Flip-chip assembly development via modified reflowable underfill process (Englisch)
- Neue Suche nach: Ping Miao,
- Neue Suche nach: Yixin Chew,
- Neue Suche nach: Tie Wang,
- Neue Suche nach: Foo, L.
- Neue Suche nach: Ping Miao,
- Neue Suche nach: Yixin Chew,
- Neue Suche nach: Tie Wang,
- Neue Suche nach: Foo, L.
In:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
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174-180
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2001
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Flip-chip assembly development via modified reflowable underfill process
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2001
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Format / Umfang:1180374 byte
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ISBN:
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ISSN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)| 2001
- 1
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Improved VCSEL structures for 10 gigabit-Ethernet and next generation optical-integrated PC-boardsMederer, F. / Jager, R. / Joos, J. / Kicherer, M. / King, R. / Michalzik, R. / Riedl, M. / Unold, H. / Ebeling, K.J. / Lehmacher, S. et al. | 2001
- 8
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Highly alignment tolerant InGaAs inverted MSM photodetector heterogeneously integrated on a differential Si CMOS receiver operating at 1 GbpsVrazel, M. / Jae Joon Chang, / In-Dal Song, / KeeShik Chung, / Brooke, M. / Jokerst, N.M. / Brown, A. / Wills, D.S. et al. | 2001
- 14
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3.125 Gbps/channel 4-channel parallel optical transmitter and receiver module with MT-RJ receptacleYoneda, I. / Yamauchi, K. / Yunoki, S. / Matsumoto, K. / Nakamura, T. / Miyoshi, K. / Nagahori, T. et al. | 2001
- 20
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Passively aligned fiber-optic transmitter integrated into LTCC moduleKarppinen, M. / Kautio, K. / Heikkinen, M. / Hakkila, J. / Karioja, P. / Jouhti, T. / Tervonen, A. / Oksanen, M. et al. | 2001
- 26
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Low cost CWDM optical transceiversGrann, E.B. et al. | 2001
- 30
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Short wave SFF small form factor transceiversAbe, S. / Tobita, K. / Shinozaki, T. / Arai, K. / Takeshita, K. / Tanaka, K. / Isono, Y. et al. | 2001
- 35
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Encapsulated double-bump WL-CSP: design and reliabilityKeser, B. / Yeung, B. / White, J. / Fang, T. et al. | 2001
- 40
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Development of low-cost and highly reliable wafer process packageKazama, A. / Satoh, T. / Yamaguchi, Y. / Anjoh, I. / Nishimura, A. et al. | 2001
- 47
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A design and manufacturing solution for high-reliable, non-leaded CSPs like QFNKuhnlein, G. et al. | 2001
- 54
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Wide Area Vertical Expansion (WAVE™) Package Design for High Speed Application: Reliability and PerformanceKim, Y.-G. / Mohammed, I. / Seol, B.-S. / Kang, T.-G. / Institute of Electrical and Electronics Engineers et al. | 2001
- 54
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Wide area vertical expansion (WAVE/sup TM/) package design for high speed application: reliability and performanceYoung-Gon Kim, / Mohammed, I. / Byong-Su Seol, / Teck-Gyu Kang, et al. | 2001
- 63
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Development of low cost, highly reliable CSP using gold-gold interconnection technologyIsozaki, S. / Kimura, T. / Shimada, T. / Nakajima, H. et al. | 2001
- 69
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A novel low-cost pluggable chip scale package for high pin-count applicationsCrane, S.W. / Jeon, J. / Ogata, C. / Wang, T. / Cangellaris, A. / Schutt-Aine, J. et al. | 2001
- 74
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Moisture blocking planes and their effect on reflow performance in achieving reliable Pb-free assembly capability for PBGAsShook, R.L. / Gerlach, D.L. / Vaccaro, B.T. et al. | 2001
- 80
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Whole field displacement measurement technique using speckle interferometryCote, K.J. / Dadkhah, M.S. et al. | 2001
- 85
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Effect of underfill on BGA reliabilityPyland, J. / Raghuram Pucha, / Suresh Sitaraman, et al. | 2001
- 91
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An accelerated reliability test method to predict thermal grease pump-out in flip-chip applicationsChia-Pin Chiu, / Biju Chandran, / Mello, K. / Kelley, K. et al. | 2001
- 98
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Mechanism and growth rate of underfill delaminations in flip chipsJakschik, S. / Feustel, F. / Meusel, E. et al. | 2001
- 104
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Impact of JEDEC test conditions on new-generation package reliabilityMercado, L.L. / Chavez, B. et al. | 2001
- 111
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Optimizing the package design with electrical modeling and simulationQuan Qi, / Quint, D. / Frank, M. / Michalka, T. / Bois, K. et al. | 2001
- 118
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Package capacitors impact on microprocessor maximum operating frequencyWaizman, A. / Chee-Yee Chung, et al. | 2001
- 123
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Design and packaging challenges for on-board cache subsystems using source synchronous 400 Mb/s interfacesNam Pham, / Cases, M. / Guertin, D. et al. | 2001
