A low power consumption fractal microchannel heat sink based on hierarchical ribs (Englisch)
- Neue Suche nach: Wu, Yongjin
- Neue Suche nach: Ma, Changbei
- Neue Suche nach: Luo, Jiangbo
- Neue Suche nach: Sun, Yunnan
- Neue Suche nach: Xie, Dongdong
- Neue Suche nach: Ding, Guifu
- Neue Suche nach: Wang, Kai
- Neue Suche nach: Wang, Yan
- Neue Suche nach: Yang, Zhuoqing
- Neue Suche nach: Shen, Shengnan
- Neue Suche nach: Wu, Yongjin
- Neue Suche nach: Ma, Changbei
- Neue Suche nach: Luo, Jiangbo
- Neue Suche nach: Sun, Yunnan
- Neue Suche nach: Xie, Dongdong
- Neue Suche nach: Ding, Guifu
- Neue Suche nach: Wang, Kai
- Neue Suche nach: Wang, Yan
- Neue Suche nach: Yang, Zhuoqing
- Neue Suche nach: Shen, Shengnan
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:A low power consumption fractal microchannel heat sink based on hierarchical ribs
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Beteiligte:Wu, Yongjin ( Autor:in ) / Ma, Changbei ( Autor:in ) / Luo, Jiangbo ( Autor:in ) / Sun, Yunnan ( Autor:in ) / Xie, Dongdong ( Autor:in ) / Ding, Guifu ( Autor:in ) / Wang, Kai ( Autor:in ) / Wang, Yan ( Autor:in ) / Yang, Zhuoqing ( Autor:in ) / Shen, Shengnan ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:08.08.2023
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Format / Umfang:3380694 byte
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ISBN:
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ISSN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
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Research on Local Heating of Flat Plate Based on Electric Field Distribution RegulationLiu, Haojie / Wang, Wanrong / Ren, Jie / Tan, Jiahao / Ye, Yan / Zhou, Shangru / Li, Kun / Zhang, Gaofeng et al. | 2023
- 1
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Design of a fuzzy decoupling control system for indoor environmentsLiu, Zichen / Cen, Honglei / Cai, Qiang / Lu, Min / Nie, Jing / Zhao, Yanming et al. | 2023
- 1
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Failure Analysis for IIH leakage on 7nm FinFFT Technology ChipChao, Shuanshe / Lin, Xinyi / Dong, Chen / Mei, Na / Yang, Dan / He, Xiao et al. | 2023
- 1
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Study on the interfacial IMCs growth of nt-Cu/In solder jointsSa, Zicheng / Liu, Xudong / Wang, Shang / Feng, Jiayun / Tian, Yanhong et al. | 2023
- 1
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Design and optimization of cell and multiple-zone gradient modulation field limiting ring(MGM-FLR) termination for 1700V/10A 4H-SiC merged PiN/Schottky (MPS) DiodesZheng, Bofeng / Luo, Houcai / Wu, Huan / Zhang, Jingping / Chen, Xianping / Lang, Lei et al. | 2023
- 1
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Solder Selection Simulation Of IGBT Module Based On Thermal - Mechanical Coupling FieldLiu, Bowen / Chen, Jibing / Hu, Maohui / Chen, Junsheng / Shi, Qianyu / Hong, Yifei et al. | 2023
- 1
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In situ nondestructive study interface aging mechanism of polymeric materials/nanocomposites based on dual-beam Raman spectroscopyLiu, Yuan / Zeng, Xiaoliang / Sun, Rong / Zhou, Binbin et al. | 2023
- 1
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A Novel Low-temperature Co-Co Direct Bonding for Future 3D InterconnectionQi, Xiaoyun / Ma, Yan / Wang, Chenxi et al. | 2023
- 1
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A novel 3D packaging technology for high-reliability applicationsLiu, Mifeng / Zhou, Yi / Dai, Jie / Qiao, Qi / Wang, Jing / Chen, Kai et al. | 2023
- 1
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The preparation of high-quality W-LED packaged with Sr3-xAl2Si3O12:xEu3+ and YAG:Ce3+Xue, Junlin / Wang, Bin / Yang, Liang / Yi, Sicheng / Han, Taiping / Wang, Yan / Cao, Chunyan / Xie, An et al. | 2023
- 1
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High-precision positioning detection technology for large-size fan-out panel-level package chipsChen, Zhihang / Chen, Xindu / Jiang, Mingxia et al. | 2023
- 1
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An investigation on the on dielectric, ferroelectric properties and failure mechanism for the 0805X7R multi-layer ceramic capacitorWang, Pengfei / Zhang, Lei / Yu, Shuhui / Sun, Rong / Fu, Zhenxiao / Cao, Xiuhua et al. | 2023
- 1
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Analysis and Modeling of Electrothermal Characteristics of SiC Power Module Based on Planar InterconnectionWang, Liang / Liang, Yu / Zhao, Mingzhi / Zhang, Tongyu / Wang J, Yuchen / Zhang, Jin et al. | 2023
- 1
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Study on Picosecond Pulsed Laser Grooving Technology for Low-k Silicon WaferWang, Canwen / Su, Jingyang / Lu, Siyuan / Zhu, Wenhui / Wang, Liancheng et al. | 2023
- 1
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The low Dk, Df surface modification of silica filler in the high speed and high frequency applicationsQiang, Qianqian / Du, Xiaomeng / Yang, Liu / Li, Haojun / Zhao, Tao / Zhu, Pengli / Sun, Rong / Wang, Ning et al. | 2023
- 1
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A novel ultra-thin vapor chamber based on graphite copper-clad film for thermal management in electronic devicesLiang, Yifu / Bai, Jingjing / Liu, Xiaolong / Xiao, Shengrong / Yuan, Xuepeng / Tang, Yong / Yan, Caiman et al. | 2023
- 1
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FOStrip Technique for Low-Cost Fan-Out PackageLin, I-Hung / Chen, Yu-Tai / Huang, Ji-Ting / Lu, Hsiang-Hua / Pan, Ying-Chieh / Wang, Chien-Hui / Ni, Tom et al. | 2023
- 1
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Research on the improved FCS-MPC strategy for Photovoltaic grid connection Based on the O-Z source inverterXu, Weiqi / Lu, Min / Liu, Chen / Shao, Jixin et al. | 2023
- 1
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Design and Implementation of FPGA-based Digitally Controlled Quadratic Buck ConverterZhao, Yanming / Cen, Honglei / Nie, Jing / Liu, Zichen / Cai, Qiang et al. | 2023
- 1
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Study on the Effect of Manual Splitting on Thermal Fatigue Reliability of PBGA Solder JointsXie, XiaoChuan / Tang, GuoBao / Chen, JunShuai / Chen, YeJun et al. | 2023
- 1
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Study on Micro-silver Joint Doped with Silicon Carbide Nanowires for Power ElectronicsLi, Mu-Lan / Huang, Shijun / Chen, Zehao / Liu, Jingwen / Yan, Longlong / Li, Cai-Fu et al. | 2023
- 1
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Temperature prediction model of sheep barn in winter based on Neural NetworkCen, Honglei / Li, Jingbin / Liu, Zichen / Nie, Jing / Cai, Qiang et al. | 2023
- 1
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A high-performance visible framing ICCD camera base on the image intensifierZheng, Jinkun / Chen, Zhen / Qin, Wenqiang / Qin, Junjun / Bai, Yonglin / Wang, Bo et al. | 2023
- 1
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The EBG Structure for Mutual Coupling Suppression Between Antenna UnitsDan, Xie / Bo, Sun et al. | 2023
- 1
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Structure Optimization Design of Interfacial Failure Resistance for Composite Film in Flexible ElectronicsRuan, Hongshi / Xu, Yangjian / Ju, Xiaozhe / Chen, Xing / Liang, LiHua et al. | 2023
- 1
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Development of high reflectance insulating film materials for packaging semiconductor optical devicesChen, Wei-Su / Wang, Yun / Huang, Shiqiao / Li, Zheng / He, Dandan / Zhang, Jianwei / Twan, Evan / Liu, Xin / Chen, Ziming et al. | 2023
- 1
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Simulation of performance and reliability of nanocopper paste in power device packagingWang, Tongtong / Xu, Liang / Zhu, Pengli / Zhao, Tao / Sun, Rong et al. | 2023
- 1
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Copper Raw Material with Elongation Factor to Improve Delamination PerformanceLi, Linda / Ng, Kim / Li, Tina et al. | 2023
- 1
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Study on Effect of Sintering Temperature on Decomposition Process of Organic System and Evolution of Sintered TissuesWang, Liang / Li, Hao / Xu, Wenjie / Yang, Fengtao / Cheng, Zizhen / Wang, Laili et al. | 2023
- 1
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Underfill Flow Numerical Simulation for Achieving Board Level Low Cost and High Reliability of Mobile DevicesJiang, Yiming / Shi, Hongbin / Lv, Xiang et al. | 2023
- 1
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Full-spectrum White Light-emitting Phosphor-in-Glass for blue LED chips by adding Green-Emitting CaY2ZrScAl3O12:Ce3+ PhosphorYi, Sicheng / Wang, Bin / Yang, Liang / Xue, Junlin / Han, Taiping / Wang, Yan / Xie, An / Cao, Chunyan et al. | 2023
- 1
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Time-Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS TechnologyZhang, Yaqian / Mo, Jiarui / Vollebregt, Sten / Zhang, Guoqi / May, Alexander / Erlbacher, Tobias et al. | 2023
- 1
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Complicated-trajectory Compartment EMI Shielding in SiP Modules by Dispensing TechnologyZhang, Xiaofei / Wu, Hao / Zhang, Baotan / Sun, Rong et al. | 2023
- 1
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Power noise coupling simulation of DDR4 for FCBGA PackagingZhang, Jianguo / Meng, Xie / Chen, Qiang / Pang, Jian et al. | 2023
- 1
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Study on the effects of surface hydroxyl of silica fillers on the mechanical properties of underfillsZhang, Zhenguo / Yu, Xuecheng / Zhang, Leicong / Fan, Yixuan / Zhao, Danning / Sun, Rong / Li, Gang / Zhu, Pengli et al. | 2023
- 1
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Toward next generation interconnection technology: Ag/Cu sinter joining and their innovative applicationGao, Yue / Xin, Jianbo / He, Yiting / Zhang, Jing / Liu, Yang et al. | 2023
- 1
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Effect of Silane Coupling Agent on The Performance of Electrically Conductive AdhesivesChen, Mengmeng / Xu, Liang / Zhu, Pengli / Zhao, Tao / Sun, Rong et al. | 2023
- 1
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Effect of Cu content in the Ni-Cu under-bump metallurgy on the interfacial reaction between Ni1-xCux and Sn solderLi, Xiaofu / Xing, Jing / Chen, Xiangxu / Yao, Jinye / Ma, Haitao et al. | 2023
- 1
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Structural Analysis of Anisotropic Conductive Film for Liquid Crystal Displays and Semiconductor Packaging ApplicationsXu, Yadong / Wang, Yong / Liu, Xuebi / Lu, Xi / Lin, Zhiqiang / Wan, Yanjun / Li, Jianhui / Long, Haohui / Hu, Yougen / Sun, Rong et al. | 2023
- 1
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The Effect of Etching Lead Frame on QFN Package DelaminationLi, Yun / Li, Tina et al. | 2023
- 1
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Die Attach for Microelectronic Packaging: Copper Paste Comparison Between Pressure and Pressureless TechniquesLiu, Ran / Zhang, Zheng / Nishijima, Masahiko / Chen, Chuantong / Shimoyama, Akio / Sakamoto, Hirokatsu / Happoya, Akihiko / Suganuma, Katsuaki et al. | 2023
- 1
