Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition (Englisch)
- Neue Suche nach: Luo, Z.-B.
- Neue Suche nach: Zhao, J.
- Neue Suche nach: Gao, Y.-J.
- Neue Suche nach: Wang, L.
- Neue Suche nach: Luo, Z.-B.
- Neue Suche nach: Zhao, J.
- Neue Suche nach: Gao, Y.-J.
- Neue Suche nach: Wang, L.
In:
Journal of Alloys and Compounds
;
500
, 1
;
39-45
;
2010
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition
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Beteiligte:
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Erschienen in:Journal of Alloys and Compounds ; 500, 1 ; 39-45
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Verlag:
- Neue Suche nach: Elsevier B.V.
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Erscheinungsdatum:25.03.2010
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Format / Umfang:7 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 500, Ausgabe 1
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