Modeling the bonding behavior of thermoplastic UD-tapes during hot stamp spot welding (Englisch)
Freier Zugriff
- Neue Suche nach: Kobler, Eva
- Neue Suche nach: Birtha, János
- Neue Suche nach: Kapshammer, Andreas
- Neue Suche nach: Laresser, Daniel
- Neue Suche nach: Marschik, Christian
- Neue Suche nach: Straka, Klaus
- Neue Suche nach: Steinbichler, Georg
- Neue Suche nach: Schlecht, Sven
- Neue Suche nach: Kobler, Eva
- Neue Suche nach: Birtha, János
- Neue Suche nach: Kapshammer, Andreas
- Neue Suche nach: Laresser, Daniel
- Neue Suche nach: Marschik, Christian
- Neue Suche nach: Straka, Klaus
- Neue Suche nach: Steinbichler, Georg
- Neue Suche nach: Schlecht, Sven
- Neue Suche nach: Perret, Edith
In:
AIP Conference Proceedings
;
3158
, 1
;
6
;
2024
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Modeling the bonding behavior of thermoplastic UD-tapes during hot stamp spot welding
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Beteiligte:Kobler, Eva ( Autor:in ) / Birtha, János ( Autor:in ) / Kapshammer, Andreas ( Autor:in ) / Laresser, Daniel ( Autor:in ) / Marschik, Christian ( Autor:in ) / Straka, Klaus ( Autor:in ) / Steinbichler, Georg ( Autor:in ) / Schlecht, Sven ( Autor:in ) / Perret, Edith ( Herausgeber:in )
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Erschienen in:AIP Conference Proceedings ; 3158, 1 ; 6
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Verlag:
- Neue Suche nach: AIP Publishing LLC
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Erscheinungsdatum:08.05.2024
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Format / Umfang:6 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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