Highly reliable and low-cost multi-chip module composed of wafer process packages (Englisch)
- Neue Suche nach: Naka, Y.
- Neue Suche nach: Tanaka, N.
- Neue Suche nach: Naito, T.
- Neue Suche nach: Naka, Y.
- Neue Suche nach: Tanaka, N.
- Neue Suche nach: Naito, T.
In:
53rd Electronic Components and Technology Conference, 2003. Proceedings.
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881-885
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2003
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Highly reliable and low-cost multi-chip module composed of wafer process packages
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2003
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Format / Umfang:496181 byte
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ISBN:
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ISSN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Wiring optimization for propagation delay and reduced power consumption in multichip modules with free-space optical interconnectChung-Seok Seo, / Chatterjee, A. / Drabik, T.J. et al. | 2003
- 7
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An advanced packaging solution for OC-768, 40Gb/s utilizing ibm standard alumina MLC technologyDyckman, W.D. / Pillai, E.R. et al. | 2003
- 11
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Electrical repair of multilayer ceramic (MLC) substratesCasey, J.A. / Sundlof, B. / Wassick, T. / Surprenant, R. / Hamel, H. / Stoller, H. / Wiley, K. / Cohen, J. / Berger, M. / Scheider, D. et al. | 2003
- 18
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Microwave bonding of silicon dies with thin metal films for MEMS applicationsClendenin, J. / Tung, S. / Budraa, N. / Mai, J. et al. | 2003
- 24
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Embedded IC packaging technology for ultra-thin and highly compact RF modulePinel, S. / Lee, C.-H. / Yoon, S.-W. / Nuttinck, S. / Lim, K. / Laskar, J. et al. | 2003
- 30
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Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applicationsNeedes, C.R. / Barker, M.F. / Ollivier, P.T. / Hang, K.W. / Souders, K.E. / Wang, C.B. / Smith, M.A. et al. | 2003
- 36
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Testing technique for early evaluation of compression land grid array connectorsBrodsky, B.L. et al. | 2003
- 41
-
Lead-free solder assembly: impact and opportunityBradley, E. et al. | 2003
- 47
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Lead-free solders. issues of toxicity, availability and impacts of extractionKu, A. / Oetinscitan, O. / Saphores, J.-D. / Shapirod, A. / Schoenunp, J.M. et al. | 2003
- 54
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Creep properties of Sn-rich solder jointsMorris, J.W. / Song, H.G. / Hua, F. et al. | 2003
- 58
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Pb-free solder challenges in electronic packaging and assemblyHua, F. et al. | 2003
- 64
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Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy compositionKang, S.K. / Won Kyoung Clioi, / Da-Yuan Shih, / Henderson, D.W. / Gossefin, T. / Sarkliel, A. / Goldsmith, C. / Punlitz, K.J. et al. | 2003
- 71
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Unique phase changes induced by electromigration (EM) in solder jointsGan, H. / Xu, G. / Tu, K.N. et al. | 2003
- 77
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Reliability of the Pb-free solder bump on electroless ni under bump metallurgiesKim, N.S. / Jung, S.Y. / Oh, S.Y. et al. | 2003
- 83
-
Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materialsZahn, B.A. et al. | 2003
- 95
-
Study of microvia failure under PCB flexing loadsSeah, S.K.W. / Lim, C.T. / Tan, V.B.C. / Quah, S.E. et al. | 2003
- 100
-
Modeling technique for reliability assessment of portable electronic product subjected to drop impact loadsLiping Zhu, et al. | 2003