- 128
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Microwave frequency model of wafer level package and increased loading effect on Rambus memory moduleJunwoo Lee, / Baekkyu Choi, / Seungyoung Ahn, / Woonghwan Ryu, / Jae Myun Kim, / Kwang Seong Choi, / Joon-Ki Hong, / Heung-Sup Chun, / Joungho Kim, et al. | 2001
- 133
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Over GHz low-power RF clock distribution for a multiprocessor digital systemWoonghwan Ryu, / Albert Lu Chee Wai, / Fan Wei, / Wai Lai Lai, / Joungho Kim, et al. | 2001
- 141
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Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualificationArun Chandrasekhar, / Vandevelde, B. / Driessens, E. / Pieters, P. / Beyne, E. / De Raedt, W. / Nauwelaers, B. / Van Puymbroeck, J. et al. | 2001
- 149
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Study on mobility of water and polymer chain in epoxy for microelectronic applicationsShijian Luo, / Leisen, J. / Wong, C.P. et al. | 2001
- 155
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Influence of temperature and humidity on adhesion of underfills for flip chip packagingShijian Luo, / Wong, C.P. et al. | 2001
- 163
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Viscosity of a no-flow underfill during reflow and its relationship to solder wettingMorganelli, P. / Wheelock, B. et al. | 2001
- 167
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Study on the effect of toughening of no-flow underfill on fillet crackingKyoung-Sik Moon, / Lianhua Fan, / Wong, C.P. et al. | 2001
- 174
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Flip-chip assembly development via modified reflowable underfill processPing Miao, / Yixin Chew, / Tie Wang, / Foo, L. et al. | 2001
- 181
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Critical aspects of reworkable underfills for portable consumer productsHannan, N. / Puligandla Viswanadham, et al. | 2001
- 188
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Low cost high-speed flip chip assembly processingGutentag, C. / Dudderar, T.D. et al. | 2001
- 193
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Consideration of mechanical chip crack on FBGA packagesKiyono, S.S. / Yonehara, K. / Graf, R.S. / Howell, W.J. et al. | 2001
- 198
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Breakthrough ball attach technology by introducing solder paste screen printingChin, Y.T. / Khor, C.K. / Sow, H.P. / Ooi, S.J. / Tan, H.B. et al. | 2001
- 203
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Improvements and alternatives for ultra fine pitch encapsulationPaquet, M.-C. / Tremblay, A. / Ouimet, S. / Tetreault, R. / Toutant, R. et al. | 2001
- 210
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Femtosecond micromachining applications for electro-optic componentsLeong, K.H. / Said, A.A. / Maynard, R.L. et al. | 2001
- 215
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Unified system for manufacturing process control and data collectionBentlage, M. / Hamilton, B. / Neuberger, R. et al. | 2001
- 218
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Novel monolithic VCSEL devices for datacom applicationsSteinle, G. / Wolf, H.D. / Popp, M. / Egorov, A.Yu. / Kristen, G. / Riechert, H. et al. | 2001
- 223
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Optical solder effects of self-written waveguides in optical circuit devices couplingHirose, N. / Yoshimura, T. / Ibaragi, O. et al. | 2001
- 229
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Lithographically fabricated fiber guides for optical subassembliesCohen, M.S. / Cordes, M.J. / Cordes, S.A. / Gelorme, J.D. / Kuchta, D.M. / Lacey, D.L. / Rosner, J. / Speidell, J.L. et al. | 2001
- 238
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A silicon optical bench approach to low cost high speed transceiversGoodrich, J. et al. | 2001
- 242
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Analysis and measures against heat-expansion for sub-micron LD assembly by passive alignmentYamauchi, A. / Arai, Y. et al. | 2001
- 247
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Monte Carlo tolerance analysis of a passively aligned silicon waferboard packageBreedis, J.B. et al. | 2001
- 255
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Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracySyed, A. et al. | 2001
- 264
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On the effect of system constraints on mechanical integrity of high density packages used in telecommunication applicationsLangari, A.R. / Morris, W.L. / Kuhlman, M. / Hashemi, H.S. / Dadkhah, M.S. et al. | 2001
- 270
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Design method for high reliable flip chip BGA packageSaito, N. / Yamada, O. / Ono, T. / Uda, T. et al. | 2001
- 276
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Reliability study of high-pin-count flip-chip BGAYuan Li, / Xie, J. / Verma, T. / Wang, V. et al. | 2001
- 281
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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization methodVandevelde, B. / Beyne, E. / Zhang, K. / Caers, J. et al. | 2001
- 288
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Characterization of molded underfill material for flip chip ball grid array packagesLiu, F. / Wang, Y.P. / Chai, K. / Her, T.D. et al. | 2001
- 288
