The new insulation system TOSTIGHT∗ II for high voltage induction motors (Englisch)
- Neue Suche nach: Mitsui, H.
- Neue Suche nach: Yamamoto, M.
- Neue Suche nach: Huruhata, S.
- Neue Suche nach: Mitsui, H.
- Neue Suche nach: Yamamoto, M.
- Neue Suche nach: Huruhata, S.
In:
1973 EIC 11th Electrical Insulation Conference
;
110-113
;
1973
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:The new insulation system TOSTIGHT∗ II for high voltage induction motors
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.09.1973
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Format / Umfang:839713 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Front matter| 1973
- 1
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The struggle with nuclear power standardsSimmons, Alfred J. et al. | 1973
- 3
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Evaluation of radiation resistance of polymers for nuclear power plant applicationsCanady, Van L. et al. | 1973
- 6
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Characteristics of enameled wire under application of voltage when immersed in water or under humid conditionsNoguchi, Hiroshi / Tobita, Shuji et al. | 1973
- 9
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Material and cable design for nuclear power generating station installationsLaGase, F. E. / Armstrong, R. S. et al. | 1973
- 11
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Properties of various plural coated magnet wires for hermetic motorsOkubo, N. / Horikoshi, S. / Shirahata, I. et al. | 1973
- 15
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New ultra thin powder coating capabilitiesWolinski, Leon E. et al. | 1973
- 19
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Matching chemical and physical properties of powdered resins to electrostatic fluid bed application equipmentMeyer, Curt L. et al. | 1973
- 22
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A water soluble wire enamelHaughney, J. P. / Hurayt, G. et al. | 1973
- 24
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Fundamental aspects of a new electrodeposition insulating process "MEDIS"Shibayama, K. / Sato, F. / Ono, H. et al. | 1973
- 28
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A new magent wire manufacturing process based on electrodepositionShibayama, K. / Suzuki, T. / Hiraoka, Y. et al. | 1973
- 33
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New impregnating resinsRichon, George L. et al. | 1973
- 34
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Performance characteristics of improved solventless silicone resinsVanwert, Bernard / Ruth, Thomas E et al. | 1973
- 38
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Effect on physical properties of variations in a two-part epoxy resin systemKurz, Robert A. et al. | 1973
- 41
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New heat resistant “DP resin”Yokono, H. / Numata, S. / Mukai, J. / Muroi, T. et al. | 1973
- 44
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Trends in insulating varnish todayWroblewski, H. A. / Moore, J. E. et al. | 1973
- 47
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Material considerations for safety in consumer electronicsSanderson, Richard L. et al. | 1973
- 48
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New considerations in flammability testing of lead and hook-up wiresSpade, R. L. et al. | 1973
- 52
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250-45 to double insulationBogue, Richard et al. | 1973
- 54
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Insulating materials for double insulated power toolsChamy, Peter G. / Bednarski, Ted E. / Bennett, John L. et al. | 1973
- 56
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Material advancement economizes double insulated power toolsDeller, T. E. / Wilkinson, R. E. / Duncan, J. et al. | 1973
- 60
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Adaptation of a gas chromatographic method for analysis of effluent from manufacturing processesHutchinson, Royce L. et al. | 1973
- 64
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Environmental problems involved in the use of asbestos containing electrical insulationsFenner, Edmund M. et al. | 1973
- 67
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Determination of explosive hazard of gases generated during pyrolysis of motor stator encapsulantsDiliberti, J. / Tobin, J. F. et al. | 1973
- 70
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International development in insulation system characterizationKelen, Andreas / Mahon, Laurence P. / Reymers, Howard E. et al. | 1973
- 72
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Evaluation of laminates for high temperature electrical/mechanical applicationsSeidler, Lawrence E. et al. | 1973
- 76
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A modified method of testing thermal endurance of winding wiresSteinhaus, Rudolf R. et al. | 1973
- 79