- 105
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Package to board interconnection shear strength (PBISS): effect of surface finish, PWR build-up layer and chip scale package structureCanumalla, S. / Hee-Dong Yang, / Viswanadham, P. et al. | 2003
- 113
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Drop impact survey of portable electronic productsLim, C.T. / Ang, C.W. / Tan, L.B. / Seah, S.K.W. / Wong, E.H. et al. | 2003
- 121
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Board level drop test and simulation of TFBGA packages for telecommunication applicationsTong Yan Tee, / Hun Shen Ng, / Chwee Teck Lim, / Pek, E. / Zhaowei Zhong, et al. | 2003
- 130
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Solder joint behavior of area array packages in board level drop for handheld devicesDongji Xie, / Arra, M. / Sanuny Yi, / Rooney, D. et al. | 2003
- 136
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Evaluation of low stress dielectrics for board applicationBrownlee, K. / Shinotani, K. / Raj, P.M. / Bbattacharya, S.K. / Wong, C.P. / Tummala, R.R. et al. | 2003
- 142
-
Laser processing of polymer layers of laminated and flexible substratesIllyefalvi-Vivez, Z. / Berenyi, R. / Gordon, P. / Pinkola, J. / Ruszinko, M. et al. | 2003
- 148
-
In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfillBansal, S. / Raj, P.M. / Shinotani, K. / Bhattacharya, S. / Tummala, R. / Lance, M.J. et al. | 2003
- 156
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Quantitative analysis of resistance variations in as-deposited nickel-phosphorus (NiP) embedded resistorsCheng, P.L. / Leung, S.Y.Y. / Law, T.W. / Liu, C.K. / Chong, I.T. / Lam, D.C.C. et al. | 2003
- 161
-
Characterizations of (SiO,Cr/sub 1-x/)/sub y/N/sub 1-y/ thin film resistors for integrated passive applicationFan Wu, / Morris, J.E. et al. | 2003
- 167
-
Integral capacitor dielectrics based on polymer composites with specialty conductive fillersLianhua Fan, / Kwnashiro, Y. / Wong, C.P. et al. | 2003
- 173
-
Development of a novel aluminum-filled composite for embedded passive applicationsJianwen Xu, / Wong, C.P. et al. | 2003
- 182
-
Field-use conditions vs. thermal cycles - a physics-based mapping studyTunga, K. / Pyland, J. / Pucha, R.V. / Sitaramai, S.K. et al. | 2003
- 189
-
Model for BGA and CSP reliability in automotive underhood applicationsLail, P. / Islam, N. / Suhling, J. / Darveaux, R. et al. | 2003
- 197
-
Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu soldersWiese, S. / Meusel, E. / Wolter, K.-J. et al. | 2003
- 207
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Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysisChong, D.Y.R. / Kapoor, R. / Sun, A.Y.S. et al. | 2003
- 214
-
Solder joint life prediction model based on the strain energy density criterionGuven, I. / Kradinov, V. / Madenci, E. / Tor, J.L. et al. | 2003
- 221
-
Finite element analysis to develop a new accelerating test method for board level solder joints for high temperature electronicsNeher, W. / Kempe, W. / Wondrak, W. / Sauer, W. et al. | 2003
- 229
-
Acceleration models, constitutive equations, and reliability of lead-free solders and jointsLau, J. / Danksher, W. / Vianco, P. et al. | 2003
- 237
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In-process stress characterization of flip chip assembly on warped organic substrateJian Zhang, / Hai Ding, / Baldwin, D.F. / Ume, I.C. et al. | 2003
- 244
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Flip chip assembly on PCB substrates with coined solder bumpsJae-Woong Nah, / Paik, K.W. / Soon-Jin Cho, / Won-Hoe Kim, et al. | 2003
- 250
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Solder shear strength for process controlNair, K.K. / Perkinson, N. / Rhine, G.A. et al. | 2003
- 256
-
A novel algorithm for fiber-optic alignment automationRong Zhang, / Shi, F.G. et al. | 2003
- 261
-