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The Characterization of Molded Underfill Material for Flip Chip Ball Grid Array PackagesLui, F. / Wang, Y. P. / Chai, K. T. / Her, T. D. / Institute of Electrical and Electronics Engineers et al. | 2001
- 293
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On the performance of epoxy molding compounds for flip chip transfer molding encapsulationRector, L.P. / Shaoqin Gong, / Gaffney, K. et al. | 2001
- 298
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Development of new no-flow underfill materials for both eutectic solder and a high temperature melting lead-free solderHaiying Li, / Wong, C.P. et al. | 2001
- 304
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Evaluation of commercially available, thick, photosensitive films as a stress compensation layer for wafer level packagingKeser, B. / Prack, E.R. / Fang, T. et al. | 2001
- 310
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A novel approach for incorporating silica filler into no-flow underfillZhuqing Zhang, / Jicun Lu, / Wong, C.P. et al. | 2001
- 317
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New developments in single pass reflow encapsulant for flip chip applicationLiu, J. / Kraszewski, R. / Xin Lin, / Wong, L. / Goh, S.H. / Allen, J. et al. | 2001
- 323
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RF micromechanical switches that can be post processed on commercial MMICsSloan, L.R. / Sullivan, C.T. / Tigges, C.P. / Sandoval, C.E. / Palmer, D.W. / Hietala, S. / Christenson, T.R. / Dyck, C.W. / Plut, T.A. / Schuster, G.R. et al. | 2001
- 327
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Modeling and design of RF MEMS structures using computationally efficient numerical techniquesBushyager, N.A. / Tentzeris, M.M. et al. | 2001
- 331
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mm-wave microstrip and novel slot antennas on low cost large area panel MCM-D substrates-a feasibility and performance studyGrzyb, J. / Cottet, D. / Troster, G. et al. | 2001
- 339
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Simultaneous switching noise suppression for high speed systems using embedded decouplingHobbs, J.M. / Windlass, H. / Sundaram, V. / Sungjun Chun, / White, G.E. / Swaminathan, M. / Tummala, R.R. et al. | 2001
- 344
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Distributed Models for Multi-Terminal CapacitorsLi, Y.-L. / Elzinga, M. / Yahyaei-Moayyed, F. / Institute of Electrical and Electronics Engineers et al. | 2001
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Modeling and evaluating leadframe CSPs for RFICs in wireless applicationsHorng, T.S. / Wu, S.M. / Huang, H.H. / Chiu, C.T. / Hung, C.P. et al. | 2001
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Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulationTomita, Y. / Morifuji, T. / Ando, T. / Tago, M. / Kajiwara, R. / Nemoto, Y. / Fujii, T. / Kitayama, Y. / Takahashi, K. et al. | 2001
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Stacked thin dice packagingPienimaa, S.K. / Valtanen, J. / Heikkila, R. / Ristolainen, E. et al. | 2001
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A Wide Area Vertical Expansion (WAVETM) packaging process developmentLi, Delin / Light, D. / Castillo, D. / Beroz, M. / Nguyen, M. / Wang, T. et al. | 2001
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A Wide Area Vertical Expansion (WAVE™) Packaging Process DevelopmentLi, D. / Light, D. / Castillo, D. / Beroz, M. / Nguyen, M. / Wang, T. / Institute of Electrical and Electronics Engineers et al. | 2001
- 367
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A Wide Area Vertical Expansion (WAVE/sup TM/) packaging process developmentDelin Li, / Light, D. / Castillo, D. / Beroz, M. / Nguyen, M. / Wang, T. et al. | 2001
- 372
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Solder wetting in a wafer-level flip chip assemblyJicun Lu, / Busch, S.C. / Baldwin, D.F. et al. | 2001
- 378
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Design and thermo-mechanical analysis of a Dimple-Array Interconnect technique for power semiconductor devicesWen, S.S. / Huff, D. / Guo-Quan Lu, et al. | 2001
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Room-temperature interconnection of electroplated Au microbump by means of surface activated bonding methodMatsuzawa, Y. / Itoh, T. / Suga, T. et al. | 2001
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Electronics packaging education: NSF and IEEE initiatives and modulesWesling, P. et al. | 2001
- 388
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Electronics Packaging Education: NSF and IEEE Initiatives, ModulesWesling, P. / Institute of Electrical and Electronics Engineers et al. | 2001
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Using an electromagnetic simulation tool for a course on electronics packagingKroger, H. et al. | 2001
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A web-based graduate course on the Mechanical Design of High Temperature and High Power ElectronicsMcCluskey, P. et al. | 2001
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Electronics packaging-a graduate course for Rutgers University School of Electrical and Computer EngineeringCaggiano, M.F. et al. | 2001
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A hands-on multi-disciplinary product development course for micro systems packaging education at Georgia TechBhattacharya, S.K. / Hobbs, J.M. / Varadarajan, M. / Sanchez, O. / Tummala, R.R. / May, G.S. et al. | 2001
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Modeling and 3D visualization of laser material processingIllyefalvi-Vitez, Z. / Gordon, P. et al. | 2001
