The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure (Englisch)
- Neue Suche nach: Yan, Tingnan
- Neue Suche nach: Zhang, Weijun
- Neue Suche nach: Chen, Xingyu
- Neue Suche nach: Wang, Fenglin
- Neue Suche nach: Liu, Zhuofeng
- Neue Suche nach: Yan, Tingnan
- Neue Suche nach: Zhang, Weijun
- Neue Suche nach: Chen, Xingyu
- Neue Suche nach: Wang, Fenglin
- Neue Suche nach: Liu, Zhuofeng
In:
Microelectronics and Reliability
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117
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2020
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure
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Beteiligte:Yan, Tingnan ( Autor:in ) / Zhang, Weijun ( Autor:in ) / Chen, Xingyu ( Autor:in ) / Wang, Fenglin ( Autor:in ) / Liu, Zhuofeng ( Autor:in )
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Erschienen in:
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Erscheinungsdatum:18.10.2020
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 117
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