Multipart optical filter packages for DWDM applicationsMuller, H.G. / Townley-Smith, P. / Hellman, S. et al. | 2003
- 265
-
Reducing RF parameter tests for test cost reduction: device model, hypothesis testing and experiment verificationAwad, M. / Jing Li, et al. | 2003
- 269
-
Forecasting supply chain components with time series analysisMartin, L.J. / Frei, J. et al. | 2003
- 279
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A bidirectional single fiber 1.25 Gb/s optical transceiver module with SFP package using PLCHashimoto, T. / Kinda, A. / Kasaliara, R. / Ogawa, I. / Shuto, Y. / Yanagisawa, M. / Obki, A. / Mino, S. / Ishii, M. / Suzuki, Y. et al. | 2003
- 284
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High reliability 2.5 Gbit/s modules using silicon platform technologyReygrobellet, J.N. / Volto, P. / Hernandez, Y. / Berthier, P. / Samson, Y. / Viala, A. / Coquelin, A. / Tournereau, A. / Lecocq, V. / Lievre, L. et al. | 2003
- 290
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Receptacle transceiver module using silica waveguide for Bi-directional transmission over single fiberKimura, N. / Mnozaki, K.S. / Kitamura, N. / Fukulomi, Y. / Minota, Y. / Tanaka, B. / Sato, A. / Ando, H. et al. | 2003
- 296
-
Process development for 10 Gb/s small footprint butterfly transmitterDelin Li, / Tievu Zheng, / Zbinden, E. / Yegnanamyanan, S. / Chen, J. / Bennett, J. / Finot, M. / Askew, E. / Walker, J. / Hat Nguyen, et al. | 2003
- 301
-
Design optimization for 10Gbps electro absorption modulator LD packagingSudharsanam, K. / Paundighaniam, R. / Min Seng Yen, / Ling Xie, / Yivi Ma, / Lee, S.B. / Pinjala, D. / Iver, M.K. et al. | 2003
- 308
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CpW transmission lines on silicon supporting 10G/40G InP EAM chip on carrier applicationsSongsheng Tan, / Nair, D. / Pollard, S.C. / Hughes, L. / Matthews, K. / Maxwell, G. / Wigley, P. et al. | 2003
- 312
-
Thin film coolers for localized temperature control in optoelectronic integrated circuitsYan Zhang, / Christofferson, J. / Vashaec, D. / Nguven, P. / Shakouri, A. et al. | 2003
- 317
-
High solder joint reliability with lead free soldersAmagai, M. / Toyoda, Y. / Tajima, T. et al. | 2003
- 323
-
A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applicationsYau, E.W.C. / Gong, J.F. / Hong, B.F.W. / Chan, P.C.H. et al. | 2003
- 331
-
Solder joint reliability of lead-free solder balls assembled with snpb solder pasteTheuss, H. / Kilger, T. / Ort, T. et al. | 2003
- 338
-
Copper doped eutectic tin-lead bump for power flip chip applicationsShing Yeh, et al. | 2003
- 346
-
Board level reliability of components with matte tin lead finishNguyen, L. / Walberg, R. / Zhou, L. / Koh, T. et al. | 2003
- 353
-
Peel test metrology for solder joint reliability of FCBGA packagesJinlin Wang, / Lim, H.K. / Lew, H.S. / Woon Theng Saw, / Chew Hong Tan, et al. | 2003
- 359
-
Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip hyperBGA pacuageJie Xue, / Hubbard, K. / Li, P. / Tang, J. / Poom, J. / Brillhart, M. / Alcoe, D. / Kunz, R. / Mendez, D. et al. | 2003
- 365
-
Development of transfer molding technology for package with die active side partially exposedEric Kuah Teng Hock, / Zhao Bao Zong, / Lee, S.G. / Ho, S.C. / Srikanth, N. et al. | 2003
- 373
-
Packaging of an electronic-microfluidic hybrid sensorErik Jung, / Assmann, R. / Aschenbrenner, R. / Reichi, H. et al. | 2003
- 377
-
A mechanical approach to overcome RF MEMS switch stiction problemLei L. Mercado, / Shun-Meen Koo, / Tien-Yu Tom Lee, / Lianjun Liu, et al. | 2003
- 385
-
Gold bump attachment-of MEM sensor die using thermocompression bondingMarinis, T.F. / Soucy, J.W. et al. | 2003
- 392
-
Design & development of a new thermally stable high vacuum IR bolometer packagePremachandran, C.S. / Khan, N. / Xiaowu Zhang, / Chong Ser Choong, / Chai, T.C. et al. | 2003
- 397
-
Homogeneous integration of off the shelf silicon-based ICs on a silicon substrateBalseanu, M. / Duster, J.S. / Kornegay, K.T. et al. | 2003
