current by Chip-Package-PCB CosimulationHyun Ho Park, / Seung-Hyun Song, / Sang-Tae Han, / Tae-Sun Jang, / Jin-Hwan Jung, / Hark-Byeong Park, et al. | 2010
- 320
-
A Domain Decomposition Approach for Efficient Electromagnetic Analysis of the Power Distribution Network of Packaged Electronic SystemsKollia, Varvara / Cangellaris, Andreas C et al. | 2010
- 332
-
Efficient Sensitivity Calculations for Optimization of Power Delivery Network ImpedanceEngin, A Ege et al. | 2010
- 340
-
A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow SlotsGuo-Ping Zou, / Er-Ping Li, / Xing-Chang Wei, / Guang-Xiao Luo, / Xiang Cui, et al. | 2010
- 346
-
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG IsolationTzong-Lin Wu, / Hao-Hsiang Chuang, / Ting-Kuang Wang, et al. | 2010
- 357
-
Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap StructuresScogna, Antonio Ciccomancini / Orlandi, Antonio / Ricchiuti, Vittorio et al. | 2010
- 365
-
Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed SignalsJong Hwa Kwon, / Dong Uk Sim, / Sang Il Kwak, / Jong Gwan Yook, et al. | 2010
- 373
-
A Localized Enhanced Power Plane Topology for Wideband Suppression of Simultaneous Switching NoiseHee-do Kang, / Hyun Kim, / Sang-Gyu Kim, / Jong-Gwan Yook, et al. | 2010
- 381
-
Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board CoanalysisHao-Hsiang Chuang, / Wei-Da Guo, / Yu-Hsiang Lin, / Hsin-Shu Chen, / Yi-Chang Lu, / Yung-Shou Cheng, / Ming-Zhang Hong, / Chun-Huang Yu, / Wen-Chang Cheng, / Yen-Ping Chou, et al. | 2010
- 392
-
Signal Integrity Design for High-Speed Digital Circuits: Progress and DirectionsJun Fan, / Xiaoning Ye, / Jingook Kim, / Archambeault, Bruce / Orlandi, Antonio et al. | 2010
- 401
-
Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling CapacitorsYao-Jiang Zhang, / Zaw Zaw Oo, / Xing-Chang Wei, / En-Xiao Liu, / Jun Fan, / Er-Ping Li, et al. | 2010
- 410
-
Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data TransmissionEakhwan Song, / Jeonghyeon Cho, / Jiseong Kim, / Yujeong Shim, / Gawon Kim, / Joungho Kim, et al. | 2010
- 421
-
Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and BoardsNdip, Ivan / Ohnimus, Florian / Löbbicke, Kai / Bierwirth, Micha / Tschoban, Christian / Guttowski, Stephan / Reichl, Herbert / Lang, Klaus-Dieter / Henke, Heino et al. | 2010
- 436
-
Analytical Approach for Crosstalk Characterization of Multiconductor Transmission Lines Using Mode Decomposition Technique in the Time DomainSangWook Park, / Fengchao Xiao, / Kami, Yoshio et al. | 2010
- 447
-
Advanced Models for Signal Integrity and Electromagnetic Compatibility-Oriented Analysis of NanointerconnectsAntonini, Giulio / Orlandi, Antonio / Raimondo, Leo et al. | 2010
- 455
-
Review of Printed-Circuit-Board Level EMI/EMC Issues and ToolsArchambeault, Bruce / Brench, Colin / Connor, Sam et al. | 2010
- 462
-
Modeling Electromagnetic Emissions From Printed Circuit Boards in Closed Environments Using Equivalent DipolesXin Tong, / Thomas, David W P / Nothofer, Angela / Sewell, Phillip / Christopoulos, Christos et al. | 2010
- 471
-
Geometrically Parameterized Circuit Models of Printed Circuit Board Traces Inclusive of Antenna CouplingTriverio, Piero / Grivet-Talocia, Stefano / Bandinu, Michelangelo / Canavero, Flavio G et al. | 2010
- 479
-
Comparison of Radiation Modeling Techniques Up to 10 GHz—Application on a Microstrip PCB TraceRogard, Eric / Azanowsky, Béatrice / Ney, Michel M et al. | 2010
- 487
-
A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit BoardsXiaomin Duan, / Rimolo-Donadio, Renato / Brüns, Heinz-Dietrich / Schuster, Christian et al. | 2010
- 496
-
Fast Transient Analysis of Next-Generation Interconnects Based on Carbon NanotubesD'Amore, Marcello / Sarto, Maria Sabrina / Tamburrano, Alessio et al. | 2010
- 504
-
IEEE Foundation| 2010
- C1
-
Table of contents| 2010
- C2
-
IEEE Transactions on Electromagnetic Compatibility publication information| 2010
- C3
-
IEEE Transactions on Electromagnetic Compatibility information for authors| 2010
- C4
-
IEEE Transactions on Electromagnetic Compatibility institutional listings| 2010