Fatigue crack growth behaviour of lead-containing and lead-free solders (Englisch)
- Neue Suche nach: Mutoh, Y.
- Neue Suche nach: Zhao, J.
- Neue Suche nach: Miyashita, Y.
- Neue Suche nach: Kanchanomai, C.
- Neue Suche nach: Mutoh, Y.
- Neue Suche nach: Zhao, J.
- Neue Suche nach: Miyashita, Y.
- Neue Suche nach: Kanchanomai, C.
In:
Soldering & Surface Mount Technology
;
14
, 3
;
37-45
;
2002
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Fatigue crack growth behaviour of lead-containing and lead-free solders
-
Beteiligte:Mutoh, Y. ( Autor:in ) / Zhao, J. ( Autor:in ) / Miyashita, Y. ( Autor:in ) / Kanchanomai, C. ( Autor:in )
-
Erschienen in:Soldering & Surface Mount Technology ; 14, 3 ; 37-45
-
Verlag:
- Neue Suche nach: MCB UP Ltd
-
Erscheinungsdatum:01.12.2002
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Format / Umfang:9 pages
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
-
Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 14, Ausgabe 3
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Fatigue crack growth behaviour of lead-containing and lead-free soldersMutoh, Y. / Zhao, J. / Miyashita, Y. / Kanchanomai, C. et al. | 2002
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