- 403
-
Silicon optical microbench technology with integrated micromachined interconnectsBanerjee, S.R. / Drayton, R.F. et al. | 2003
- 410
-
A finite element modeling methodology for thermomechanical analysis of printed wiring board assembliesHai Ding, / Powell, R.E. / Hanna, C.R. / Ume, I.C. et al. | 2003
- 415
-
Power cycling simulation of an IC package: considering electromigration and thermal-mechanical failureYong Liu, / Irving, S. et al. | 2003
- 422
-
Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packagesPerkins, A. / Sitaraman, S.K. et al. | 2003
- 431
-
Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packagesZhang, H.Y. / Pinjala, D. / Joshi, Y.K. / Wong, T.N. / Toh, K.C. et al. | 2003
- 438
-
Thermal modeling and measurement of AlGaN/GaN FETs built on sapphire and SiC substratesJeong Park, / Kakovitch, D. / Moo whan Shin, / Chin C. Lee, et al. | 2003
- 443
-
Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow processZhuqing Zhang, / Voyakunpinij, A. / Sitaraman, S.K. / Wong, C.P. et al. | 2003
- 449
-
Electronic components in cell phone handsets: thermal simulations and evaluation of modeling assumptionsElie, A. / Ferrario, J. et al. | 2003
- 452
-
Design of multilayer spiral inductor resonator filterGye-An Lee, / Megahed, M. / De Flaviis, F. et al. | 2003
- 458
-
High frequency SAW correlator moduleBrocato, R. / Heller, E. / Onidahl, G. / Wendt, J. / Jones, S. / Palmer, D. et al. | 2003
- 464
-
Embedded passives in organic substrate for bluetooth transceiver moduleLi Li, / Bowles, P. / Lih-Tyng Hwang, / Plager, S. et al. | 2003
- 470
-
A novel integrated dielectric resonator antenna for circular polarizationPopov, A.P. / Rotaru, M.D. et al. | 2003
- 474
-
Integration of miniaturized patch antennas with high dielectric-constant multilayer packages and soft-and-hard surfaces (SHS)Li, R.L. / DeJean, G. / Tentzeris, M.M. / Laskar, J. et al. | 2003
- 478
-
An investigation of the material and process parameters for thin-film MCM-D and MCM-L technologies up to 100GHzGrzyb, J. / Ruiz, I. / Cottet, D. / Troster, G. et al. | 2003
- 487
-
RF circuit integration using high Q copper inductors on organic substrate and solder-bumped flip chip technologyGuo-Wei Xiao, / Xiao Huo, / Chan, P.C.H. et al. | 2003
- 493
-
A web-based course on integrated passive component technologyUlrich, R. et al. | 2003
- 495
-
Educational modules on RF MEMS and microsystemsPham, A. et al. | 2003
- 498
-
Internet-based performance centered instruction - the link between work and education in microelectronicsTzanova, S. / Schaeffer, C. / Tardif, C. / Royer, N. / Illyefalvi-Vitez, Z. / Mouthaan, T. et al. | 2003
- 503
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Development and dissemination of KEEP - kentucky electronics education projectLumpp, J.K. / Bradley, K.D. et al. | 2003
- 508
-
Improving graduate packaging education through international cooperationWinkler, G. / Virga, K.L. / Prince, J.L. et al. | 2003
- 514
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Role of independent study in creating an effective graduate-level program in electronic packagingCharles, H.K. et al. | 2003
- 520
-
Innovative self-study tools in microsystems packaging education at Dresden University of technologyZema, T. / Oppermann, M. / Wolter, K. / Sauer, W. et al. | 2003
- 524
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Large die flip chip packaging on organic substrates. the role of finite element analysis (FEA), materials characterization, failure analysis (FA) and test vehicles in development spinsGoodelle, J.P. / Amin, A. / Gilbert, J. / Horvath, C. / Nease, E. / Vaccaro, B.T. et al. | 2003
- 536
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Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chipJackson, G.J. / Hendriksen, M.W. / Durairaj, R.K. / Ekere, N.N. / Desmulliez, M.P.Y. / Kay, R.W. et al. | 2003
- 544
