Diffusion bonding of commercially pure Ni using Cu interlayer (Englisch)
- Neue Suche nach: Rahman, A.H.M.E.
- Neue Suche nach: Cavalli, M.N.
- Neue Suche nach: Rahman, A.H.M.E.
- Neue Suche nach: Cavalli, M.N.
In:
Materials Characterization
;
69
;
90-96
;
2012
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Diffusion bonding of commercially pure Ni using Cu interlayer
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Beteiligte:Rahman, A.H.M.E. ( Autor:in ) / Cavalli, M.N. ( Autor:in )
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Erschienen in:Materials Characterization ; 69 ; 90-96
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Verlag:
- Neue Suche nach: Elsevier Inc.
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Erscheinungsdatum:12.04.2012
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Format / Umfang:7 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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