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Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplatingZhang, Ning / Li, Zhe / Wang, Rui-Xun / Liu, Zhi-Quan / Sun, Rong et al. | 2023
- 1
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Study on surge current characteristic of SiC SBD with different solder layer structureHu, Zheng / Wang, Yinjie / Zhao, Xiuchen / Huo, Yongjun / Tang, Yidan et al. | 2023
- 1
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Low Modulus Polyimide Coating on Wedge Bond to Improve Wire Bond Robustness in Thermal CyclingDong, Ou / Li, Zhiwen / Funke, Hans-Juergen / Fan, Haibo et al. | 2023
- 1
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Research on Thermal Resistance Simulation and Testing Technology of Ceramic Packaging PackageYang, Zhen-tao / Yu, Fei / Chen, Jiang-tao / Li, Peng et al. | 2023
- 1
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Optimizing conformal shielding scheme with quantitative analysisXinyu, Zhang / Jun, Li / Chenglin, Yang / Jian, Yuan / Huilin, An / Wenwen, Zhang / Minghao, Zhou et al. | 2023
- 1
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Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder JointLuo, Ming-Sheng / Wang, Hong-Guang / Chen, Bin / Lyu, Guang-Chao / Zhang, Xin-Ping et al. | 2023
- 1
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Effect of Thermal Interface Materials on Thermal Performance and Reliability of Large Size Flip ChipsSu, Jinyang / Lu, Siyuan / Wang, Canwen / Zhu, Wenhui / Wang, Liancheng et al. | 2023
- 1
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Experimental validation of a simple fractional model for viscoelastic behavior of high filled polymer-based compositesFan, Jianfeng / Wu, Weijian / Zeng, Xiangliang / Pang, Yunsong / Zhou, Yu / Sun, Rong / Zeng, Xiaoliang / Ren, Linlin et al. | 2023
- 1
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A Novel IGZO-TFT Device With High Dielectric Constant Sandwich Structure Gate Dielectric LayerWang, Yan / Han, Taiping / Yang, Liang / Wang, Bin / Xue, Junlin / Yi, Sicheng / Xie, An / Cao, Chunyan et al. | 2023
- 1
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Chlorine and sulfur effects on silver bonding wire reliabilityLiao, Jinzhi Loia / Wang, Bisheng / Zhang, Xi / Hua, Younan / Li, Xiaomin et al. | 2023
- 1
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Prediction of Packaging Induced-Warpage for a 3D Stacked Package with a Cure-dependent Viscoelastic Model for EMCWang, Han / Qin, Junjie / Wang, Guanglai / Chen, Danyang / Wu, Shangxian / Yang, Daoguo et al. | 2023
- 1
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Research on the electrical performance of flexible metal arraysGe, Chengqi / Huang, Caiping / Huang, ZhaoLing / Zhao, Guolin / Long, Houlin / Zeng, Qi et al. | 2023
- 1
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Simulation Study on Temperature Field of Packaged High Power GaN Laser DiodesLiao, Hui / Song, Chunyan / Yang, Ningxuan / Wang, Rui / Tang, Guanghui / Ji, Hongyu et al. | 2023
- 1
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Interconnection Performance of Copper Core Solder Joints in Ball-Grid-Array PackageWu, Qifan / Yin, Chunyan / Ming, Xuefei / Ke, Zheng / Zhu, Jiachang / Dou, Guangbin et al. | 2023
- 1
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The Influence of Welding Interfacial Voids on the Thermal Conductivity of Space-borne High-power ElectronicsZhang, Le / Zhong, Guisheng / Diwu, Dongchao / Wang, Rui / Chen, Zhengping / Jin, Zhansi et al. | 2023
- 1
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Thermo-Mechanical Fatigue Failure Simulation and Life Prediction of Solder Joints Using the Maximum Entropy Fracture ModelChen, Xing / Xu, Guixiang / Ruan, Hongshi / Shen, Chengkai / Ju, Xiaozhe / Xu, Yangjian et al. | 2023
- 1
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Improving Moldability by Regulating Thixotropy of Epoxy Molding CompoundsLiu, Xiang / Lu, Roger / Xie, Guangchao / Gu, Haiyong et al. | 2023
- 1
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Prediction of Electromagnetic Leakage from Circuits inside PackageTang, Si-Yao / Wei, Xing-Chang et al. | 2023
- 1
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Influence of Zn content on properties of Cu/SAC0307+xZn/Al joint by ultrasonic-assisted at low-temperatureLuo, Jie / Gan, Guisheng / Zhou, Jin / Yang, Hao / Ma, Yongchong / Chen, Siwen / Zhang, Jiajun / Xia, Daquan / Wang, Huaishan et al. | 2023
- 1
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Research on AI-Based Gold Removal Technology for Aviation Connector Cup Cavity SurfaceYongzhong, Zhang / Deru, Song / Jiachang, Li / Tianyi, Qin / Zhimin, Qie / Ruizhe, Zhang et al. | 2023
- 1
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Additive Fabrication of 3D Surface Conformal Circuits Using a Modified Screen-Printing TechnologyLi, Wenbo / Zhou, Qingzhong / Hou, Tianyu / Liu, Shujie / Li, Jianzhu / Li, Yujie / Guo, Hui / Yu, Xihan et al. | 2023
- 1
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Reliability Analysis and Evaluation of Epoxy Resin Adhesive for LED EncapsulationXu, Huanxiang / Gu, Jiabao / Zu, Gang / Tang, Yanhuang / Chen, Chengcheng / Liu, Zilian et al. | 2023
- 1
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Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulationFan, Yixuan / Peng, Liang / Zhang, Zhen'An / Li, Gang / Zhao, Danning / Zhang, Zhenguo / Sun, Rong / Zhu, Pengli et al. | 2023
- 1
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Design and H3TRB Test on 650V SiC-JBS DiodesLang, Lei / Luo, Houcai / Chen, Xianping et al. | 2023
- 1
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Characterization and modeling of interface delamination in 3D stacked package with combination of experimental and CZM analysisZhu, Cheng / Yang, Wen / Chen, Danyang / Qin, Junjie / Wang, Zijian / Yang, Daoguo et al. | 2023
- 1
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Study on cracking behavior of sintering silver joints based on cohesive zone modelYang, Rui / Dai, Yanwei / Qin, Fei et al. | 2023
- 1
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Effect of pre-welding pulse on microstructure and mechanical properties for parallel gap resistance welding joint of GaAs solar cell and Ag foilDing, Yuhan / Wang, Zhichao / Li, Xiaoran / Wei, Yi / Shen, Chen / Hua, Xueming / Wang, Min / Wang, Lin / Qian, Bin et al. | 2023
- 1
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Research on the electromigration failure of W interconnects under high-temperature environmentYong, Wang / Zeng, Jiantao / Liu, Xiaoyang / Fang, Yike / Liang, Lihua / Zhang, Yuanxiang et al. | 2023
- 1
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A digital image correlation study on the microstructure and strain behavior of electroplated nanotwinned copper as interconnection materialZhang, Zhiqiang / Li, Peifeng / Sun, Rong / Liu, Zhi-Quan et al. | 2023
- 1
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Effect of Young’s modulus on the reliability of sintered silver joints: simulation and experimentCheng, Kuifu / Zhong, Cheng / Zhang, Yuning / Xu, Liang / Liang, Xianwen / Lai, Zhiqiang / Liu, Dan / Zhao, Tao / Sun, Rong et al. | 2023
- 1
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Thermal and Reliability Study of Self propagating Reaction Interconnects in Microsystem IntegrationZhang, Tao / Zhou, Zheng / Feng, Chang Lei / Hu, Peifeng / Zhang, Wei / Yang, Li / Xia, JingChao / Wu, Peng / Qian, Jiang et al. | 2023
- 1
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Study of Residual Stress in Packaging Process on Solder Joint Life under Thermal ShockYu, Chang / Chen, Pei / Qin, Fei / Geng, Mingyu / Zhou, Xiangguo / Hua, Yongjie et al. | 2023
- 1
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Research on Board Level Reliability of Mounted Ceramic PackageZhang, Qian / Chen, Jiang-Tao / Yang, Zhen-Tao / Liu, Lin-Jie et al. | 2023
- 1
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High Speed SerDes Design on Flip Chip Package SubstrateZhuang, Ming-Han / Lai, Chia-Chu / Lin, Ho-Chuan / Shih, Chih Yuan / Kang, Andrew / Wang, Yu-Po et al. | 2023
- 1
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Study on Energy Management Strategy for Optical Storage Microgrid Considering Dynamic Load FluctuationYao, Fuyuan / Zhang, Xin / Chang, Xiqiang / Lin, Meng / Gong, Lijiao / Zhou, Weiji et al. | 2023
- 1
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Fabrication of Stretchable and Thermal Responsive Conductive Polymer Composites for Electromagnetic Interference ShieldingXu, Xinyun / Zhang, Zhen / Lin, Zhiqiang / Hu, Yougen / Sun, Rong et al. | 2023
- 1
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Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder jointsLi, Bofeng / Wang, Jundong / Yao, Yao et al. | 2023
- 1
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Sacrificial anode electroless plating of iron on Bi2Te3 and electrochemical analysis for thermoelectric interconnectionSun, DeZhu / Huang, XiLin / Zhu, LiMing / Liu, Wei / Deng, Xin / Hu, XiaoKai et al. | 2023
- 1
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Theoretical analysis and prediction for thermal stress of sintered silver interconnection structure based on modified Suhir's solutionWei, Jiahui / Dai, Yanwei / Qin, Fei et al. | 2023
- 1
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A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approachYuan, Haiyang / Li, Ce / Ma, Zhaolong / Zhang, Huizhe / Fan, Mengzhuo et al. | 2023
- 1
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Simulation and Performance Test of High Bandwidth PCB Based on Multichannel Vertical Interconnection High Frequency ConnectorWu, Miao / Wang, Dong / Jiao, Kai et al. | 2023
- 1
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The Study on Bulging Mechanism of Plastic Packaging Materials for ElectronicsGu, Jiabao / Tang, Yanhuang / Liang, Junhao / Xu, Huanxiang / Chen, Chengcheng / Liu, Zilian et al. | 2023
- 1
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Design and Research of Oval Flip Chip Solder BumpLi, Guoshuai / Zheng, Linghui / Wang, Lina et al. | 2023
- 1
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Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) methodChen, Zhikai / Liu, Peng / Ren, Jing / Huang, Mingliang et al. | 2023
- 1
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Effect of Zn Content on the Performance of Cu/SAC0307+xZn/Al Joints with Dual Ultrasound AssistanceMa, Yongchong / Gan, Guisheng / Zhang, Jiajun / Luo, Jie / Yang, Hao / Zhou, Jin / Chen, Siwen / Wang, Huaishan / Xia, Daquan et al. | 2023
- 1
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Verification of a Chinese Copper-system LTCCYang, Shicheng / Sun, Peng / Xu, Zepeng / Pang, Jin Biao / Xu, Meijuan / Lin, Zhuo et al. | 2023
- 1
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Transmission Structures Using Parylene C and TSV for Silicon-based Low-loss and Low-profile Heterogeneous Integrations at Ka-bandWang, Qi / Wen, Bo / Chen, Lang / Wang, Wei / Jin, Yufeng et al. | 2023
- 1
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A junction temperature prediction model for 3D stacked packaging chip based on thermal resistance matrixLiu, Jiahao / Chen, Fangzhou / Zhao, Hao / Xiao, Hui / Diao, He / Zhong, Xiangxiang / Wang, Fengyi / Liu, Hao / Guo, Xiaotong et al. | 2023