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Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrateWu, Y.P. / Alam, M.O. / Chan, Y.C. / Wu, B.Y. et al. | 2003
- 549
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Accurate predictions of flip chip BGA warpageYuan Li, et al. | 2003
- 554
-
Bumpless flip chip packages for cost/performance driven devicesLin, C.W.C. / Chiang, S.C.L. / Yang, T.K.A. et al. | 2003
- 560
-
Viscoelastic properties of underfill for numerical analysis of flip chip packagesMan-Lung Sham, / Jang-Kyo Kim, / Joo-Hyak Park, et al. | 2003
- 567
-
Development of a 4-layer low cost flip chip packaging technologyGovind, A. / Ghahghahi, F. et al. | 2003
- 572
-
Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package familyZhang, L. / Sitaraman, R. / Patwardhan, V. / Nguyen, L. / Kelkar, N. et al. | 2003
- 578
-
Predictive failure model of flip chip on board component level assembliesMuncy, J. / Lazarakis, T. / Baldwin, D. et al. | 2003
- 583
-
Effect of package and board characteristics on solder joint reliability of microstar BGAVariyam, M. / Tz-Cheng Chiu, / Sundararaman, V. / Edwards, D. et al. | 2003
- 589
-
Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assembliesVandevelde, B. / Gonzalez, M. / Beyne, E. / Zhang, G.Q. / Caers, J. et al. | 2003
- 597
-
Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-viasTanaka, N. / Yamaji, Y. / Sato, T. / Takahashi, K. et al. | 2003
- 603
-
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulationSchubert, A. / Dudek, R. / Auerswald, E. / Gollbardt, A. / Michel, B. / Reichl, H. et al. | 2003
- 611
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Damage evolution in Sn62Pb36Ag2 solder of a chip scale pacliage under a monotonic shear stressCanumalla, S. / Mathew, S. / Saha, S.K. et al. | 2003
- 620
-
Novel multi-layer through-die connections for package to chip power and ground connectionsKonimera, S. / Woods, W. / Krusius, J.P. et al. | 2003
- 627
-
A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packagingPremachandran, C.S. / Nagarajan, R. / Chen Yu, / Zhang Xiolin, / Chong Ser Choong, et al. | 2003
- 631
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IC stacking technology using fine pitch, nanoscale through silicon viasSpiesshoefer, S. / Schaper, L. et al. | 2003
- 634
-
Batch fabrication of through-wafer vias in CMOS wafers for 3-D packaging applicationsRasmussen, F.E. / Heschel, M. / Hansen, O. et al. | 2003
- 640
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Mgh density electroplating bonding interconnect technology: chip packaging and high aspect ratio passive elementsYoun-Ho Joung, / Allen, M.G. et al. | 2003
- 647
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High-density packaging technologies on silicon substratesAkazawa, M. / Kuramochi, S. / Tomoko, / Maruyama, / Nakayama, K. / Takano, A. / Yamaguchi, M. / Fukuoka, Y. et al. | 2003
- 652
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Using PDMS microtransfer molding (/apl mu/TM) for polymer flip chipWong, C.K.Y. / Cheung, O.C.T. / Bing Xu, / Yuen, M.M.F. et al. | 2003
- 658
-
Improvement in the properties of Sn-Zn Eutectic based Pb-free solderKwang-Lung Lin, / Kang-I Chen, / Hui-Min Hsu, / Chia-Ling Shi, et al. | 2003
- 664
-
Pb-free bumping by alloying electroplated metal stacksEzawa, H. / Miyata, M. / Seto, M. / Honma, S. et al. | 2003
- 668
-
New fluxless bonding process in air using Sn-Bi with Au capDongwook Kim, / Chin C. Lee, et al. | 2003
- 673
-
Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloyPang, J.H.L. / Xiong, B.S. / Neo, C.C. / Mang, X.R. / Low, T.H. et al. | 2003
- 680
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Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumpsJin-Wook Jang, / De Silva, A. / Jong-Kai Lin, / Frear, D. et al. | 2003
- 685
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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth propertiesSing-Feng Gong, / Guo-Wei Xiao, / Chani, P.C.H. / Lee, R.S.W. / Yuen, M.M.F. et al. | 2003