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MEMS technology in optical layer networksWalker, J.A. et al. | 2001
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MEMS technology-micromachines enabling the "all optical network"Robinson, S.D. et al. | 2001
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Automated opto-electronic packaging for 10 Gb/s applicationsVerdiell, J.-M. / Webjorn, J. / Kohler, R. / Epitaux, M. / Finot, M. / Kirkpatrick, P. / Lake, R. / Colin, S. / Mader, T. / Bennett, J. et al. | 2001
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SOA-based optical network componentsRenaud, M. / Keller, D. / Sahri, N. / Silvestre, S. / Prieto, D. / Dorgeuille, F. / Pommereau, F. / Emery, J.Y. / Grard, E. / Mayer, H.P. et al. | 2001
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Packaging of optical Fibre Bragg GratingsPsaila, D.C. / Inglis, H.G. et al. | 2001
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Optical components and their role in optical networksLebby, M. et al. | 2001
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Interfacial reaction studies on lead (Pb)-free solder alloysKang, S.K. / Shih, D.Y. / Fogel, K. / Lauro, P. / Yim, M.J. / Advocate, G. / Griffin, M. / Goldsmith, C. / Henderson, D.W. / Gosselin, T. et al. | 2001
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Characterization of lead-free solders and under bump metallurgies for flip-chip packageJong-Kai Lin, / De Silva, A. / Frear, D. / Yifan Guo, / Jin-Wook Jang, / Li Li, / Mitchell, D. / Yeung, B. / Zhang, C. et al. | 2001
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Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgiesZhang, C. / Jong-Kai Lin, / Li Li, et al. | 2001
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Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formationSalam, B. / Ekere, N.N. / Rajkumar, D. et al. | 2001
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Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packagesKa Yau Lee, / Ming Li, / Olsen, D.R. / Chen, W.T. / Tan, B.T.C. / Mhaisalkar, S. et al. | 2001
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Fluxless Sn-Bi-Au bonding process using multilayer designChoe, S. / Chuang, R. / Lee, C.C. et al. | 2001
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Full wave analysis of planar interconnect structures using FDTD-SPICEOrhanovic, N. / Raghuram, R. / Matsui, N. et al. | 2001
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Closed-form representations for triangle impulse responses associated with single and coupled lossy transmission linesTingdong Zhou, / Dvorak, S.L. / Prince, J.L. et al. | 2001
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Exploration of a new, efficient approach to modeling and simulation of interconnectsBing Zhong, / Dvorak, S.L. / Prince, J.L. et al. | 2001
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Radiative coupling in BGA packaging for mixed-signal and high-speed digitalWoods, W. / Diaz-Alvarez, E. / Krusius, J.P. et al. | 2001
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Synthesis of SPICE-compatible broadband electrical models for pins and viasPinello, W. / Morsey, J. / Cangellaris, A. et al. | 2001
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Distributed SPICE circuit model for ceramic capacitorsSmith, L.D. / Hockanson, D. et al. | 2001
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SoC or SoP? A balanced approach!Davidson, E. et al. | 2001
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Process integration for low-cost system on a package (SOP) substrateSundaram, V. / Liu, F. / Dalmia, S. / White, G.E. / Tummala, R.R. et al. | 2001
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Development of advanced 3D chip stacking technology with ultra-fine interconnectionTakahashi, K. / Hoshino, M. / Yonemura, H. / Tomisaka, M. / Sunohara, M. / Tanioka, M. / Sato, T. / Kojima, K. / Terao, H. et al. | 2001
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Development of a high density pixel multichip module at FermilabCardoso, G. / Zimmermann, S. / Kwan, S.W. / Andresen, J. / Appel, J.A. / Cancelo, G. / Christian, D.C. / Cihangir, S. / Downing, R. / Hall, B.K. et al. | 2001
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Development of 3-dimensional module package, "System Block Module"Imoto, T. / Matsui, M. / Takubo, C. / Akejima, S. / Kariya, T. / Nishikawa, T. / Enomoto, R. et al. | 2001
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A study of electromigration in 3D flip chip solder joint using numerical simulation of heat flux and current densityLee, T.-Y.T. / Taek Yeong Lee, / King-Ning Tu, et al. | 2001
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Advanced thermal interface materials for enhanced flip chip BGAKohli, P. / Sobczak, M. / Bowin, J. / Matthews, M. et al. | 2001
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Self-Alignment Feasibility Study and Contact Resistance Improvement of Electrically Conductive AdhesivesWu, J. / Moon, K.-S. / Wong, C. P. / Institute of Electrical and Electronics Engineers et al. | 2001
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Self-alignment feasibility study and contact resistance improvement of electrically conductive adhesives (ECAs)Jiali Wu, / Kyoung-Sik Moon, / Wong, C.P. et al. | 2001
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Solder alternative: contact resistance improvements for SMCAs. IIFredrickson, G. / Chih-Min Cheng, et al. | 2001