- 1
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A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive PropertiesZhang, Yexin / Lv, Xialei / Li, Jinhui / Zhang, Guoping / Sun, Rong et al. | 2023
- 1
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Research on Modeling and IP Technology for High-Speed Optical Interconnection Interfaces in Optoelectronic MicrosystemsWang, Haoyan / Ye, Yunong / Li, Wei / Wang, Zhiqiang / Liu, Jie et al. | 2023
- 1
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High-efficiency and low-loss thin film lithium niobate modulatorYang, Peng / Liu, Fengman / Sun, Siwei / Xue, Haiyun / Meng, Xiangxu / Cao, Liqiang et al. | 2023
- 1
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Analysis of Complex BGA Transition for Equivalent Circuit ModelingLi, Kangrong / Wang, Yanling / Yang, Qiao et al. | 2023
- 1
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Research for the development of advanced packaging material testing technology and standardizationSun, Zhaoning / Liu, Peijing / Chen, Chengcheng / Zhao, Zhenbo / Xiao, Meizhen / Zhao, Hao et al. | 2023
- 1
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Reliability Evaluation of Sintered AgNPs Strength Degradation: Influence of Microstructural Evolution during Thermal AgingWu, Zhaoxi / Su, Yutai / Duan, Chao / Cheng, Xiaoran / Long, Xu et al. | 2023
- 1
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UV light enhanced metal-assisted chemical etching of SiC triangular nanostructure arraysZhong, Yiming / Chen, Yun / Chen, Xin et al. | 2023
- 1
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Die Shift Simulation in Panel Level PackagingGu, Bin / Luan, Jing-En / Spini, Daniela / Zalaffi, Samuele / Rovitto, Marco / Chen, Chun-Hao et al. | 2023
- 1
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Wafer-level controllable graphene transfer and electrical characterizationCheng, Lu / Wang, Haopeng / Zhang, Wenyuan / Chen, Pengkun / Yuan, Kai / Mao, Yahui / Wang, Huaishan / Luo, Le / Zhang, Bin et al. | 2023
- 1
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Research on TSV Stress of Ultra-thin Optical Fingerprint ChipHu, Jinjin / Gao, Chenshan / Liu, Lei / Chen, Ruitian / Li, Jun / Zhang, Qiangbo / Ye, Huaiyu et al. | 2023
- 1
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Optimizing surge current capability of small-signal SBD device based on Fan-out Panel Level PackagingLuo, Xudong / Shao, Dongdong / Ding, Kunpeng et al. | 2023
- 1
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Using Stacked Inverse-Reflective Cup Structure to Improve Vertical Light Output and Ambient Contrast Ratio of Light Emitting Diode Display DeviceHe, Chonghui / Zhang, Yunlong / Li, Jiasheng / Li, Zongtao et al. | 2023
- 1
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Condition monitoring of SiC power assembly by using time-series analysis of acoustic emission during power cycling testsZhang, Zheng / Shimizu, Fu / Matsubara, Yasuko / Suetake, Aiji / Chen, Chuantong / Sakurai, Yasushi / Suganuma, Katsuaki et al. | 2023
- 1
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Research on heat dissipation performance of double-sided cooling IGBT moduleHuang, Zuoyi / An, Tong / Qin, Fei / Gong, Yanpeng / Dai, Yanwei / Wang, Zhen et al. | 2023
- 1
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Understanding Heat Diffusion Solvers for Electronic and Microelectronic EngineersGao, Bo / Zhang, Li / Zhang, Chunguang / Ling, Yan et al. | 2023
- 1
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Stealth dicing of SiC using femtosecond laser Bessel beamLi, Shaowei / Chen, Pei / Qin, Fei / Tu, Senyu / Wu, Kunzhou et al. | 2023
- 1
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Copper submicron particle pastes with organic compounds as anti-oxidative additive for Cu–Cu bonding in airWang, Xiaocun / Xiao, Fei et al. | 2023
- 1
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A ReaxFF molecular dynamics study on the mechanism of material removal from 4H-SiC substrate in chemical mechanical polishingXue, Lianghao / Tian, Zhiqiang / Gao, Bing / Liu, Sheng et al. | 2023
- 1
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Effects of Plasma Treatment on Adhesion and Flow Behavior of Underfill in 2.5D Electric PackageYang, Yuanyuan / Fan, Yixuan / Zhu, Caiping / Zhang, Ruoyu / Yang, Jinbao / Chen, Jing / Xie, Liangjun / Li, Gang / Zhu, Pengli et al. | 2023
- 1
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Effect of isopropyl alcohol, acetic acid and sodium dodecyl sulfate on the etching rate and surface roughness of Z-cut quartz etched by BOE solutionGuangbin, Dou / Yike, Zhou / Yide, Dong et al. | 2023
- 1
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Direct soldering of 5A06 Al alloy using a Ti alloy mesh reinforced SAC305 composite solderXu, Xing / Xi, Bangfu / Chen, Gaiqing / Xiao, Yong et al. | 2023
- 1
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Low-temperature direct bonding of strengthened glass chips for optical imaging and co-packaged opticsDu, Yu / Liu, Linjie / Zhang, Xuming / Wang, Chenxi et al. | 2023
- 1
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A Subpixel Edge detection algorithm to test the accuracy of Semiconductor Packaging EquipmentJin, Shikang / Zhou, Wei et al. | 2023
- 1
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Highly conductive stable grid electrode via electroplating Ni on EHD-printed patternsMa, Jingxuan / Zhang, He / Hu, Xuanyi / Feng, Jiayun / Wen, Jiayue / Tian, Yanhong et al. | 2023
- 1
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Electroless amorphous Ni-Cu-P deposit and the interaction between Ni-Cu-P barrier and Sn solderXing, Jing / Xiao, Siyuan / Li, Xiaofu / Yao, Jinye / Chen, Xiangxu / Ma, Haitao et al. | 2023
- 1
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In-situ observation of microscale crack-tip strain field evolution in underfill with different toughening agents via SEM-DIC coupled methodYu, Xuecheng / Zhang, Zhenguo / Li, Gang / Zhu, Pengli / Sun, Rong et al. | 2023
- 1
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Studies of Atomic Force Microscopy and Application in Advanced Packaging, Materials Characterization and Failure AnalysisHua, Younan / Liao, Lois / Zhu, Lei / Zhang, Linhua / Luo, Xiaodan / Zhao, Yanfei / Wu, Meihua / Li, Xiaomin et al. | 2023
- 1
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Welding process expert system based on Industrial Internet and neural networkXie, XiaoChuan / Sun, ShengJie / Chen, JunShuai / Liu, JunCheng / Lan, HaiPing et al. | 2023
- 1
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Fabrication of Ultra-thin Conformal EMI Shielding Coatings on SiP Modules by Inkjet Printing TechnologyWu, Hao / Zhang, Xiaofei / Zhang, Baotan / Sun, Rong et al. | 2023
- 1
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Study on Defect Detection and Impact on Heat Dissipation in Nanosilver SubstratesLiu, Mengyuan / Cai, Miao / Luo, Yinyin / Wei, Jinxiu / Yun, Minghui / Yang, Daoguo et al. | 2023
- 1
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Development and Prospect of Coaxial Through-Silicon Via in 3D Integrated CircuitsJunkai, Ma / Guangbao, Shan / Guoliang, Li / Zheng, Liu / Weihua, Fan et al. | 2023
- 1
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A fast and simple method to place sub-die under Chip-let architecture based on thermal simulationCao, Jiangcheng / Man, Hongtao / Wu, Xiaohu et al. | 2023
- 1
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Enhancing the Interface Adhesion and Reliability Study of High Tg EMC and Substrate for Multichip PackageWang, Bei / Cai, Yaqi / Liu, Zuyao / Li, Juanjuan / He, Michael / Liu, Lu et al. | 2023
- 1
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Design and characterization of novel doped heterostructured electromagnetic shielding packaging materials for Current sensor chip applicationsHuang, Haichao / Wang, Shuaipeng / Chen, Yanning / Fu, Zhen / Li, Yongfu / Jiang, Xiping et al. | 2023
- 1
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Accurate Assessment of Young's Modulus of Sintered Ag Joints by NanoindentationZhang, Yuning / Xu, Liang / Zhu, Pengli / Zhao, Tao / Sun, Rong et al. | 2023
- 1
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Epoxy adhesive of high Tg for electronic packaging with stress relaxation and self-healingXu, Hui / Luo, Yanzhe / Sun, Zhibo / Mao, Zhu / Chen, Jifeng / Tian, Bo / Zhu, Pengli / Sun, Rong et al. | 2023
- 1
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Thermal fatigue behavior of Cu/Co-P/Sn/Co-P/Cu solder joint interface with crystalline/amorphous Co-P coatingLiu, Shuang / Ma, Limin / Zhen, Cheng / Guo, Fu et al. | 2023
- 1
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Micro Solder Defect Inspection Using Infrared Sequence and Deep Learning Omni-scale CNNJiang, Ye / Liu, Zhiyong / Liao, Guanglan et al. | 2023
- 1
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Preparation and characterization of submicron silver particles with the nanoscale surface structure for high-reliability packagingDong, Bolong / Zhang, Le / Yang, Fan / Zhou, Qihang / Zhu, Wenbo / Du, Jianjun / Li, Mingyu et al. | 2023
- 1
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Study on Reflow Warpage Deformation of High Pin Density BGA Devices Affected by MoistureXu, Haoyang / Lyu, Xianliang / Wang, Yicai / Wu, Fengshun / Zhou, Longzao / Zhou, Hao et al. | 2023
- 1
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Effect of Er and Ni-CNTs on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layersLi, Qi / Gao, Haitao / Zhang, Xueying / Liu, FengMei / Cai, Zhihong / Yi, Jianglong et al. | 2023
- 1
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The correlation between the microstructure and mechanical property of low temperature sintering nano Ag pasteZhou, Qihang / Yang, Fan / Dong, Bolong / Du, Jianjun / Li, Mingyu et al. | 2023
- 1
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A Novel Band-pass Filter in Ka Band with SiP PackagingQin, Junjie / Wang, Han / Chen, Danyang / Zhu, Cheng / Wang, Guanglai / Yang, Daoguo et al. | 2023
- 1
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A novel lead-free NaNbO3-based relaxation ferroelectric ceramics for energy storage applicationXiao, Jiaming / Yun, Yaoyao / Cai, Xinhong / Zhou, Weiji / Zeng, Zhaoquan / Li, Hongwei / Li, Baoqing / Niu, Lei / Zhang, Ling et al. | 2023
- 1
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Phosphor-in-glass film on AlN substrate for high-luminance white laser LightingYu, Zikang / Peng, Yang / Chen, Mingxiang et al. | 2023
- 1
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A Novel No-Clean Type 5 SAC305 Solder Paste Reflowed under Air AtmosphereBai, Jinjin / Lu, Xiaoqin / Chen, Fen / Liu, Yan et al. | 2023
- 1
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Study on the failure mechanism and characteristics of electrochemical migration of electronic package structures in humid environmentXi, Yuchen / Zhang, Guoxu / Jia, Fei et al. | 2023
- 1
