Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate (Englisch)
- Neue Suche nach: Bang, Junghwan
- Neue Suche nach: Yu, Dong-Yurl
- Neue Suche nach: Ko, Yong-Ho
- Neue Suche nach: Son, Jun-Hyuk
- Neue Suche nach: Nishikawa, Hiroshi
- Neue Suche nach: Lee, Chang-Woo
- Neue Suche nach: Bang, Junghwan
- Neue Suche nach: Yu, Dong-Yurl
- Neue Suche nach: Ko, Yong-Ho
- Neue Suche nach: Son, Jun-Hyuk
- Neue Suche nach: Nishikawa, Hiroshi
- Neue Suche nach: Lee, Chang-Woo
In:
Microelectronics and Reliability
;
99
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62-73
;
2019
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
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Beteiligte:Bang, Junghwan ( Autor:in ) / Yu, Dong-Yurl ( Autor:in ) / Ko, Yong-Ho ( Autor:in ) / Son, Jun-Hyuk ( Autor:in ) / Nishikawa, Hiroshi ( Autor:in ) / Lee, Chang-Woo ( Autor:in )
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Erschienen in:Microelectronics and Reliability ; 99 ; 62-73
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Verlag:
- Neue Suche nach: Elsevier Ltd
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Erscheinungsdatum:28.05.2019
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Format / Umfang:12 pages
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 99
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