Junction temperature estimation method for a 600V, 30A IGBT module during converter operation (Englisch)
- Neue Suche nach: Choi, U.M.
- Neue Suche nach: Blaabjerg, F.
- Neue Suche nach: Iannuzzo, F.
- Neue Suche nach: Jørgensen, S.
- Neue Suche nach: Choi, U.M.
- Neue Suche nach: Blaabjerg, F.
- Neue Suche nach: Iannuzzo, F.
- Neue Suche nach: Jørgensen, S.
In:
Microelectronics and Reliability
;
55
, 9-10
;
2022-2026
;
2015
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Junction temperature estimation method for a 600V, 30A IGBT module during converter operation
-
Beteiligte:Choi, U.M. ( Autor:in ) / Blaabjerg, F. ( Autor:in ) / Iannuzzo, F. ( Autor:in ) / Jørgensen, S. ( Autor:in )
-
Erschienen in:Microelectronics and Reliability ; 55, 9-10 ; 2022-2026
-
Verlag:
- Neue Suche nach: Elsevier Ltd
-
Erscheinungsdatum:23.06.2015
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Format / Umfang:5 pages
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ISSN:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Elektronische Ressource
-
Sprache:Englisch
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Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis – Band 55, Ausgabe 9-10
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Study on specific effects of high frequency ripple currents and temperature on supercapacitors ageingGerman, R. / Sari, A. / Venet, P. / Briat, O. / Vinassa, J.-M. et al. | 2015
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Numerical analysis and experimental tests for solder joints power cycling optimizationCova, P. / Delmonte, N. / Chiozzi, D. et al. | 2015
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Thermomechanical modeling and simulation of a silicone gel for power electronic devicesHaussener, M. / Caihol, S. / Trajin, B. / Vidal, P.E. / Carrillo, F. et al. | 2015
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Analysis and modeling of passive device degradation for a long-term electromagnetic emission study of a DC–DC converterHuang, H. / Boyer, A. / Ben Dhia, S. et al. | 2015
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Exploring the use of approximate TMR to mask transient faults in logic with low area overheadGomes, Iuri A.C. / Martins, Mayler G.A. / Reis, André I. / Kastensmidt, Fernanda Lima et al. | 2015
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