Thermal degradation of joined thick Au and Al elements (Englisch)
- Neue Suche nach: Bochenek, A.
- Neue Suche nach: Bober, B.
- Neue Suche nach: Hauffe, W.
- Neue Suche nach: Lukaszewicz, M.
- Neue Suche nach: Langer, E.
- Neue Suche nach: Bochenek, A.
- Neue Suche nach: Bober, B.
- Neue Suche nach: Hauffe, W.
- Neue Suche nach: Lukaszewicz, M.
- Neue Suche nach: Langer, E.
In:
Microelectronics International
;
21
, 1
;
31-34
;
2004
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Thermal degradation of joined thick Au and Al elements
-
Beteiligte:Bochenek, A. ( Autor:in ) / Bober, B. ( Autor:in ) / Hauffe, W. ( Autor:in ) / Lukaszewicz, M. ( Autor:in ) / Langer, E. ( Autor:in )
-
Erschienen in:Microelectronics International ; 21, 1 ; 31-34
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Verlag:
- Neue Suche nach: Emerald Group Publishing Limited
-
Erscheinungsdatum:01.04.2004
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Format / Umfang:4 pages
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
-
Sprache:Englisch
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Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis – Band 21, Ausgabe 1
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