Thermal comfort analysis for three classrooms in the polish intelligent educational building (Englisch)
- Neue Suche nach: Krawczyk, Natalia
- Neue Suche nach: Dziedzic, Joanna
- Neue Suche nach: Dębska, Luiza
- Neue Suche nach: Krawczyk, Natalia
- Neue Suche nach: Dziedzic, Joanna
- Neue Suche nach: Dębska, Luiza
- Neue Suche nach: Kee, Chan Mieow
- Neue Suche nach: Rajamanickam, Leelavathi
- Neue Suche nach: Chin, Wang Chan
- Neue Suche nach: Chai, Tan Yong
- Neue Suche nach: Janasekaran, Shamini
- Neue Suche nach: Salleh, Salmaliza
- Neue Suche nach: Wei, Lim Mee
- Neue Suche nach: Salleh, Muhammad Zulhaziman Mat
- Neue Suche nach: Ramli, Nurulazlina
- Neue Suche nach: Chun, Ho Kah
- Neue Suche nach: Parthasarathy, Rajamohan
In:
AIP Conference Proceedings
;
2847
, 1
;
6
;
2023
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Thermal comfort analysis for three classrooms in the polish intelligent educational building
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Beteiligte:Krawczyk, Natalia ( Autor:in ) / Dziedzic, Joanna ( Autor:in ) / Dębska, Luiza ( Autor:in ) / Kee, Chan Mieow ( Herausgeber:in ) / Rajamanickam, Leelavathi ( Herausgeber:in ) / Chin, Wang Chan ( Herausgeber:in ) / Chai, Tan Yong ( Herausgeber:in ) / Janasekaran, Shamini ( Herausgeber:in ) / Salleh, Salmaliza ( Herausgeber:in ) / Wei, Lim Mee ( Herausgeber:in )
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Erschienen in:AIP Conference Proceedings ; 2847, 1 ; 6
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Verlag:
- Neue Suche nach: AIP Publishing LLC
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Erscheinungsdatum:27.11.2023
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Format / Umfang:6 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 2847, Ausgabe 1
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