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Characterization of anisotropic conducting adhesive used as a flex-to-card interconnectionPrabhakumar, A. / Constable, J.H. et al. | 2001
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Development of thermoplastic isotropically conductive adhesiveLiong, S. / Wong, C.P. et al. | 2001
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Microwave cure of metal-filled electrically conductive adhesiveTiebing Wang, / Ying Fu, / Becker, M. / Liu, J. et al. | 2001
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Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrateGuo-Wei Xiao, / Chan, P.C.H. / Teng, A. / Lee, P.S.W. / Yuen, M.M.F. et al. | 2001
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Mechanical bending fatigue reliability and its application to area array packagingSkipor, A. / Leicht, L. et al. | 2001
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Selection of base substrate material for design against interfacial delamination for a multilayered system-on-package (SOP) structureWeidong Xie, / Hurang Hu, / Sitaraman, S.K. et al. | 2001
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Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packagesTay, A.A.O. / Zhu, H. et al. | 2001
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Fracture Mechanics Analysis of the Effect on Delaminations in Rectangular IC PackagesTay, A. A. O. / Zhu, H. / Institute of Electrical and Electronics Engineers et al. | 2001
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Buckling driven interface delamination between a thin metal layer and a ceramic substrateLiu, C.J. / Zhang, G.Q. / Ernst, L.J. / Vervoort, M. / Wisse, G. et al. | 2001
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Wavelength stability of DFB lasers for non-hermetic applicationsTheis, C. / Jongwoo Park, / Kiely, P. / Tohmon, G. / Ping Wu, / Chakrabarti, U. / Osenbach, J. et al. | 2001
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Epoxy adhesive used in optical fiber/passive component: kinetics, voids and reliabilityJongwoo Park, / Taweeplengsangsuke, J. / Theis, C. / Osenbach, J. et al. | 2001
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Electromagnetic shielding of plastic material in laser diode modulesChiu, S.K. / Cheng, J.Y. / Jou, W.S. / Jong, G.J. / Wang, S.C. / Wang, C.M. / Lin, C.S. / Wu, T.L. / Cheng, W.H. et al. | 2001
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A New Type of Package Incorporating a Thin AIN Heater for Planar Lightwave Circuit DevicesSaito, H. / Nagai, M. / Hirose, Y. / Tatoh, N. / Seki, M. / Saitou, M. / Tomikawa, T. / Yamanaka, S. / Institute of Electrical and Electronics Engineers et al. | 2001
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A new type of package incorporating a thin AlN heater for planar lightwave circuit devicesSaito, I. / Nagai, M. / Hirose, Y. / Tatoh, N. / Seki, M. / Saitou, M. / Tomikawa, T. / Yamanaka, S. et al. | 2001
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Low loss deep glass waveguides produced with dry silver electromigration processChuang, R.W. / Lee, C.C. et al. | 2001
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High-performance polymers for optical interconnect applications at 3MWalker, C.B. / Kling, J.A. / Lee, N.A. / Novack, J. / Watson, J.E. et al. | 2001
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Development of a lead free chip scale package for wireless applicationsKripesh, V. / Poi-Siong Teo, / Tai, C.T. / Vishwanadam, G. / Yew Cheong Mui, et al. | 2001
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A fluxless Sn-In bonding process achieving high remelting temperatureChuang, R.W. / Choe, S. / Lee, C.C. et al. | 2001
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Lead free interfacial structures and their relationship to Au plating including accelerated thermal cycle testing of non-leaden BGA spheresTaguchi, T. / Kato, R. / Akita, S. / Okuno, A. / Suzuki, H. / Okuno, T. et al. | 2001
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Deformation and crack growth characteristics of SnAgCu vs 63Sn/Pb solder joints on a WLP in thermal cycle testingDeok-Hoon Kim, / Elenius, P. et al. | 2001
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The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic jointsZribi, A. / Zavalij, L. / Borgesen, P. / Primavera, A. / Westby, G. / Cotts, E.J. et al. | 2001
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Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBsZeng, K. / Vuorinen, V. / Kivilahti, J.K. et al. | 2001
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A study of normal, restoring, and fillet forces and solder bump geometry during reflow in concurrent underfill/reflow flip chip assemblyRenzhe Zhao, / Yun Zhang, / Johnson, R.W. / Harris, D.K. et al. | 2001
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Stress analysis and design optimization of a wafer-level CSP by FEM simulations and experimentsRzepka, S. / Hofer, E. / Simon, J. / Meusel, E. / Reichl, H. et al. | 2001
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Simulation and measurement of thermal stress in quasi-monolithic integration technology (QMIT)Joodaki, M. / Kompa, G. / Leinhos, T. / Kassing, R. / Hillmer, H. et al. | 2001
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Coupled thermal electric-modeling of flexible nanospring interconnects for high-performance probingAhmad, M. / Sitaraman, S.K. et al. | 2001
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Thermal characterization of bare-die stacked modules with Cu through-viasYamaji, Y. / Ando, T. / Morifuji, T. / Tomisaka, M. / Sunohara, M. / Sato, T. / Takahashi, K. et al. | 2001