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Thermal stability of magnet wire evaluated by viscoelastic behaviorMasuda, Shigeo / Asano, Nobuyuki et al. | 1973
- 83
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The process of resin rich insulating materials for use in high voltage rotating machinesNeal, J. E. / Scarlett, E. et al. | 1973
- 87
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A new method for obtaining the thermal conductivity of electrical insulationKultzow, Robert J. et al. | 1973
- 90
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Development of new mica paper epoxy insulation systems for high voltage rotating machinesHirabayashi, S. / Shibayama, K. / Matsuda, S. / Ito, S. et al. | 1973
- 92
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Air gap winding for superconducting electrical machinerySterrett, C. C. / Haller, H. E. / Lauroesch, Hugo C. / Lonseth, Palmer et al. | 1973
- 95
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Reliability testing of aluminum magnet wire connections for hermetic motorsSpears, Jerry L. et al. | 1973
- 99
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Some evaluations of hermetic motor insulation systemsTokunaga, T. / Isogai, T. / Kurokawa, S. et al. | 1973
- 102
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Correlation of properties of polyethylene terephthalate with aging in refrigerantsKohne, John A. et al. | 1973
- 105
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Improving the quality of dual coat amide imide/polyester wire by using the dissipation factor as a bake indicatorMol, Evert A. et al. | 1973
- 109
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History and progress of IEEE hermetic subcommitteeEmmons, Harold L. et al. | 1973
- 110
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The new insulation system TOSTIGHT∗ II for high voltage induction motorsMitsui, H. / Yamamoto, M. / Huruhata, S. et al. | 1973
- 114
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Vacuum pressure impregnation: The key to void-free coil insulationRolshouse, Bill / Arndt, Dana et al. | 1973
- 117
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Extension of the post impregnation concept to high voltage windingsStabile, S. J. et al. | 1973
- 122
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Commutator design for commutator fusingWarner, Allan et al. | 1973
- 126
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Comparison of the effect of varnish treatment processes on the moisture resistance of electrical insulation systems for random wound motorsFlaherty, R. J. / Kimball, J. A. / Tobin, J. F. et al. | 1973
- 131
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EPDM for molded electrical connectors and accessoriesSpenadel, L. / Murphy, J. J. et al. | 1973
- 134
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Evaluation of a molded splicing systemTaj, Hatim H. et al. | 1973
- 137
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Tree initiation in polyethyleneNoto, Fumitoshi / Yoshimura, Noboru et al. | 1973
- 141
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Cast urethane insulatorsDelmonte, John / Norring, W. D. et al. | 1973
- 144
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A new approach to the evaluation of organic insulating materials for service in polluted conditionsTonnesen, Ole et al. | 1973
- 149
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Test methods useful in selecting materials for outdoor high voltage insulationNiemi, R. G. / Orbeck, T. et al. | 1973
- 153
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A contribution to the study of aging of cable insulating materialsGouldson, E. J. / Gahir, A. S. / Kurtz, M. et al. | 1973
- 157
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Outdoor insulator surface conductance and surface arcingDakin, T. W. / Mullen, G. A. / Chenoweth, T. E. / Dodds, J. J. et al. | 1973
- 162
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Indoor and outdoor transformer insulation systemsPendleton, W. W. / Bimbiris, Alfons et al. | 1973
- 167
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A portable liquid power factor instrumentSambhu, M. K. et al. | 1973
- 170
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Insulation resistance measurements at low frequenciesBartnikas, R. / Spielvogel, R. et al. | 1973
- 172
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Methods for evaluating new dielectric liquids for use in high voltage electrical equipmentBurow, R. F. / Vincent, G. A. / Brooks, W. T. et al. | 1973
- 175
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The use of the oxygen electrode for determining the susceptibility of liquid dielectrics to biodegradeNeely, W. B. / Litchfield, N. / Blau, G. / Hamilton, E. C. et al. | 1973
- 178
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Safety aspects of high voltage power line fault location techniquesReynolds, P. H. / Dyner, B. L. et al. | 1973
- 181