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Accurate Identification of Viscoelastic Constitutive Equation of Thermal Interfacial MaterialsZhou, Yu / Lu, Xiaoxin / Ding, Shengchang / Rong, Sun / Lu, Jibao et al. | 2023
- 1
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Effects of silver paste glass additive composition on co-firing behavior of silver conductor LTCC packageLiu, Zhuofeng / Liang, Wenxue / Li, Wei / Xun, Yan / Wang, Fenglin / Zhang, Weijun et al. | 2023
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Integrated Data Acquisition Module based on CPO packagingLv, Xiaomeng / Xibin, Li / Shaoyong, Chen / Xu, Weihua / Yangzhi, Liu / Wu, Yilong / Yunke, Zhu / Tao, Zhou et al. | 2023
- 1
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A Cooling System based on Wafer-level Microfluidic Channels for the System-on-Wafer Packaging ApplicationCao, Rong / Liu, Guandong / Li, Jie / Wang, Weihao / Wang, Chuanzhi / Liu, Lingling / Duan, Yuanxing et al. | 2023
- 1
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Mode I fracture of graphene reinforced Sn-Ag-Cu solder jointsWang, Jianfeng / Dai, Yanwei / Qin, Fei / Li, Kui et al. | 2023
- 1
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A Comprehensive Study on Signal Integrity of Build-up Film Applied to IC SubstrateZhong, Cheng / Chen, Wenbo / Kong, Weikun / Yu, Shuhui / Lu, Jibao / Sun, Rong et al. | 2023
- 1
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Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi SolderShen, Zesheng / An, Yuxuan / Xiong, Zishan / Tu, King-Ning / Liu, Yingxia et al. | 2023
- 1
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Package Warpage and Low-k Stress Investigation under Thermo-Compression Bonding with Non-Conductive Paste ProcessLu, Siyuan / Wang, Canwen / Su, Jinyang / Chen, Huapeng / Zhu, Wenhui / Wang, Liancheng et al. | 2023
- 1
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Hansen solubility parameter optimization of surface modified silica filler in electronic packaging materialsYang, Liu / Li, Haojun / Qiang, Qianqian / Du, Xiaomeng / Zhao, Tao / Zhu, Pengli / Sun, Song / Wang, Ning et al. | 2023
- 1
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Deposition Efficiency Study on Wafer Level Gold Plating based on Cyanide-free ElectrolyteJia, Zhaowei / Sheng, Junwei / Yang, Sen / Wang, Jian / Wang, David et al. | 2023
- 1
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Influence of Cu heat sink on heat dissipation of QFN packageMa, Haoqin / Yuan, Ziyi / Ding, Dongyan / Yew, Cheekiang et al. | 2023
- 1
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Analysis of the Transformation Characteristics of Primary and Secondary Fusion Switch Matched Instrument Transformer in Flexible Interconnected Distribution NetworkLi-Sheng, Li / Hai-Dong, Yu / Bin, Wang / Yang, Liu / Shi-Dong, Zhang / Min, Huang et al. | 2023
- 1
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Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layerZhao, Shuaijie / Chen, Chuantong / Haga, Motoharu / Ueshima, Minoru / Suzuki, Hirose / Takenaka, Hiroto / Suganuma, Katsuaki et al. | 2023
- 1
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Application of ANSYS Sherlock in the fatigue lifetime evaluation of board level solder jointYang, Mengke / Li, Qiuxi / Wang, Xiaowei / Chen, Zhiyun / Jiang, Xiaoying / Zhang, Queenie Zheng / Tan, Biao et al. | 2023
- 1
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A Micro-hotplate for MEMS Gas Sensor Wafer Level PackagingZhang, Zhaohua / Zhao, Xuewei / Wang, Deyan / Duan, Guotao / Xing, Chaoyang et al. | 2023
- 1
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Comparative analysis of different microfluidic cooling technologies for high performance chipsFeng, Jianyu / Chen, Chuan / Fu, Rong / Cao, Liqiang et al. | 2023
- 1
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The Effect of Silane Coupling Agent on Viscosity and Mechanical Properties of TIM1Wen, Zhibin / Ai, Daifeng / Mo, Pingjing / Mai, Zhixin / Ren, Linlin / Zeng, Xiaoliang / Sun, Rong et al. | 2023
- 1
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Characterizing the Radiation Degradation of Metal Can Packaged Bipolar Transistor*Liu, Mohan / Lu, Wu / He, Chengfa / Guo, Qi et al. | 2023
- 1
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Reliability Prediction of PBGA Solder Joint under High Temperature Torsional Composite Loading Based on BP Neural NetworkLiu, Shoufu / Zhang, Chi / Zhou, Shuai / Jiang, Zhuohao / Li, Tianjing / Zhang, Xiaofei / Ma, Chi et al. | 2023
- 1
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Stacked circuit packaging method of multichip SiC MOSFET power modules for electrical performance improvementChen, Hong / Qiu, Xiangqi / Lu, Pengfei / Wei, Song / Li, Ruifeng et al. | 2023
- 1
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Design of inductor winding structure based on non-uniform distribution of magnetic flux densityBao, Yiying / You, Xiangan / Zhou, Yunyan / Zhang, Wenwen / Hou, Fengze et al. | 2023
- 1
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The prediction of orthotropic material properties for RDL based on effective modeling and CNNHaozhou, Wang / Zhao, Fu / Jun, Wang et al. | 2023
- 1
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Case analysis on the fracture of deformed leads of the ceramic flat packageWang, Zhibin / Sun, Jiajia / Li, Guangyao et al. | 2023
- 1
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The reliability study on electrochemical migration evaluations for common substrates in power electronicsYang, Mingkun / Zhang, Donglin / Cao, Chenrui / Xu, Tao / Tian, Xin / Zhao, Xiuchen / Huo, Yongjun et al. | 2023
- 1
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Preparation and sintering performance of micro-nano hybrid copper particles for third-generation semiconductor package interconnectsYang, Kai / Zhang, Yu / Huang, Zhongwei / Peng, Linfeng / Huang, Guanghan / Cui, Chengqiang / Yang, Guannan et al. | 2023
- 1
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Strain Engineering for Modulating Electronic and Optoelectronic Properties of Monolayer InSeXu, Siyuan / Sun, Tuobei / Li, Junfeng / Lin, Tao / Yang, Huiru / Ye, Huaiyu et al. | 2023
- 1
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The Prediction of the Solder Ball Crack Based on Artificial Neural Network Using S ParametersWang, Huanpeng / Xu, Yuehang et al. | 2023
- 1
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Meso-scale crystal plasticity modeling of sintered silver nanoparticles in typical interconnected structuresLong, Xu / Chong, Kainan / Chang, Chao / Su, Yutai et al. | 2023
- 1
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Analysis of the influence of dispensing on the reliability of CCGA solder jointsChen, Xiaodong / Zou, Yabing / Lu, Tao / He, Xiao / Liu, Jiahao et al. | 2023
- 1
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Lifetime model of copper pillar micro-bump interconnects under bi-directional pulse current stressFu, Zhiwei / Hao, Tongsen / Xiao, Qingzhong / Xu, Jile / Zheng, Bingjie / Yang, Jia-Yue et al. | 2023
- 1
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Research on Acceleration Test Model and Parameter Determination Method of Integrated CircuitDeng, Chuanjin / Zha, Wenjie / Chen, Kaibin / Lv, Hongfeng et al. | 2023
- 1
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Mechanical properties of IGBT module under Temperature Shock Test considering residual stressWang, Rui / Liu, XuGuang / Yang, JinLong / Luo, Jian / Shi, YuChao / Wu, Jing et al. | 2023
- 1
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Achieving Non-underfill SMT Process for Large Size Packages by Creative Package Pin Map and PCB Pad DesignsShi, Hingbin / Yang, Chao / Zhang, Jianrui et al. | 2023
- 1
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SEM study on the mechanism of electromigration induced Sn alloy solder joints failureLiu, Qingyi / Du, Tongcheng / Su, Fei et al. | 2023
- 1
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Study on Reliability of Hard-Lap Solder Joints of Microwave RF Coaxial ConnectorsXiaowei, Sun / Geng, Li / Wenyu, Wu et al. | 2023
- 1
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Copper electroplating of through silicon vias (TSV) using a series of nitrogen-containing heterocyclic compoundsChen, Ke-Xin / Gao, Li-Yin / Sun, Rong / Liu, Zhi-Quan et al. | 2023
- 1
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Heat dissipation technology of GaN power Amplifier based on diamond carrierJi, Naiyi / Zhou, Hongda / Zhang, Lixiang / Zhao, Yongzhi / Li, Zhiqiang / Liu, XiXi et al. | 2023
- 1
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Study on the effect of solder flux on the reliability of ceramic PackageYang, Zhen-tao / Yu, Fei / Chen, Jiang-tao / Ren, Hao-di et al. | 2023
- 1
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Research on Intelligent Detection Method for IC Surface Defects Based on Convolutional Neural NetworkZhao, Yue / Lv, Hongfeng / Wang, Zhizhe / Luo, Jun et al. | 2023
- 1
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Microstructure and properties of Sn3.0Ag0.5Cu micro-bumps with nickel-coated graphite and nickel-coated carbon fibers additionsDu, Yihui / Ji, Xiaoliang / Wang, Yishu / Guo, Fu et al. | 2023
- 1
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Simplified Evaluation on Cooling Performance of Silicon Microfluidic InterposerYu, Miao / Huang, Min / Zhu, Jian et al. | 2023
- 1
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Reliability study of Through Glass Vias under high current densityXiang, Junshan / Chen, Hongtao / Wang, Haozhong / Yang, Xiaofeng et al. | 2023
- 1
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Design of Optoelectronic Chip Packaging and Integration Method Based on SiP TechnologyXuan, Hui / Xiaoyong, Miao / Guohua, Gao et al. | 2023
- 1
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Research on the welding technology of T/R components assembled with SIP mouldsLiu, Zhidan / Zhao, Zhiping / Zhang, Fei / Chen, Shuai et al. | 2023
- 1
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A Critical Assessment of graphene based heat pipes for electronics and power module cooling applicationsShen, Zhiyang / Zhang, Hongfeng / Nkansah, Amos / Chen, Jiajia / Chen, Jin / Liu, Johan et al. | 2023
- 1
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Power Supply Design and Application Based on Piezoelectric EffectMa, Xinxin / Gong, Lijiao / Guo, Wangwang / Yang, Tong et al. | 2023
- 1
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3D FO package technology using bridge die for high number of chiplets integrationZhuang, Jiaming / Li, Shangxuan / Zhang, Xc / Chen, Ivan / Chen, Bruce / Hsieh, Simon / Yang, Bohan / Chung, C. Key / Xia, Xin et al. | 2023
- 1
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Study of the effect of Si/Dia interface structure on heat dissipationWu, Yufeng / Xie, An / Jian, Xiaodong / Yang, Xiaofeng et al. | 2023
- 1
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On-Die Power-Rails Isolation Using Package Loop InductanceHuddar, Vinod Arjun / Park, Shinyoung et al. | 2023
- 1
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Electrical Performance Enhancement Solution with FO-EB in HPC ApplicationSu, Po Yuan James / Ho, David / Wang, Yu Po / Pu, Jacy / Shih, Teny / Lin, Sam et al. | 2023