- 738
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Parametric studies of the thermal performance of back-to-back tape ball grid array (TBGA) packagesTonapi, S.S. / Sathe, S.B. / Sammakia, B.G. / Srihari, K. et al. | 2001
- 738
-
Parametric Studies of the Thermal Performance of Back-to-Back Tape Bill Grid Array (TBGA) PackagesTonapi, S. S. / Sathe, S. B. / Sammakia, B. G. / Srihari, K. / Institute of Electrical and Electronics Engineers et al. | 2001
- 744
-
50 GHz broadband SMT package for microwave applicationsYoshida, K. / Shirasaki, T. / Matsuzono, S. / Makihara, C. et al. | 2001
- 750
-
A pressure sensor using flip-chip on low-cost flexible substrateGuo-Wei Xiao, / Chan, P.C.H. / Teng, A. / Jian Cai, / Yuen, M.M.F. et al. | 2001
- 755
-
Room-temperature direct bonding of CMP-Cu film for bumpless interconnectionShigetou, A. / Hosoda, N. / Itoh, T. / Suga, T. et al. | 2001
- 761
-
Compliant cantilevered spring interconnects for flip-chip packagingLunyu Ma, / Qi Zhu, / Sitaraman, S.K. / Chua, C. / Fork, D.K. et al. | 2001
- 767
-
Ultra thin electronics for space applicationsVendier, O. / Huan, M. / Drevofi, C. / Cazaux, J.L. / Beyne, E. / Van Hoof, R. / Marty, A. / Pinel, S. / Tasselli, J. / Marco, S. et al. | 2001
- 772
-
2 metal layer tape package for improving the performance of high speed DRAMTae-Sub Chang, / Dong-Ho Lee, / Jung-Jin Kim, / Mee-Hyun Ahn, et al. | 2001
- 777
-
A practical, flip-chip, multi-layer pre-encapsulation technology for wafer-scale underfillBurress, R.V. / Capote, M.A. / Yong-Joon Lee, / Lenos, H.A. / Zamora, J.F. et al. | 2001
- 782
-
Flip chip assembly process development, reliability assessment and process characterization for polymer stud grid array-chip scale packagePaydenkar, C.S. / Jefferson, F.G. / Baldwin, D.F. et al. | 2001
- 790
-
Investigation of low cost flip chip under bump metailization (UBM) systems on Cu padsJae-Woong Nab, / Kyung-Wook Paik, et al. | 2001
- 790
-
Investigation of Low Cost Flip Chip Under Bump Metallization (UBM) Systems on Cu PadsNah, J.-W. / Paik, K.-W. / Institute of Electrical and Electronics Engineers et al. | 2001
- 796
-
Adhesion/reliability/reworkability study on underfill material from free radical polymerization system and its hybrid composite with epoxy resinLianhua Fan, / Wong, C.P. et al. | 2001
- 803
-
Assessment of flip chip assembly and reliability via reflowable underfillTie Wang, / Chew, T.H. / Lum, C. / Chew, Y.X. / Miao, P. / Foo, L. et al. | 2001
- 810
-
Processing design rules for reliable reflowable underfill applicationKallmayer, C. / Becker, K.-F. / Jung, E. / Aschenbrenner, R. / Reichl, H. et al. | 2001
- 816
-
Modeling RF passive circuits using coupled lines and scalable modelsDalmia, S. / Sung Hwan Min, / Swaminathan, M. et al. | 2001
- 824
-
Experimental analysis of design options for spiral inductors integrated on low cost MCM-D substratesCottet, D. / Grzyb, J. / Scheffler, M. / Troster, G. et al. | 2001
- 831
-
Parameterized models for a RF chip-to-substrate interconnectDoerr, I. / Lih-Tyng Hwang, / Sommer, G. / Oppermann, H. / Li, L. / Petras, M. / Korf, S. / Sahli, F. / Myers, T. / Miller, M. et al. | 2001
- 839
-
New structure 1608 size chip tantalum capacitor -6.3 WV-10 /spl mu/F with face-down terminals for fillet-less surface mountingShirashige, M. / Oka, K. / Okada, K. et al. | 2001
- 839
-
New Structure 1608 Size Chip Tantalum Capacitor - 6.3WV 10muF - with Face-Down Terminals for Fillet-less Surface MountingShirashige, M. / Oka, K. / Okada, K. / Institute of Electrical and Electronics Engineers et al. | 2001
- 847
-
Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbps optical transmitter and receiver modulesShibuya, A. / Matsui, K. / Takahashi, K. / Kawatani, A. et al. | 2001
- 852
-
Simulation, modeling, and testing embedded RF capacitors in low temperature cofired ceramicBlood, W. / Feng Ling, / Kamgaing, T. / Myers, T. / Petras, M. et al. | 2001
- 858
-
Advances in long-wavelength single-mode VCSELs and packaging approaches for single-mode fiber applicationsColdren, L.A. / Hall, E. / Nakagawa, S. et al. | 2001
- 864
-
Heterogeneous integration of OE arrays with Si electronics and micro-opticsYue Liu, et al. | 2001
- 870
-
SMT-compatible optical-I/O chip packaging for chip-level optical interconnectsIshii, Y. / Koike, S. / Arai, Y. / Ando, Y. et al. | 2001
- 876
-
Microlens arrays with integrated thin film power monitorsEugene Ma, / Payne, A. / Nemchuk, N. / Domash, L. et al. | 2001
- 880
-
Multi-channel optical interconnection modules up to 2.5 Gb/s/chEichenberger, J. / Toyoda, S. / Takezawa, N. / Keller, C. / Sugiyama, M. / Iwasaki, Y. et al. | 2001
- 886
-
Device processing technology for free-space optical interconnect systemOren, M. / McCarthy, A. / Tooley, F. / Laprise, A.E. / Plant, D. / Kirk, A. / Lu, Y. / Zhao, J. et al. | 2001
- 890
-
Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip jointsWiese, S. / Schubert, A. / Walter, H. / Dukek, R. / Feustel, F. / Meusel, E. / Michel, B. et al. | 2001
- 890
-
Constitutive Behavior of Lead-Free Solders v.s. Lead-Containing Solders - Experiments on Bulk Specimens and Flip-Chip JointsWiese, S. / Schubert, A. / Walter, H. / Dudek, R. / Feustel, F. / Meusel, E. / Michel, B. / Institute of Electrical and Electronics Engineers et al. | 2001
- 903
-
Mold delamination and die fracture analysis of mechatronic packagesMercado, L.L. / Wieser, H. / Hauck, T. et al. | 2001
- 911
-