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Electrical insulation aspects of compressed gas cablesDoepken, Herbert C. / Bolin, Philip C. et al. | 1973
- 183
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Stress grading in extruded cablesSingh, N. / Bruhin, A. C. et al. | 1973
- 185
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Development of field molded splices for ethylene-propylene rubber and crosslinked polyethylene insulated cablesNelson, A. L. / Mcavoy, F. M. et al. | 1973
- 188
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Non-conventional power transmission systemsWeeks, W. L. et al. | 1973
- 192
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Micropackaging of electronic circuitsMcdonald, R. D. et al. | 1973
- 194
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Leadless packaging challenges the traditional dipGrossman, Stephen E. et al. | 1973
- 197
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On the temperature response of semiconductor devicesBaxter, Gene K. et al. | 1973
- 201
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Flexible beam-leaded substratesBachner, Frank J. et al. | 1973
- 202
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Miniature explosive bonding for electrical interconnectionsCranston, B. H. et al. | 1973
- 205
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Flexible advanced packagingPerrino, F. A. et al. | 1973
- 206
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New laminates for printed circuit boardsYanagihara, Kohtaro / Sugie, Soji / Gaku, Morio et al. | 1973
- 208
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Thermal characterization of multilayer printed wiring boards during laminationEngelmaier, Werner et al. | 1973
- 211
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Prediction of multilayer printed wiring board temperatures during laminationAung, W. et al. | 1973
- 215
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Kerimid 601 polyimide resin for multilayer printed wiring boardsDarmory, F. P. et al. | 1973
- 217
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Comparative testing and evaluation of conformal, coating materials and processesWorthington, D. Gene et al. | 1973
- 223
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New silicone elastoplastic coating for electronic applicationsWaterman, W. R. et al. | 1973
- 225
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Sources of error in drilling printed circuit laminatesMcKeon, L. R. / Reynolds, M. J. / Speicher, C. G. et al. | 1973
- 228
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Voltage breakdown of fineline flexible printed wiringRainal, A. J. / Landry, E. F. / Lahti, J. N. et al. | 1973
- 231
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Characterization of Kapton® polyimide film for use in flexible circuitryKreuz, John A. et al. | 1973
- 234
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Reliability considerations of multilayer printed circuit boardsMcCormick, John E. / Rigling, Walter S. et al. | 1973
- 236
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Panels and pins, production and perfection (The AMP "select solder" approach)Cobaugh, R. / Coller, J. et al. | 1973
- 240
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Plated pin surface evaluationGetten, J. R. / Vanvestrout, V. D. et al. | 1973
- 242
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Reflow soldering of circuits on heat sensitive materialsSchoenthaler, D. / Pfahl, R. C. et al. | 1973
- 245
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Electrical performance of pin-connected stacked backplanesKnausenberger, W. H. et al. | 1973
- 248
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Cabling for high speed circuitsMoulton, R. Kirk et al. | 1973
- 251
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User's view of some newer insulation materialsSinclair, William Y. et al. | 1973
- 253
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Fatigue life of flexible printed studies: Selected studiesVan Dover, L. K. / Lindfors, J. F. et al. | 1973
- 257
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Sand-bath and thermal-shock testing of plated-through-holesModlo, Robert J. et al. | 1973
- 258
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Selecting microwave stripline laminatesWorboys, David C. et al. | 1973
- 260
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Microstrip tantalum resistors deposited through electron beam techniquesKonsowski, S. G. / Hall, R. D. et al. | 1973
- 262
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Effects of variations in alumina substrates on dielectric constant at microwave frequenciesBailey, J. T. / Gaddy, J. H. / Getsinger, W. J. / Olyphant, M. / Kawada, Jun-Ichiro / Sugie, Soji et al. | 1973
- 263
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Conditioning and packaging factors in stripline performanceOlyphant, M. et al. | 1973
- 266