- 1
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The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array MicrosystemHuang, Lichang / Jiang, Mankai / Xu, Xiaobin / Chen, Jinxing / Xu, Sha / Cao, Yunfei et al. | 2023
- 1
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Experimental study on the growth behavior of Ni3Sn4 intermetallic compound within single-layer SnAg micro solder bumps considering ultra-long timeWang, Yuexing / Zhang, Xiangou / Cao, Linwei / Sun, Xiangyu / Li, Shun / Yao, Zhifeng et al. | 2023
- 1
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Design of a Miniature High-Gain Quasi-Resonant Flyback ConverterJiang, Peixuan / Yang, Renbin / Wang, Jialu / Gao, Yuheng / Gao, Bo / Chen, Xianping et al. | 2023
- 1
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Research on NonLinear Active Disturbance Rejection Controller for Permanent Magnet Synchronous Linear Motor*Rao, Huan / Liang, Wen / Zhou, Quan / Qiu, Guofu / Ren, YiKun et al. | 2023
- 1
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Microstructure evolution and fracture mechanism of sintered nano-Ag joints on bare copper during high temperature agingZhou, Qihang / Yang, Fan / Du, Zhipeng / Du, Jianjun / Li, Mingyu et al. | 2023
- 1
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Selective Laser-induced Etching of Borosilicate Glass In Hydrofluoric AcidZhan, Yue / Yin, Kuibo / Nie, Meng / Dou, Guangbin et al. | 2023
- 1
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Simulation and Optimization of Large Scale Multiport Power Supply Noise for 2.5D ICYang, Chenxi / FengWu, FengWu / Zhang, Jiangtao / Zhang, Jianguo et al. | 2023
- 1
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Influence of voids in solder layer on the reliability of the IGBT die attached interconnection under temperature shockJiang, Danlei / Zhou, Longzao / Wu, Fengshun / Ding, Liguo / Li, Kewei / Li, Xuemin et al. | 2023
- 1
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Finite element analysis of board-level drop reliability of WLCSP solder joints with eutectic Sn-Bi, hybrid Sn-Bi/Sn-Ag-Cu and Sn-Ag-Cu soldersWang, Zhiyi / Zhu, Lin / Huang, Mingliang et al. | 2023
- 1
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Influences of bonding process parameters on mechanical properties of the Micro-LED deviceWang, Kefeng / Zhong, Han / Chen, Zehua / Zhou, Haojie / Ji, Xiaoxiao / Lu, Xiuzhen / Yin, Luqiao / Zhang, Jianhua et al. | 2023
- 1
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Effect of Filler Particle Size and Surface Functionalization on the Properties of Thermal GreaseZeng, Xiangliang / Fan, Jianfeng / Rao, Shipeng / Ren, Linlin / Zeng, Xiaoliang / Sun, Rong et al. | 2023
- 1
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High-Throughput Screening Modeling for Exploring Low-k Dielectric Constant CrystalsGuo, Zikang / Wu, Yunwen / Su, Hongwei / Huang, Qing / Ju, Shenghong et al. | 2023
- 1
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Surface Protecting and Particles Removing after Wafer Sawing for Die-to-wafer Hybrid BondingWang, Hao / Liu, Ziyu / Wang, Wenchao / Zhu, Hao / Chen, Lin / Sun, Qingqing et al. | 2023
- 1
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Effect of Zr4+ doping on electrical property of BaTiO3-based MLCC with high-voltageWang, Chun / Huang, Xiong / Zhang, Lei / Sun, Rong / Yu, Shuhui / Fu, Zhenxiao / Cao, Xiuhua et al. | 2023
- 1
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Location Identification Method for Soldering Devices of SMT Based on ConvRes-UNetYang, Yiqing / Zhang, Qiang / Pan, Kailin et al. | 2023
- 1
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Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light CouplingLiu, Xiaofeng / Miao, Hua / Wang, Guodong / Yao, Tengfei / Liu, Jianhui / Sun, Rong et al. | 2023
- 1
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Research on PID parameter self-tuning and feedforward control of precision X-Y motion platform for wire bonding machineLiang, Wen / Rao, Huan / Zhou, Quan et al. | 2023
- 1
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Microstructural evolution and thermal fatigue reliability of Sn-Ag-Cu/Sn-Bi-Ag hybrid BGA solder joints assembled by low-temperature solderingLiu, Shanhong / Ren, Jing / Huang, Mingliang et al. | 2023
- 1
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Research of 3D-TSV crystal plastic constitutive and Optimization of electroplated copper fillingHou, Kaihong / Fan, Zhengwei / Chen, Xun / Zhang, Shufeng / Yu, Dianlong / Wang, Yashun et al. | 2023
- 1
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Laser-induced processing of thermal cloaks enabling heat shieldingWen, Guanhai / Chen, Jingtao / Yan, Lu / Hou, Maoxiang / Ma, Li / Chen, Yun / Chen, Xin et al. | 2023
- 1
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Effect of the toughening agent and coupling agent on the Liquid Epoxy Molding CompoundWei, Chunxiang / Liu, Mingqiang / Liu, Xin / Luo, Yanjie / Zhu, Pengli / Ai, Wenji et al. | 2023
- 1
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Chemical Reduction Preparation of Multi-Morphology Micro-Nano Silver Powders and their Performance in Solar Cell Conductive Silver PastesTang, Siwei / Li, Panzheng / Dong, Haonan / Huang, Zhe / Ma, Yunzhu / Liu, Wensheng et al. | 2023
- 1
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Embedded Wafer-level Microfluidic Cooling Designs for The System on Wafer PackagingLi, Jie / Liu, Guandong / Wang, Weihao / Cao, Rong / Wang, Chuanzhi / Liu, Lingling et al. | 2023
- 1
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Optimization of Wafer-level TTV Using RIE Applied for the Extreme Wafer ThinningLi, Jinzhu / Liu, Ziyu / Wang, Wenchao / Wang, Yang / Chen, Lin / Sun, Qingqing et al. | 2023
- 1
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The microstructure of Cu joint soldered with a new Cu coated Ni foam reinforced Sn composite solderHe, Huang / Tan, Kewei / He, Yingxian / Zhao, Lei / Wang, Wen / Xiao, Yong et al. | 2023
- 1
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Structural design and optimization of rectifier module based on copper-clip bonding technologyWei, Jinxiu / Gao, Yongjie / Cai, Miao / Yun, Minghui / Liu, Mengyuan / Yang, D.G. et al. | 2023
- 1
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Strain Threshold Test and Case Analysis of THT ComponentTian, Wanchun / Wang, Shiyu / Liu, Peijiang / Liu, Jiahao / Wu, Jingxi / Zhao, Hao et al. | 2023
- 1
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A Study on Transmission Loss of Build-up Film Applied to IC SubstrateKong, Weikun / Chen, Wenbo / Zhong, Cheng / Chu, Baojin / Li, Baozhong / Yu, Shuhui et al. | 2023
- 1
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Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packagingSun, Zhanxing / Ding, Fei / Ma, Rui / Wang, Qidong / Jing, Xiangmeng / Su, Meiying / Cao, Liqiang et al. | 2023
- 1
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A Combined Experimental and Analytical Study of Residual Strains Developed in Encapsulated StructuresLi, Xiang / Zhong, Hua / Zhao, Xianhang / Liu, Xin / Li, Yuefang et al. | 2023
- 1
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Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder JointTian, Xinwei / Chen, Shi / Qiao, Yuanyuan / Zou, Longjiang / Zhao, Ning et al. | 2023
- 1
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Investigation on the Influence of Frame Structure on Substrate Stress in IGBT ModulesLi, Xiaodong / Li, Helong / Wang, Dingyi / Pan, Nian'An / Zhang, Zhongbiao et al. | 2023
- 1
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Design of Spacer in Silicon Carbide Double-Sided Cooling Packaging Based on Multiphysics Finite Element Topology OptimizationCheng, Zizhen / Cui, Hongchang / Zhu, Mengyu / Zhang, Hong / Yang, Fengtao / Xu, Wenjie / Wang, Laili et al. | 2023
- 1
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A 3D Crystal plasticity finite element model for a 3D package under drop impactLiu, Shijiao / Cheng, Yujie / Gan, Linhai / Hu, Shanwen / Cai, Zhikuang / Liu, Lu et al. | 2023
- 1
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The Effect of Pore Defects on the Interfacial Thermal Resistance of GaN-Diamond HeterostructureYang, Chao / Zhao, Pengfei / Wang, Jian / Ma, Dezhi / He, Zhiyuan / Fu, Zhiwei / Yang, Jia-Yue et al. | 2023
- 1
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A High Density QFP With Hybrid LeadMa, Milan / Pang, X.S. / Yao, J.Z. / Bai, Denis / Luo, Yongchao et al. | 2023
- 1
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The Adhesive Strength Measurements and Analysis of Phase Change Thermal Interface MaterialYang, Min / Li, Junhong / Pang, Yunsong / Zeng, Xiaoliang et al. | 2023
- 1
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Design and Integration Approach of Low-Inductance Vertical Interconnection Structure for Gallium-Nitride High Electron Mobility TransistorsFan, Yinxiang / Yan, Haidong / Yang, Daoguo / Li, Wangyun / Liu, Chaohui / Zhang, Yakun et al. | 2023
- 1
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Double-decker silsesquioxane-doped benzocyclobutene functionalized siloxane polymer for low k materialsHe, Jianhao / Cai, Jing / Tian, Shichang / Cheng, Yuanrong et al. | 2023
- 1
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Investigation on Silver Nanowire/Resin-Induced Liquid Crystal Polymer MetallizationZhang, Yongjiang / Lai, Zhiqiang / Liu, Dan / Zhao, Tao / Liang, Xianwen / Sun, Rong / Fu, Xianzhu / Wang, Ning et al. | 2023
- 1
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Sidewall Chipping Investigation & Challenges on 100um Thin Low-K Wafer with DAFXia, Hongbin / Wu, Yongbing / Yuan, Linna et al. | 2023
- 1
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Stress-strain analysis and optimization of laminated solder joints under random vibration load based on Taguchi and grey correlation methodWu, Liye / Huang, Chunyue / Liu, Xiaobin / Wang, Lilin / Liu, Xianjia / Zhang, Huaiquan et al. | 2023
- 1
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Enhanced Thermal Conductivity of Epoxy Adhesive Films by Filling Surface-Modified AlNXu, Yuping / Xu, PengPeng / Li, Peng / Ma, Peilin / Yang, Jie / Chu, Baojin / Luo, Suibin / Yu, Shuhui et al. | 2023
- 1
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Optimization of Mason Model in Thin Film Bulk Acoustic Resonators with Extra Passivating Piezoelectric StructuresWen, Bo / Zhao, Tengda / Wang, Qi / Du, Jianyu / Wang, Wei et al. | 2023
- 1
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Study of flip ultrasonic bonding process with Non-conductive pasteLiu, Haoming / Guo, Hengtong / Xu, Shimeng / Xie, Xiaochen / Lin, Pengrong / Zhang, Yuyi / Chen, Zhuo / Wang, Fuliang et al. | 2023
- 1
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Optimization and Research on Warpage of Ultra-thin SubstrateWei, Qiang / Yang, Huan / Ma, XiaoJian / Liu, Weidong / Wang, JiaChen / Wang, PengKai et al. | 2023
- 1
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Thermal reliability analysis of M3D based on artificial neural network in multi-physics fieldZhang, Sixiang / Zhu, Zhiyuan et al. | 2023
