A review on copper alloys with high strength and high electrical conductivity (Englisch)
- Neue Suche nach: Mao, Qingzhong
- Neue Suche nach: Liu, Yanfang
- Neue Suche nach: Zhao, Yonghao
- Neue Suche nach: Mao, Qingzhong
- Neue Suche nach: Liu, Yanfang
- Neue Suche nach: Zhao, Yonghao
In:
Journal of Alloys and Compounds
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990
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2024
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:A review on copper alloys with high strength and high electrical conductivity
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: Elsevier B.V.
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Erscheinungsdatum:07.04.2024
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:HSHC , high strength and high conductivity , GB , grain boundary , IACS , international annealed copper standard , CG , coarse grain , YS , yield strength , UTS , ultimate tensile strength , ECC , elastic conductive copper , HCP , hexagonal close packed , FCC , face-centered cubic , HAGB , high angle grain boundary , LAGB , low angle grain boundary , NG , nanocrystalline , BCC , body-centered cubic , SPD , severe plastic deformation , ECAP , equal channel angular pressing , HPT , high pressure torsion , TB , twinning boundary , SFE , stacking fault energy , DPD , dynamic plastic deformation , MDDM , macrodirectional design of microstructure , RS , rotary swaging , UFG , ultra-fine grained , EBSD , electron backscatter diffraction , IPF , inverse pole figure , CNT , carbon nanotube , Gr , graphene , ARB , accumulative roll-bonding , IO , internal oxidation , BM , ball milling , IRS , in-situ reactive synthesis , GNP , graphene nanoplatelet , SPS , spark plasma sintering , SFP , stacking fault probability , G.P. , Guinier Preston , LNT , liquid nitrogen temperature , RTR , room temperature rolling , CR , cryogenic rolling , CARB , cross accumulative roll bonding , DFT , density functional theory , MLDS , machine learning design system , C2P , composition→performance , P2C , performance→composition , BPNN , back-propagation neural network , Copper and copper alloy , Strength , Conductivity , Microstructure , Trade-off
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Datenquelle:
Inhaltsverzeichnis – Band 990
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