Deposition behavior of thermally softened copper particles in cold spraying (Englisch)
- Neue Suche nach: Yin, Shuo
- Neue Suche nach: Wang, Xiaofang
- Neue Suche nach: Suo, Xinkun
- Neue Suche nach: Liao, Hanlin
- Neue Suche nach: Guo, Zhiwei
- Neue Suche nach: Li, Wenya
- Neue Suche nach: Coddet, Christian
- Neue Suche nach: Yin, Shuo
- Neue Suche nach: Wang, Xiaofang
- Neue Suche nach: Suo, Xinkun
- Neue Suche nach: Liao, Hanlin
- Neue Suche nach: Guo, Zhiwei
- Neue Suche nach: Li, Wenya
- Neue Suche nach: Coddet, Christian
In:
Acta Materialia
;
61
, 14
;
5105-5118
;
2013
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Deposition behavior of thermally softened copper particles in cold spraying
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Beteiligte:Yin, Shuo ( Autor:in ) / Wang, Xiaofang ( Autor:in ) / Suo, Xinkun ( Autor:in ) / Liao, Hanlin ( Autor:in ) / Guo, Zhiwei ( Autor:in ) / Li, Wenya ( Autor:in ) / Coddet, Christian ( Autor:in )
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Erschienen in:Acta Materialia ; 61, 14 ; 5105-5118
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Verlag:
- Neue Suche nach: Acta Materialia Inc.
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Erscheinungsdatum:16.04.2013
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Format / Umfang:14 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 61, Ausgabe 14
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- iii
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Editors for Acta Materialia| 2013