High-density interconnects for electronic packaging (Englisch)
C W EICHELBERGER, R J WOJNAROWSKI, R O CARLSON, L M LEVINSON (GE Corporate Res. & Dev., Schenectady, NY, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877, pp. 90–91 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:High-density interconnects for electronic packaging
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Untertitel:C W EICHELBERGER, R J WOJNAROWSKI, R O CARLSON, L M LEVINSON (GE Corporate Res. & Dev., Schenectady, NY, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877, pp. 90–91 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)
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Verlag:
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Erscheinungsdatum:01.01.1989
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Format / Umfang:1 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 20, Ausgabe 3
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Human contamination as a source of IC failuresBrenman, M. / Mejerovich, J. et al. | 1989
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Characterisation of large area devices by an improved constant capacitance voltage transient technique| 1989
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High performance cooling systems for advanced semiconductor equipment| 1989
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Optical-beam-induced current measurements in semiconductor devices| 1989
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Protection of thyristors against overvoltage with breakover diodes| 1989
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Platinum wire wedge bonding: a new IC and microsensor interconnect| 1989
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Impact of residue on Al/Si pads on gold bonding| 1989
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High reliability silver paste for die bonding| 1989
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New film-type die attach adhesives| 1989
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The development of new copper ball bonding-wire| 1989
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Japanese hybrid microcircuit manufacturers face a tough road ahead| 1989
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High-density interconnects for electronic packaging| 1989
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Thermosonic gold-wire bonding to precious-metal-free copper lead-frames| 1989
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Physical properties of ceramic-glass-copper micro-interconnect systems for VLSI/VHSIC packaging applications| 1989
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Editorial| 1989