Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface (Englisch)
- Neue Suche nach: Hagio, Takeshi
- Weitere Informationen zu Hagio, Takeshi:
- https://orcid.org/0000-0002-7434-0150
- Neue Suche nach: Park, Jae-Hyeok
- Weitere Informationen zu Park, Jae-Hyeok:
- https://orcid.org/0000-0002-6798-8493
- Neue Suche nach: Naruse, Yuto
- Neue Suche nach: Goto, Yasuki
- Neue Suche nach: Kamimoto, Yuki
- Neue Suche nach: Ichino, Ryoichi
- Neue Suche nach: Bessho, Takeshi
- Neue Suche nach: Hagio, Takeshi
- Neue Suche nach: Park, Jae-Hyeok
- Neue Suche nach: Naruse, Yuto
- Neue Suche nach: Goto, Yasuki
- Neue Suche nach: Kamimoto, Yuki
- Neue Suche nach: Ichino, Ryoichi
- Neue Suche nach: Bessho, Takeshi
In:
Surface and Coatings Technology
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403
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2020
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface
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Beteiligte:Hagio, Takeshi ( Autor:in ) / Park, Jae-Hyeok ( Autor:in ) / Naruse, Yuto ( Autor:in ) / Goto, Yasuki ( Autor:in ) / Kamimoto, Yuki ( Autor:in ) / Ichino, Ryoichi ( Autor:in ) / Bessho, Takeshi ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: Elsevier B.V.
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Erscheinungsdatum:19.08.2020
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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