Sensitivity derivatives of dissimilar material junctions in electronic packagesGuven, I. / Barut, A. / Madenci, E. et al. | 2001
- 919
-
Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill propertiesYang, D.G. / Zhang, G.Q. / Ernst, L.J. / Caers, J.F.J. / Bressers, H.J.L. / Janssen, J. et al. | 2001
- 925
-
Evaluation and optimization of package processing, design, and reliability through solder joint profile predictionYeung, B.H. / Lee, T.-Y.T. et al. | 2001
- 931
-
Creep behavior of a molding compound and its effect on packaging process stressesKiasat, M.S. / Zhang, G.Q. / Ernst, L.J. / Wisse, G. et al. | 2001
- 933
-
Studies on a novel flip-chip interconnect structure - pillar bumpTie Wang, / Tung, F. / Foo, L. / Dutta, V. et al. | 2001
- 939
-
Cr/Cu/Ni underbump metallization studyTay Hui Leng, / Galen Kirkpatrick, / Andrew Tay, / Lu Li, et al. | 2001
- 950
-
Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solderSe-Young Jang, / Wolf, J. / Ehrmann, O. / Gloor, H. / Reichl, H. / Kyung-Wook Paik, et al. | 2001
- 957
-
Micro-ball wafer bumping for flip chip interconnectionHashino, E. / Shimokawa, K. / Yamamoto, Y. / Tatsumi, K. et al. | 2001
- 965
-
Interfacial adhesion study for copper/SiLK interconnects in flip-chip packagesMiller, M.R. / Ho, P.S. et al. | 2001
- 971
-
Thermo-electromigration phenomenon of solder bump, leading to flip-chip devices with 5,000 bumpsNakagawa, K. / Baba, S. / Watanabe, M. / Matsushima, H. / Harada, K. / Hayashi, E. / Wu, Q. / Maeda, A. / Nakanishi, M. / Ueda, N. et al. | 2001
- 978
-
Evaluation of lead(Pb)-free ceramic ball grid array (CBGA): Wettability, microstructure and reliabilityFarooq, M. / Ray, S. / Sarkhel, A. / Goldsmith, C. et al. | 2001
- 987
-
High speed multichip modules using flip chip mount technology for 10 Gbps optical transmission systemsTakahashi, K. / Ikeuchi, T. / Tsuda, T. / Chuzenji, T. et al. | 2001
- 993
-
Improved grounding method for heat sinks of high speed processorsDiepenbrock, J.C. / Archambeault, B. / Hobgood, L.D. et al. | 2001
- 997
-
High performance flip chip PBGA developmentStone, B. / Czarnowski, J.M. / Guajardo, J.R. et al. | 2001
- 1003
-
Bump-less interconnect for next generation system packagingSuga, T. / Otsuka, K. et al. | 2001
- 1009
-
Flip chip in leaded molded package (FLMP)Joshi, R. / Manatad, R. / Tangpuz, C. et al. | 2001
- 1013
-
A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) conceptSuga, T. / Howlader, M.M.R. / Itoh, T. / Inaka, C. / Arai, Y. / Yamauchi, A. et al. | 2001
- 1019
-
Electrical test strategies for a wafer-level batch packaging technologyKeezer, D.C. / Patel, C.S. / Zhou, Q. / Meindl, J.D. et al. | 2001
- 1024
-
Flip chip interconnection method applied to small camera moduleKarasawa, J. / Segawa, M. / Kishimoto, Y. / Aoki, M. / Sasaki, T. et al. | 2001
- 1029
-
Time for change in pre-assembly? The challenge of thin chipsKroninger, W.J. / Hecht, F. / Lang, G. / Mariani, F. / Geyer, S. / Schneider, L. et al. | 2001
- 1034
-
Innovative packaging concepts for ultra thin integrated circuitsKlink, G. / Feil, M. / Ansorge, F. / Aschenbrenner, R. / Reichl, H. et al. | 2001
- 1040
-
Development of gold to gold interconnection flip chip bonding for chip on suspension assembliesLuk, C.F. / Chan, Y.C. / Hung, K.C. et al. | 2001
- 1045
-
Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliabilityBurnette, T. / Johnson, Z. / Koschmieder, T. / Oyler, W. et al. | 2001
- 1052
-
The comparison of solder joint reliability between BCC++ and QFNHung, S.C. / Zheng, P.J. / Ho, S.H. / Lee, S.C. / Wu, J.D. et al. | 2001
- 1052
-
The Comparison of Solder Joint Reliability Between BCC++ and MCCHung, S. C. / Zheng, P. J. / Ho, S. H. / Lee, S. C. / Wu, J. D. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1059
-
Solder joint crack propagation in plastic and ceramic packaged diodes mounted on insulated metal substrateSangalli, N. / Barker, D.B. et al. | 2001
- 1065
-
Characterization and analysis on the solder ball shear testing conditionsXingjia Huang, / Lee, S.-W.R. / Chien Chun Yan, / Hui, S. et al. | 2001
- 1065
-
Characterization and Analysis on the Solder Bail Shear Testing ConditionsHuang, X. / Lee, S.-W. R. / Yan, C. C. / Hui, S. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1072
-
The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid arrayCoyle, R.J. / Wenger, G.M. / Hodges, D.E. / Mawer, A. / Cullen, D.P. / Solan, P.P. et al. | 2001
- 1081
-
An experimental study of failure and fatigue life of a stacked CSP subjected to cyclic bendingWu, J.D. / Ho, S.H. / Zheng, P.J. / Liao, C.C. / Hung, S.C. et al. | 2001
- 1087
-
Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 /spl mu/m CMOS test chipBudell, T. / Audet, J. / Kent, D. / Libous, J. / O'Connor, D. / Rosser, S. / Tremble, E. et al. | 2001
- 1087
-
Comparison of Multilayer Organic and Ceramic Package Simultaneous Switching Noise Measurements using a 0.16-mum CMOS Test ChipBudell, T. / Audet, J. / Kent, D. / Libous, J. / O Connor, D. / Rosser, S. / Tremble, E. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1095
-
Modeling and simulation of core switching noise on a package and boardNa, N. / Swaminathan, M. / Libous, J. / O'Connor, D. et al. | 2001
- 1102
-
A simulation study of simultaneous switching noiseChen, C.-T. / Zhao, J. / Chen, Q. et al. | 2001
- 1107
-
Integrated modeling methodology for core and I/O power deliveryRadhakrishnan, K. / Li, Y.-L. / Pinello, W.P. et al. | 2001
- 1111
-
A quasi three-dimensional distributed electromagnetic model for complex power distribution networksChoi, M.J. / Cangellaris, A.C. et al. | 2001
- 1117
-
The impact of split power planes on package performanceMiller, J.R. et al. | 2001