- 1
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Effects of TiO2 Nanoparticles on Growth Behavior of IMCs between Sn/Cu joint during isothermal stage of solderingXiao, Tianyu / Shang, Shengyan et al. | 2023
- 1
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Performance enhancement of GaN/AlGaN multi-quantum-well ultraviolet light-emitting diodes by a novel p-type electron blocking layer with graded inverted V-shaped structureHan, Taiping / Wang, Yan / Yang, Liang / Wang, Bin / Xue, Junlin / Yi, Sicheng / Xie, An / Cao, Chunyan et al. | 2023
- 1
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A novel approach to 3D stacking of power chips with hot-via interconnectionsChang, Wenhan / Ye, Huijie / Lu, Qian / Zhang, Jian / Wu, Qingmin / Cheng, Qifen / Xu, Rongqing / Xiang, Weiwei et al. | 2023
- 1
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Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflowsYuan, Mingqi / Zhu, Lin / Huang, Mingliang et al. | 2023
- 1
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Stress analysis and geometrical parameter optimization of LGA solder joint under thermal cycle conditionLan, Jingyi / Huang, Chunyue / Yin, Shupei / Li, Shuyi / Liu, Xianjia et al. | 2023
- 1
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Study of the ErP Directive EU 2019/1781 on the Ecological Assessment of Three-phase Asynchronous MotorsPeng, Li / Jiang, Jianpin / Fan, Xiaoxuan et al. | 2023
- 1
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Modeling Methodology for Mechanical Shock Reliability Enhancement Designs of Ultra-Large BGA PackagesGu, Jianghai et al. | 2023
- 1
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Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packagingWang, Zesong / Zhong, Cheng / Li, Peifeng / Liu, Zhi-Quan et al. | 2023
- 1
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A Lossy Filter Using Quarter-mode Substrate Integrated Waveguide and Coplanar WaveguideXie, Shihao / Li, Guohui / Zhang, Jing / Jiang, Qitian / Xiao, Yinchuan et al. | 2023
- 1
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Correlation Analysis between Warpage and Metal Thermal Interface Materials Thermo-mechanical Reliability of Large size FCBGAWu, Zhuolun / Wang, Zhuqiu / Qi, Di / Lin, Xinyi / Yang, Dan / Mei, Na et al. | 2023
- 1
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Reliability influence of solder joints on gold plated carriersTang, Linjiang / Zhang, Minghua / Wang, Jun / Yao, Yuan / Du, Qian et al. | 2023
- 1
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Structure control and comprehensive properties study of UV-curable epoxy resinsWang, Zuqiang / Li, Jinhui / Zhang, Guoping / Sun, Rong et al. | 2023
- 1
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A New Numerical Algorithm to Estimate the Average Travel Time of Workpiece in Packaging Equipments or Reliability TestersSun, Niuyi / Yang, Dan / Mei, Na et al. | 2023
- 1
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Optimizing Temperature and Flow Fields of 4H-SiC Epitaxial Growth by Integrating CFD Simulation with Multi-objective Particle Swarm OptimizationTian, Jing / Tang, Zhuorui / Tang, Hongyu / Fan, Jiajie / Zhng, Guoqi et al. | 2023
- 1
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Anti-oxidation property of nanotwinned copper micro-cone array for low-temperature bondingChen, Peixin / Sun, Hongqi / Dong, Mengya / Hang, Tao / Wu, Yunwen / Li, Ming et al. | 2023
- 1
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Numerical simulation of bonding wire lift-off of IGBT under power cyclingZhao, Shengjun / An, Tong / Qin, Fei / Wang, Zhen et al. | 2023
- 1
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Effect of metal ions on corrosion behavior of component coating in high temperature and humidity environmentFu, Haoxi / Deng, Rui / Jiang, Kun / Deng, Chuanjin / Chen, Kaibin et al. | 2023
- 1
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Collaborative Optimization of Multi-energy Complementary System via Game TheorySong, Tongqing / Tang, Haotian / Tao, Guo / Qin, Ling / Ju, Shenghong et al. | 2023
- 1
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Effect of X-rays Irradiation on the Reliability of 850nm High-speed VCSELZhang, Jide / Liao, Wenyuan / Yang, Shaohua / Lu, Guoguang / Wang, Xiaohua / Wei, Zhipeng et al. | 2023
- 1
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Enhanced energy storage performance of Na0.94Sm0.02NbO3 ferroelectric ceramics by Bi0.5La0.5Ba2/3Ta1/3O3 dopingYun, Yaoyao / Xiao, Jiaming / Zeng, Zhaoquan / Zhou, Weiji / Zhang, Ling et al. | 2023
- 1
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Investigations on the Batch Fluctuations of an Epoxy Diluent via Encapsualtion Stress AnalysisLin, Xiaobin / Li, Yuefang / Jia, Jin / Li, Xiang / Zhong, Hua / Zeng, Zhibin et al. | 2023
- 1
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Failure analysis and improvement research on flexible termination multilayer ceramic capacitorsCao, Rui / Wu, Yaning / Zhou, Dandan / Hou, Xilu / Duan, Lei / Zhu, Hengjing et al. | 2023
- 1
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A New High-efficient Burn-in Screening Methodology Applied in Automotive Integrated Circuits ReliabilitySheng, Yalan / Gao, Yining / Sun, Niuyi / Lin, Shaobing / Lin, Xinyi / Yang, Dan / Mei, Na et al. | 2023
- 1
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Test and evaluation of process adaptability and environmental adaptability for reliability application of a thermal insulation adhesiveZhang, Sheng / Zhang, Chenhui / Liu, Zhidan / Zhang, Fei / Chen, Shuai / Jin, Xing et al. | 2023
- 1
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Enhancing the Thermal Stability of Ni UBM through Introducing High-Density Nano-TwinsWu, Yang / Pan, Song / Wang, Ben / Zhang, Zhijie / Chen, Leida et al. | 2023
- 1
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Study on the Correlation between the Ball Collapse Height and the Coplanarity Control Requirements for PBGA Reflow SolderingHe, Guanghui / Xu, Hui / Wang, Hongqin / Zheng, Zengxiong / Zhang, Qiaomu et al. | 2023
- 1
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Contrastive Study on Multiple Reflowing in SnAg-Cu/Ni-P Joints by Laser and Reflow SolderingZhou, Xu / Zhang, Zhi-Jie / Wei, Hong / Liang, Wang-Rong / Shi, Quan / Gao, Xing et al. | 2023
- 1
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Hydrothermally Synthesized Vanadium Diselenide: A Cathode Active Material for Aqueous Zinc-Ion BatteriesWang, Xinxin / Wang, Shang / Feng, Yan / Ma, Xinyang / Feng, Jiayun / Zhang, He / Tian, Yanhong et al. | 2023
- 1
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A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices PackagingLiu, Guandong / Wang, Changhai / Bhandari, Binod / Swingler, Jonathan et al. | 2023
- 1
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A crosstalk mitigation method of DDR5 in large size LGA packageOuyang, Keqing / Ma, Shineng / Wu, Feng / Lei, Chao / Zhang, Jiangtao / Pang, Jian et al. | 2023
- 1
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A Novel Focused Induction Heating Method For The Interconnection Between High-power Devices And Integrated Circuit BoardCui, Peng / Li, Haosong / Yang, Fan / Zhu, Wenbo / Hu, Bo / Li, Mingyu et al. | 2023
- 1
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Time-of-Flight Mass Spectroscopic Studies of Non-Stick on Pad Issues in Wire BondingZhu, Lei / Teo, Ling Ling / Lau, Eric / Zhao, Yanfei / Hua, Younan / Li, Xiaomin et al. | 2023
- 1
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Failure analysis and reliability improvement of large-size parallel seam welding packageWu, Yaning / Cao, Rui / Wang, Xu / Zhang, Jun / Gong, Baoming / Xiang, Yuyan et al. | 2023
- 1
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Demonstration of a Wafer-level Integration for System-on-Wafer ArchitectureWang, Weihao / Li, Jie / Wang, Chuanzhi / Cao, Rong / Li, Shunbin / Wan, Zhiquan / Liu, Guandong / Deng, Qingwen / Zhang, Ruyun et al. | 2023
- 1
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An accurate numerical prediction for the thermal conductivity of thermal interface materialsLu, Xiaoxin / Huang, Jiabin / Cheng, Nan / Ding, Dongdong / Lu, Jibao / Rong, Sun et al. | 2023
- 1
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Vertical Hexagonal Arrangement Structure - VHASSahoo, Akanksha et al. | 2023
- 1
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A Study on Warpage Behavior of Underfill in Flip ChipPeng, Xiaohui / Ai, Wenji / Pan, Yan / Zhao, Guolin / Du, Xiaomeng / Zhu, Pengli et al. | 2023
- 1
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A Novel Liner Formation Strategy for Double-sided Through-silicon-via (TSV) ProcessHao, Yigang / Ding, Yingtao / Yang, Baoyan / Pan, Xingling / Chen, Zhiming / Zhang, Ziyue et al. | 2023
- 1
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Research on Optimized Modeling of Package Warping PhenomenonWu, Lin / Pan, Tao / Zhu, Guozhen / Sun, Xiaofei / Zhang, Xian / Kim, Aiden / Chae, Brandon / Quan, Changhao / Shi, Hengrong / Ahn, Charles et al. | 2023
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A Single-layer Photosensitive Polymer Material for Temporary Bonding and Laser DebondingWang, Xuefan / Liu, Qiang / Wang, Fangcheng / Dai, Wenxue / Li, Kang / Zhang, Guoping / Sun, Rong et al. | 2023
- 1
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Electrochemical Migration Mechanism of Cu@Ag Composite Preforms by Electromagnetic Compaction for Power ElectronicsLi, Ziao / Zhao, Weiwei / Shi, Runze / Chen, Ziwen / Chen, Zhiwen / Liu, Li et al. | 2023
- 1
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Ultrasonic-assisted soldering of Al alloy using a novel Ni mesh reinforced Sn-9Zn solderLi, Dan / Xiao, Yong / He, Huang et al. | 2023
- 1
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Warpage Control Method in Fan-Out Wafer Level Packaging with Rectangular ChipsYan, Zhenghan / Zhong, Cheng / Jiang, Pengcheng / Ma, Chi / Liu, Shuang / Zeng, Dan / Wang, Hong / Hu, Zhengxun / Sun, Rong et al. | 2023
- 1
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Solution to Optimize Warpage performance for 2.5D Fanout PackagingJiang, Yue / Chen, Yang / Hu, Fengtian / Han, Dong / Fang, Jianmin / Li, Guangyao / Ouyang, Keqing et al. | 2023
- 1
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Optimal design of the stress-buffering structure in MEMS resonant accelerometer packageXiaorui, Bie / Xingyin, Xiong / Zheng, Wang / Wuhao, Yang / Zhitian, Li / Xudong, Zou et al. | 2023
- 1
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Numerical Simulation of Solder Ball and RDL on Fan-Out Wafer Level Package under Random VibrationYang, Shuai / Xu, Cheng / Su, Meiying / Dai, Fengwei / Sun, Peng / Cao, Liqiang et al. | 2023
- 1
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Study of the shear strength behavior in flip chip under thermo-mechano-electrical coupling and different solder heightZhou, Bin / Qiao, Jianxin / Su, Yunkang / Liu, Dapeng / Huang, Wentao / Li, Longqiu et al. | 2023
- 1