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Metallizing microwave stripline substrates in high performance crossed-field amplifiersAng, C. / Mills, G. J. / Isenberg, S. F. et al. | 1973
- 269
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Round-robin correlation testing of an X-band dielectric constant and dissipation factor test methodVan Dover, L. K. Monty et al. | 1973
- 271
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Laser cut microwave thin film circuitsMino, T. D. / Oberholzer, D. J. / Strittmatter, C. A. et al. | 1973
- 274
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Beryllium oxide is cost effectiveFleischner, P. L. et al. | 1973
- 278
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A constant index lens for integrated digital electronicsTurner, E. M. / Bogner, Bruce F. et al. | 1973
- 281
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Microstrip phased array antennasMunson, Robert et al. | 1973
- 284
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Cost-effective and reliable hybrid circuit assemblyJackson, C. Roger et al. | 1973
- 286
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Microwave stripline packaging using conductive epoxyHartman, J. A. / Palermo, C. A. et al. | 1973
- 289
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ARC plasma technology for electronic devicesBabbitt, R. W. / Harris, D. H. / Janowiecki, R. J. / Wilson, M. C. / Chang, J. T. / Bolger, Justin C. et al. | 1973
- 292
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Flow test for electronic foam encapsulantsJohnson, L. I. / Ryan, R. J. et al. | 1973
- 295
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Skylab high voltage systems corona assessmentDunbar, William G. et al. | 1973
- 298
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Evaluation of potting compounds by electrical resistivity techniquesLequin, Doris S. et al. | 1973
- 301
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TPRTM thermoplastic rubber in wire and cable applicationsAllen, Kenneth R. et al. | 1973
- 304
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Lightweight electronic harness wireRead, John G. et al. | 1973
- 306
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An electronic systems viewpoint of the automobile environmentMcCarter, O. T. et al. | 1973
- 314
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Automated ground transport systems: Some observed materials problemsMayhan, Robert J. / Fenton, Robert E. / Olson, Karl W. et al. | 1973
- 317
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The computerized car in 1979: Supplying the demandCohen, Philip L. et al. | 1973
- 319
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A microwave automatic vehicle identification systemStaras, H. / Klensch, R. J. / Rosen, J. et al. | 1973
- 320
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Parylene thin films dielectricsJayne, W. M. / Lee, S. M. et al. | 1973
- 324
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Holographic evaluation of electronic circuits using photochrome filmsLo, D. S. et al. | 1973
- 326
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Electrophoretic deposition as applied to ground planes and other electrical hardwarePresti, Frank P. / Damm, E. P. et al. | 1973
- 330
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Effective use of epoxy adhesives in microelectronicZimmerman, D. D. et al. | 1973
- 333
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Some aspects of adhesive-induced corrosion in electronic devicesDahringer, D. W. et al. | 1973
- 336
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Epoxy device bonding and die handling techniques for hybrid microcircuitsKimball, Jay et al. | 1973
- 337
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Weaknesses in a strong film adhesiveBurkett, Frank S. et al. | 1973
- 338
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Optimizing a chip adhesiveKraus, Herbert S. et al. | 1973
- 341
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Partial discharge (corona) detection in electronic systemsReynolds, P. H. / Saile, C. J. et al. | 1973
- 344
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Broadband measurements on materials using time domain metrologyNicolson, A. M. et al. | 1973
- 347
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Fingerprinting resin cure with dielectric analysisOnufer, Robert J. / Yalof, Stanley A. et al. | 1973
- 350
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Rapid measurements of the insulation resistance of capacitorsTait, D. A. G. / Reynolds, P. H. et al. | 1973
- 354
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Dielectric measurements on liquid resins and curing agents from 10 to 200 MHzSnell, John B. / Olyphant, Murray et al. | 1973
- 357
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Seed™, shield effectiveness evaluation deviceMiller, Paul et al. | 1973
- vii
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Table of contents| 1973