Mg2Si-based thermoelectric compounds with enhanced fracture toughness by introduction of dual nanoinclusions (Englisch)
- Neue Suche nach: Kim, Gwansik
- Neue Suche nach: Rim, Hyun Jun
- Neue Suche nach: Lee, Hwijong
- Neue Suche nach: Kim, Jeongmin
- Neue Suche nach: Roh, Jong Wook
- Neue Suche nach: Lee, Kyu Hyoung
- Weitere Informationen zu Lee, Kyu Hyoung:
- https://orcid.org/0000-0001-6843-6706
- Neue Suche nach: Lee, Wooyoung
- Weitere Informationen zu Lee, Wooyoung:
- https://orcid.org/0000-0001-8406-4324
- Neue Suche nach: Kim, Gwansik
- Neue Suche nach: Rim, Hyun Jun
- Neue Suche nach: Lee, Hwijong
- Neue Suche nach: Kim, Jeongmin
- Neue Suche nach: Roh, Jong Wook
- Neue Suche nach: Lee, Kyu Hyoung
- Neue Suche nach: Lee, Wooyoung
In:
Journal of Alloys and Compounds
;
801
;
234-238
;
2019
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Mg2Si-based thermoelectric compounds with enhanced fracture toughness by introduction of dual nanoinclusions
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Beteiligte:Kim, Gwansik ( Autor:in ) / Rim, Hyun Jun ( Autor:in ) / Lee, Hwijong ( Autor:in ) / Kim, Jeongmin ( Autor:in ) / Roh, Jong Wook ( Autor:in ) / Lee, Kyu Hyoung ( Autor:in ) / Lee, Wooyoung ( Autor:in )
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Erschienen in:Journal of Alloys and Compounds ; 801 ; 234-238
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Verlag:
- Neue Suche nach: Elsevier B.V.
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Erscheinungsdatum:06.06.2019
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Format / Umfang:5 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 801
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Editorial Board| 2019