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Injection molding process optimization of plastic packaging device based on GA and BP neural networkRuyi, Fu / Wei, Huang / Jian, Zhang / Kailin, Pan / Yubing, Gong et al. | 2023
- 1
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Preparation of Nano-foam Sheet and Its Application in High Temperature Packaging of Power ChipsZhang, Hongqiang / Yin, Changhao / Zhang, Jiahe / He, Siliang / Guo, Wei et al. | 2023
- 1
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Optimization of Laser-induced Deep Etching for TGV Fabrication in Fused SilicaLiu, Jingli / Xia, Chenhui / Ming, Xuefei / Yin, Chunyan et al. | 2023
- 1
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Study on the Control Method of Moisture Content in Microwave ModulesWang, Chuanwei / Min, Zhixian / Jin, Jiafu / Li, Chenyu et al. | 2023
- 1
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Branched alumina filled epoxy resin and finite element simulationYao, Xiong / Wang, Xiaojian / Dong, Yanfang / Zhang, Rui / Zhang, Zhaoxian / Liang, Caihang et al. | 2023
- 1
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4x4 Millimeter-Wave Patch Antenna Array for 5G CommunicationYin, Ningning / Chen, Tianfang / Xu, Cheng / Zhang, Hongwei / Dai, Fengwei / Sun, Peng et al. | 2023
- 1
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High Density Multi-Chip Embedded Panel-Level Packaging Integration TechnologyChen, Xianming / Huang, Benxia / Hong, Yejie / Feng, Lei / Feng, Jindong / Zhu, Guilin / Huang, Gao / Dong, Yanlin / Chen, Wu et al. | 2023
- 1
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Thermal Reliability Analysis of High-Power Terahertz Traveling Wave TubeFang, Shuanzhu / Tang, Mengyao / Luo, Jun / Wang, Zhizhe / Lv, Hongfeng / Jiang, Kun et al. | 2023
- 1
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The investigation of threshold voltage instability of p-GaN AlGaN/GaN HEMT caused by the measurementCai, Zongqi / Lv, Anru / He, Zhiyuan / Shi, Yijun / Chen, Yiqiang / Lu, Guoguang / Chen, Liye / Xiao, Qingzhong et al. | 2023
- 1
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Analysis of torsional stresses in POP solder joints under constant temperature field conditionsLiu, Jiahua / Huang, Chunyue / Yin, Shupei / Li, Shuyi / Lan, Jingyi / Liu, Xianjia et al. | 2023
- 1
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Study on grinding of Cu-Ta interface based on molecular dynamicTian, Zhiqiang / Wang, Shizhao / Liu, Sheng et al. | 2023
- 1
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Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale SimulationLi, Shizhen / Jiang, Jing / Liu, Xu / Wang, Shaogang / Zhang, Zhonghua / Ye, Huaiyu et al. | 2023
- 1
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A UV-curing Temporary Bonding Material with High-temperature SurvivabilityLiu, Yanting / Bai, Yun / Zeng, Yalin / Li, Kang / Jiang, Guoming / Li, Jinhui / Liu, Qiang / Wang, Xuefan / Zhang, Guoping et al. | 2023
- 1
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Stress-strain analysis and optimization of TSV interconnect structure parameters under thermal cyclic load loading based on bp neural networkWang, Lilin / Huang, Chunyue / Wu, Liye / Liu, Xiaobin / Liu, Xianjia / Zhang, Huaiquan et al. | 2023
- 1
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Flexible cellulose fibre/silver fabric for highly efficient and broadband EMI shielding via metal-organic decomposition approachLiao, Si-Yuan / Wang, Xiao-Yun / Hu, You-Gen / Zhu, Peng-Li / Sun, Rong / Wan, Yan-Jun et al. | 2023
- 1
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Research on sliding mode control algorithm of permanent magnet synchronous linear motor based on fuzzy switching gain adjustmentLiu, Huan / Jin, Shikang et al. | 2023
- 1
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A Thermo-mechanical Coupled 3D Crystal Plasticity Finite Element Model for CASTIN Solder AlloyLi, Yang / Cheng, Yujie / Hu, Shanwen / Xu, Binbin / Liu, Lu / Cai, Zhikuang et al. | 2023
- 1
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Enabling Zero Delamination between Lead Frame Surface and Epoxy Molding Compound at Zero-hour and MSL1 in Leaded PackageLan, Wenhao / Leung, Wa-San / Li, Zhigang / Luo, Shaoqing et al. | 2023
- 1
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Warpage Analysis and Optimization of Fan-Out Panel-Level Packaging in Hygrothermal EnvironmentWang, Zijian / Yang, Wen / Zhu, Cheng / Wu, Shangxian / Ni, Yan / Yang, Daoguo et al. | 2023
- 1
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Design Strategies of Nanofillers in Photosensitive Polyimide NanocompositesWang, Tao / Li, Jinhui / Niu, Fangfang / Zhang, Guoping / Sun, Rong et al. | 2023
- 1
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The application of Developing Low-warpage Bonding Pair by Finite Element AnalysisZeng, Yalin / Bai, Yun / Niu, Fangfang / Liu, Yanting / Li, Kang / Jiang, Guoming / Li, Jinhui / Liu, Qiang / Zhang, Guoping et al. | 2023
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Modeling and Simulation of a High Bandwidth Conical 3D Monopole Antenna for 3D ICWang, Yang / Ju, Yudi / Liu, Ziyu / Sun, Qingqing / Chen, Lin / Zhang, David Wei et al. | 2023
- 1
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Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced PackagingYao, Yifan / An, Yuxuan / Tu, King-Ning / Liu, Yingxia et al. | 2023
- 1
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The Densification Behavior and Microwave Dielectric Properties of the CBS Glass-ceramics for LTCC ApplicationLi, Zhaojun / Dong, Chao / Yan, Tingnan / Shen, Qinchen / Sun, Rong / Wang, Dawei et al. | 2023
- 1
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Research on short-term power prediction and energy storage capacity allocation of wind and photovoltaic power based on Elman neural networkLi, Rongrong / Li, Ruilin / Chang, Xiqiang / Gong, Lijiao / Yu, Jinguo / Chao, Xuewei et al. | 2023
- 1
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Technology Development of Wafer-level Ultra-high Density Fan-out (UHDFO) PackageFu, Dongzhi / Ma, Shuying / Zhao, Yanjiao / Yang, Shiquan / Shen, Jiulin / Xiao, Zhiyi et al. | 2023
- 1
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Evaluation and Mechanism Study of a Novel Green Chemical Mechanical Polishing Slurry for Cobalt InterconnectsHuang, Zisheng / Chang, Pengfei / Zhou, Xiangzhuo / Hang, Tao et al. | 2023
- 1
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Thermal Stress Field of Al2O3/Al-Ni Nanofoil/Ni Solder Joints by Self-propagation ReactionsHuang, Shengbo / Zhao, Weiwei / Liu, Zhenyu / Zhang, Chenru / Chen, Zhiwen / Liu, Li et al. | 2023
- 1
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Simulation Application of Interconnected Structure of Microsystems Based on Artificial Neural Network TechnologyYe, Yunong / Liu, Jie / Wang, Haoyan / Li, Miao / Wang, Zhiqiang / Li, Wei et al. | 2023
- 1
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Rapid and low temperature Cu particle sintering for power devices with mixing of MOD ink and reductive additivesXin, Jianbo / Gao, Yue / Sun, Quan / Liu, Yang / Zhang, Jing et al. | 2023
- 1
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Key Factors for the Formation of Intermetallic Compound During Cu-Sn TLPB ProcessDing, Yuyan / Zhao, Tao / Zhu, Pengli / Xu, Liang / Sun, Rong et al. | 2023
- 1
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Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental InvestigationsZhang, Shasha / Ye, Ziting / Wei, Yuhang / Sheng, Bo / Dong, Zhaoteng / Zheng, Bing / Zhao, Xiuchen et al. | 2023
- 1
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Research on the Application of Microscopic Analysis Technology in PCB Inspection and Failure AnalysisChen, Zhenhai / Li, Xingxing / Zhou, Bo / He, Xiao / Tian, Wanchun et al. | 2023
- 1
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A digital twin framework of reflow soldering based on a novel high dimension surrogate modelYe, Fan / Jin, Dayuan / Wan, Yun / Xie, Xin et al. | 2023
- 1
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Research on Genetic Algorithm for Feedforward Parameter Tuning in XY motion platformZhou, Wei / Liu, Huan / He, HaiYuan et al. | 2023
- 1
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Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD)Zheng, Kaiwen / Huang, Zhiheng / Xiao, Min / Meng, Yuezhong / Yan, Hui / Liu, Yang et al. | 2023
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Green and high-efficiency CMP Slurry for Cu planarizationZhang, Jiale / Wang, Ning / Yin, Jianhang / Liang, Qingwen / An, Tengda / Li, Haojun et al. | 2023
- 1
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Life Prediction of Solder Interconnects under Harsh Thermal Cycling from Microstructural DegradationJiang, Wanyu / Xu, Jingwen / Wang, Jing / Hu, Hao / Zhang, Wei / An, Rong et al. | 2023
- 1
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Wafer-level Sn-Ag-Cu/SiO2 Transient Liquid Phase Hybrid Bonding (TLP-HB) TechnologyZhang, Shuai / Mao, Hairong / Xu, Hongbo / Zeng, Lingfang / Chen, Guang / Zeng, Yuanpeng et al. | 2023
- 1
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A Novel Circular Position Sensitive Detector for Continuously High-Precision Angle MeasurementMeng, Xiangxu / Sun, Siwei / Yan, Xuetao / Yang, Peng / Liu, Fengman / Cao, Liqiang et al. | 2023
- 1
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TGV filling process based on low temperature conductive silver pasteYu, Chen / Li, Wei / Yang, Tingting / Wu, Heng / Yu, Daquan et al. | 2023
- 1
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Implantable flexible temperature sensor for in-operando sensing of Lithium-ion batteriesGuo, Dengji / Li, Weichang / Pan, Taisong / Lin, Yuan et al. | 2023
- 1
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SIP Solder Paste via Powder Cluster Design Harvest Both Slump Resistance and Temperature Cycling ReliabilityXu, Zhengfeng / Wang, Jian / Lee, Ning-Cheng / Zheng, Aixia / Wang, Ming / Gu, Qiwei et al. | 2023
- 1
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Improved Dielectric Constant and Breakdown Strength of Polyimide with Cyclohexane End Group via Molecular Engineering StrategyTingLi, TingLi / Liu, Jie / Tang, Shenghua / Huang, Chuanwei / Yu, Shuhui / Sun, Rong et al. | 2023
- 1
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First Principle Study of the Adsorption Behavior of 1,2,4-Triazole on Defective Copper SurfaceChang, Pengfei / Huang, Zisheng / Hang, Tao / Li, Ming et al. | 2023
- 1
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Thermal analysis of TSV with design factorsSeo, Seong-Won / Kim, Gu-Sung et al. | 2023
- 1
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The crack propagation analysis in an IGBT package under in-service conditions by VCCTFu, Zhao / Wang, Hao-Zhou / Wang, Jun et al. | 2023
- 1
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Synthesis and characterization of highly-dispersed copper submicron particles for low temperature sintering jointsFang, Yi / Yang, Fan / Du, Jianjun / Fu, Bicheng / Qi, Fang / Li, ZhengYu / Cao, Haiyang / Xu, Haipeng / Li, Mingyu et al. | 2023
- 1
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Rapid Moisture-Responsive Biopolymer Film ActuatorsYang, Yunxia / Li, Dan / Guo, Fu et al. | 2023