- 1122
-
A comparison of large I/O flip chip and wire bonded packagesBulumulla, S.B. / Caggiano, M.F. / Lischner, D.J. / Wolf, R.K. et al. | 2001
- 1127
-
High Density Packaging for Mobile TenninalsPienimaa, S. K. / Martin, N. I. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1127
-
High density packaging for mobile terminalsPienimaa, S.K. / Martin, N.I. et al. | 2001
- 1135
-
Flip chip with lead-free solders on halogen-free microvia substratesBaynham, G. / Baldwin, D.F. / Boustedt, K. / Wennerholm, C. et al. | 2001
- 1140
-
Low cost flip chip package design concepts for high density I/OTee-Onn Chong, / Seng-Hooi Ong, / Teong-Guan Yew, / Chee-Yee Chung, / Sankman, R. et al. | 2001
- 1144
-
Improvement of the reliability of the C4 for ultrahigh thermal conduction module with the direct solder-attached cooling system (DiSAC)Yamada, O. / Sawada, Y. / Harada, M. / Yokozuka, T. / Yasukawa, A. / Moriya, H. / Saito, N. / Kasai, K. / Uda, T. / Netsu, T. et al. | 2001
- 1149
-
Dual Operational Amplifier Using Flip-Chip Fine Package of 1.0x1.0x0.6mm with 8-Pin CountsKurata, H. / Mitsuka, K. / Matsushita, H. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1149
-
Dual operational amplifier using flip-chip fine package of 1.0/spl times/1.0/spl times/0.6-mm with 8-pin countsKurata, H. / Mitsuka, K. / Matsushita, H. et al. | 2001
- 1154
-
Reliability study for CTE mismatching in build-up structureNawa, K. et al. | 2001
- 1159
-
Reliability assessment of microvias in HDI printed circuit boardsFuhan Liu, / Jicun Lu, / Sundaram, V. / Sutter, D. / White, G. / Baldwin, D. / Tummala, R.R. et al. | 2001
- 1164
-
Global/local modeling for PWB mechanical loadingJiansen Zhu, / Quander, S. / Reinikainen, T. et al. | 2001
- 1170
-
Effect of thermal cycling ramp rate on CSP assembly reliabilityGhaffarian, R. et al. | 2001
- 1175
-
Effects of probe damage on wire bond integrityHotchkiss, G. / Ryan, G. / Subido, W. / Broz, J. / Mitchell, S. / Rincon, R. / Rolda, R. / Guimbaolibot, L. et al. | 2001
- 1181
-
Novel thermal validation metrology based on non-uniform power distribution for Pentium(R) III Xeon/sup TM/ cartridge processor design with integrated level two cacheTeck Joo Goh, / Amir, A.N. / Chia-Pin Chiu, / Torresola, J. et al. | 2001
- 1181
-
Novel Thermal Validation Metrology Based on Non-Uniform Power Distribution for Pentium® III Xeon™ Cartridge Processor Design with Integrated Level Two CacheGoh, T. J. / Amir, A. N. / Chiu, C.-P. / Torresola, J. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1187
-
Evaluation of Cu capping alternatives for polyimide-Cu MCM-DPerfecto, E. / Kang-Wook Lee, / Hamel, H. / Wassick, T. / Cline, C. / Oonk, M. / Feger, C. / McHerron, D. et al. | 2001
- 1193
-
Selection and evaluation of materials for future system-on-package (SOP) substrateMarkondeya Raj, P. / Shinotani, K. / Mancheol Seo, / Bhattacharya, S. / Sundaram, V. / Zama, S. / Jicun Lu, / Zweben, C. / White, G.E. / Tummala, R.R. et al. | 2001
- 1198
-
Processing and properties of new soluble polyimidesEzzell, S.A. / Bai, F. / Chien, B. / Givot, B.L. / Ayukawa, H. / Kobayashi, M. / Aoki, S. et al. | 2001
- 1201
-
Processing of polymer-ceramic nanocomposites for system-on-package applicationsWindlass, H. / Markondeya Raj, P. / Balaraman, D. / Bhattacharya, S.K. / Tummala, R.R. et al. | 2001
- 1207
-
Effects of microvia build-up layers on the solder joint reliability of a wafer level chip scale package (WLCSP)Lau, J.H. / Lee, S.-W.R. et al. | 2001
- 1216
-
Effects of O~2/C~2F~6 Plasma Descum with RF Cleaning on Via Formation in MCM-D Substrate Using Photosensitive BCBJu, C.-W. / Park, S.-S. / Kim, S.-J. / Pack, K.-H. / Lee, H.-T. / Song, M.-K. / Institute of Electrical and Electronics Engineers et al. | 2001
- 1216
-
Effects of O/sub 2//C/sub 2/F/sub 6/ plasma descum with RF cleaning on via formation in MCM-D substrate using photosensitive BCBChul-Won Ju, / Seong-Su Park, / Seong-Jin Kim, / Kyu-Ha Pack, / Hee-Tae Lee, / Min-Kyu Song, et al. | 2001
- 1219
-
Solder joint attachment reliability and assembly quality of a molded ball grid array socketCoyle, R.J. / Holliday, A. / Solan, P.P. / Yao, C. / Cyker, H.A. / Manock, J.C. / Bond, R. / Stenerson, R.E. / Furrow, R.G. / Occhipinti, M.V. et al. | 2001
- 1227
-
A new coiled microspring contact technologyMarcus, R.B. et al. | 2001
- 1233
-
BGA backplane connector for high speed differential signalsOlson, S.W. et al. | 2001
- 1239
-
AMP Z-pack 2 mm HM connectors with quiet mate contacts for resolution of nanosecond discontinuity in hot-swap applicationsDemirci, H.H. / Laub, M. / Fry, C. et al. | 2001
- 1245
-
Electrical modeling of high speed interconnection linksDe Geest, J. / Sercu, S. / Nadolny, J. et al. | 2001
- 1250
-
High frequency measurement of isotropically conductive adhesivesLiong, S. / Zhuqing Zhang, / Wong, C.P. et al. | 2001
- 1255
-
SensEdu-an Internet course for teaching sensoricsHarsanyi, G. / Lepsenyi, I. / Gordon, P. / Bojta, P. / Ballun, G. / Illyefalvi-Vitez, Z. et al. | 2001
- 1261
-
Progress on Internet-based educational material development for electronic products and systems cost analysisSandborn, P. / Murphy, C.F. et al. | 2001
- 1267
-
Progress on developing electronic packaging educational modulesKim, B.C. / Severance, C. et al. | 2001
- 1270
-
Development of an Internet course on electrically conductive adhesives with experimentsJohan Liu, / Xitao Wang, / Morris, J.E. et al. | 2001
- 1276
-
Undergraduate microsystems packaging education: needs, status and challengesTummala, R. / Conrad, L. et al. | 2001