- 1
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Design Hydro-Solar-Wind Multi-energy Complementary System via Multi-Objective OptimizationTang, Haotian / Song, Tongqing / Tao, Guo / Qin, Ling / Ju, Shenghong et al. | 2023
- 1
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Prospective application of nanotwinned copper for Damascene via filling and hybrid bondingGao, Li-Yin / Wan, Yong-Qiang / Lei, Zhi-Gang / Wang, Yu-Xi / Li, Zhe / Li, Xiao / Liu, Zhi-Quan / Sun, Rong et al. | 2023
- 1
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Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging TechnologyPan, Shuaiyi / Xu, Huimin / Tan, Xin / Ma, Haoran / Xia, Xiaochuan / Liang, Hongwei et al. | 2023
- 1
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Simulation of Crack Initiation and Propagation in Solder Layer of IGBT Module under Temperature Shock in 3D Model Based on Phase Field MethodQin, Jiaolong / Wu, Fengshun / Zhou, Longzao / Ding, Liguo / Liu, Hui / Xiang, Yuan et al. | 2023
- 1
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Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche StressWang, Shaogang / Tan, Yanlong / Liu, Xu / Li, Shizhen / Liu, Ke / Yuan, Wucheng / Lin, Tao / Zhang, Guoqi / French, Paddy / Ye, Huaiyu et al. | 2023
- 1
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Improving Optical and Electronic Performance of Monolayer Silicon Carbide via Metal DopingLi, Junfeng / Tang, Yanlong / Xu, Siyuan / Lin, Tao / Sun, Tuobei / Ye, Huaiyu et al. | 2023
- 1
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Contribution of sintering process to the reliability of X7R BME-MLCCs with high-voltageJian, Gang / Zhang, Lei / Yu, Shuhui / Sun, Rong / Fu, Zhenxiao / Cao, Xiuhua et al. | 2023
- 1
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Fabrication of Full Glass Antenna-in-Package by Laser Transmission WeldingGuo, Yuhua / Wang, Yunlong / Wang, Qiangwen et al. | 2023
- 1
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Electrochemical simulation of electrodeposition growth of copper in Through Silicon Via (TSV)Xu, Zeng-Guang / Zhong, Cheng / Li, Zhe / Sun, Rong / Liu, Zhi-Quan et al. | 2023
- 1
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Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) InterposerZhao, Jin / Qin, Fei / Chen, Zuohuan / Yu, Daquan et al. | 2023
- 1
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Plasma-Mediated Enhanced Electroless Photoelectrochemical Etching of Gallium Nitride Nanowire ArraysYu, Pengfei / Chen, Yun / Hou, Maoxiang / Chen, Xin / Gao, Jian et al. | 2023
- 1
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Evaluation of the influence of the reliability application of a thermal insulation adhesive on the reliability of solder jointsZhang, Sheng / Zhang, Chenhui / Zhang, Fei / Chen, Shuai / Liu, Zhidan / Jin, Xing et al. | 2023
- 1
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Study of TSV Interconnection Structure Based on Coupled High Temperature and Random Vibration Loading ConditionsWang, Bin / Huang, Chunyue / Gao, Chao / Wu, Liye / Liu, Xiaobin / Liu, Xianjia et al. | 2023
- 1
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Study on Electromigration Lifetime of Ni/solder/Cu Sandwich Structure with Different Pb ContentXie, Jiang / Qiu, Baojun / Wang, Hongqin / Yan, Zhao / Suo, Wenyu / Yang, Xiaofeng et al. | 2023
- 1
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Non-wet Simulation and risk prediction of 2.5D PackageHuang, Qianjin / Xu, Cheng / Su, Meiying / Dai, Fengwei / Sun, Peng / Cao, Liqiang et al. | 2023
- 1
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A low-cost spin-on-glass (SOG) liner deposited by vacuum-assisted spin coating technique for via-last ultra-high aspect ratio through-silicon viasChen, Xuyan / Ding, Yingtao / Zhang, Ziyue / Xiao, Lei / Wang, Han / Chen, Zhiming et al. | 2023
- 1
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Effect of Different Proportions and Powder Sizes of Sn on The Performance of Cu-Sn TLPB JointsDing, Yuyan / Zhao, Tao / Zhu, Pengli / Xu, Liang / Sun, Rong et al. | 2023
- 1
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A Comprehensive Study of Interface Damage at Cu/Polyimide Interface in Redistribution Layers of Fan-out Wafer Level PackagingZhou, Shilu / Zhong, Cheng / Shan, Liang / Zhang, Guoping / Lu, Jibao / Sun, Rong et al. | 2023
- 1
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Study on Failure Modes of High Speed Optical Communication PCBZhou, Bo / Luo, Dingfeng / Xiao, Meizhen / Ning, Minjie / He, Xiao et al. | 2023
- 1
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Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in AmbientHu, Liangxing / Lim, Yu Dian / Zhong Lim, Michael Joo / Miao, Weiyang / Dinh, Van Quy / Xie, Zhen / Chen, Qimiao / Ju, Xin / Tan, Chuan Seng et al. | 2023
- 1
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An ultra-thin vapor chamber with oriented spiral woven wick for microelectronic heat dissipationYan, Caiman / Huang, Haoyi / Liu, Hang / Leng, Hongjian / Yuan, Xuepeng / Tang, Yong / Liang, Yifu et al. | 2023
- 1
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The Influence of Total Dose Irradiation and Annealing Experiments on Three Types of SiC Power DevicesJiang, Jie / Hu, Shengdong / Shi, Yijun / Cheng, Liye / He, Zhiyuan / Xiao, Qingzhong / Zeng, Wei / Wu, Hao / Hui, Caixin et al. | 2023
- 1
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FDTD Simulation of anti-reflective performance for the SiO2/PDMS transparent packaging materialsAn, Tengda / Wang, Mozhen / Liang, Qingwen / Jia, Jianxin / Zhang, Jiale / Wang, Ning et al. | 2023
- 1
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The influence of pattern size on the profile and microstructure of electroplated copper pad, redistribution layer and via for advanced packagingLiu, Jin-Hao / Gao, Li-Yin / Cui, Xian-Wei / Wan, Yong-Qiang / Liu, Zhi-Quan et al. | 2023
- 1
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Thermal Cycle Reliability of Microwave Components in CBGA Package with Different Dispensing Methods for Spaceborne RadarMiao, Li / Xiaowei, Sun / Yanlong, Sun / Jiajia, Zou / Gaiqing, Chen / Huidong, Song / Ren, Fu et al. | 2023
- 1
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Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder jointsLi, Li / Wang, Shengbo / Chen, Junlin / Huang, Mingliang et al. | 2023
- 1
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Case Analysis and Improvement of Silver Migration in ResistorsHu, Chaohui / Guan, Xiaoxiao et al. | 2023
- 1
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Optimization of stress and related parameters of BGA solder joint with void defect under torsional loadLi, Junjian / Huang, Chunyue / Li, Shuyi / Yin, Shupei / Liu, Jiahua / Liu, Xianjia et al. | 2023
- 1
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Fan-Out Embedded Bridge Solution for Chiplet/HBM IntegrationLiao, Mark / Lin, Vito / Kang, Andrew / Wang, Long-Yuan / Shih, Teny / Wang, Y.P et al. | 2023
- 1
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Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensional IntegrationJiang, Xiaofan / Tao, Zeming / Yu, Tian / Jiang, Binbin / Zhong, Yi / Yu, Daquan et al. | 2023
- 1
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A Method of ADC Circuit Noise Optimization based on A Stochastic Resonance Bistable SystemYing, Zhang / Bo, Sun / Chunbing, Guo et al. | 2023
- 1
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Electro-Thermal-Mechanical simulation of a three-dimensional stacked flexible circuit interconnects structure and its comparative analysisQian, Haoquan / Wang, Hongyue / Mei, Xiaoyang / Zhu, Wenhui / Wang, Liancheng et al. | 2023
- 1
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In-plane Heat Transfer Enhancement of Phosphor Layer in Transmissive Laser-excited White LightingZhao, Weixian / Xie, Bin / Hu, Run / Luo, Xiaobing et al. | 2023
- 1
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The Thermal Transient Measurement for the Carbon Fiber-based Thermal Interface Materials in Electronic Packaging StructuresPang, Yunsong / Sun, Rong / Zeng, Xiaoliang / Yang, Shangqiang / Sun, Aixiang / Cao, Yong et al. | 2023
- 1
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Cu/SiC heterogeneous interconnection with high-frequency ultrasound at low-temperatureYang, Hao / Gan, Guisheng / Luo, Jie / Chen, Siwen / Zhou, Jin / Ma, Yongchong / Wang, Huaishan / Xia, Daquan / Wang, Weisheng et al. | 2023
- 1
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Interfacial reliability analysis and structural optimization of System-in-Package modulesHuang, Sixin / Long, Haohui / Li, Jianhui / Shen, Rilin et al. | 2023
- 1
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A Wire-less SiC Power Module Using Flip-Chip Sintering MethodLiu, Yuncan / Yan, Haidong / Yang, Daoguo / Li, Wangyun / Liu, Chaohui / Zhang, Yakun et al. | 2023
- 1
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Ablation Behaviour of Photosensitive Materials in Laser Debonding Processes for Advanced PackagingWang, Fangcheng / Liu, Qiang / Wang, Xuefan / Dai, Wenxue / Zhang, Guoping / Sun, Rong et al. | 2023
- 1
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Structure Reliability Analysis of Embedded MicroChannel Cooling with PCB ManifoldLyu, Peijue / Yang, Yuchi / Wang, Hongyue / Zhang, Yiming / Yang, Zhou / Wu, Hongxu / Jin, Yufen / Wang, Wei / Zhang, Chi et al. | 2023
- 1
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High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglementWu, Weijian / Wang, Hangqian / Zeng, Xiangliang / Hao, Zhifeng / Fan, Jianfeng / Ren, Linlin et al. | 2023
- 1
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Design and characterization of a novel low temperature wafer level bonding technologyZhu, Chunsheng / Zhang, Lichao / Zhong, Jingxin et al. | 2023
- 1
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Cascode GaN device’s Electrical Performance Failure Caused by Package Degradation under Repetitive Power Cycling StressShi, Yijun / Wu, Shan / He, Zhiyuan / Cai, Zongqi / Cheng, Liye / Rao, Yunliang / Xiao, Qingzhong / Chen, Yiqiang / Lu, Guoguang et al. | 2023
- 1
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Comparison of electroless plating interconnection of different reducing agent systemsZhang, Yuyi / Ren, Nana / Liu, Haoming / Chen, Zhuo et al. | 2023
- 1
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Effect of microstructure on sensitivity of flexible capacitive pressure sensorZeng, Jiantao / Wang, Yong / Liu, Xiaoyang / Fang, Yike / Liang, Lihua / Zhang, Yuanxiang et al. | 2023
- 1
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An isogeometric boundary element scheme for transient heat transfer problems in electronic packagingXu, Hao / Gong, Yanpeng / Kou, Yuguo / Qin, Fei et al. | 2023
- 1
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Improving the interface bonding strength of epoxy adhesives for electronic packagingLuo, Yanzhe / Xu, Hui / Mao, Zhu / Nie, Kaixuan / Ning, Yi / Li, Zhongyu / Zhu, Pengli / Sun, Rong et al. | 2023
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