- 692
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3D large deformation and nonlinear stress analyses of tin whisker initiation and growth on lead-free componentsLau, J.H. / Pan, S.H. / Chen Xa, et al. | 2003
- 698
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Experimental and modeling analysis of the reliability of the anisotropic conductive filmsYin, C.Y. / Lu, H. / Bailey, C. / Chan, Y.C. et al. | 2003
- 703
-
Delamination control in electronic packaging using the energy methodFan, H.b. / Tang, H.B. / Yuen, M.M.F. / Chan, P.C.H. et al. | 2003
- 708
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Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effectsden Toonder, J. / van Dijken, A. / Gonda, V. / Beijer, J. / Kouchi Zhang, / Ernst, L. et al. | 2003
- 714
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Interfacial fracture analysis of underfill delamination and flip chip reliability optimizationZhai, C.J. / Sidharth, / Blish, R. / Master, R. / Parthasarathy, S. et al. | 2003
- 720
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Optimization and stochastic procedures for robust design of photonic packages with applications to a generic packageRadhakrishnan, S. / Subbarayan, G. / Nguyen, L. / Mazotte, W. et al. | 2003
- 727
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Effect of packaging on interfacial cracking in Cu/ low k Damascene structuresGuotao Wang, / Groothuis, S. / Ho, P.S. et al. | 2003
- 733
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Analytical solution for moisture-induced interface delamination in electronic packagingXuejun Fan, / Zhang, G.Q. / van Driel, W. / Ernst, L.J. et al. | 2003
- 739
-
Development of a web-based course on lead free solders for electronics packagingLiu, J. / Andersson, C. et al. | 2003
- 743
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Mechanical properties of packaging materials -the need and a strategy for an educational moduleWiese, S. / Wolter, K. et al. | 2003
- 748
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Flip-chip packaging interconnect technology and reliabilityXiaoling He, et al. | 2003
- 753
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Multimedia for MEMS technologies and packaging educationHarsanyi, G. / Ballun, G. / Bojta, P. / Gordon, P. / Santha, H. et al. | 2003
- 760
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Development of graduate level optoelectronics packaging courses at San Jose state universitySelvaduray, G. / Becker, J.F. et al. | 2003
- 767
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Educational development for mixed-signal design and testNewman, K.E. / Edelstein, G. et al. | 2003
- 770
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International web course on mixed signal IC testKim, B.C. / Varadarajan, V. / Se-Hyun Park, et al. | 2003
- 773
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The optical challenges in next generation networksSocher, M. et al. | 2003
- 776
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Tunable optical filters for dynamic networksHsu, K. / Cormack, R.H. et al. | 2003
- 782
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Micro-electro-mechanically tunable two-chip vcsels for 1.55 /spl mu/mRiemenschneider, F. / Sagnes, I. / Bohm, G. / Halbritter, H. / Maute, M. / Symonds, C. / Amann, M.C. / Meissner, P. et al. | 2003
- 789
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Performance and reliability of widely tunable laser diodesWipiejewski, T. / Akulova, Y.A. / Fish, G.A. / Koh, P.C. / Schow, C. / Kozodoy, P. / Dahl, A. / Larson, M. / Mack, M. / Strand, T. et al. | 2003
- 796
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Integrated tunable transmitters for 10Gb/s long-haul DWDM applicationsHall, J. / Edge, C. / Randle, F. / Pope, S. / Fraser, J. / Loosley, J. / Kimber, E.M. / Firth, P. et al. | 2003
- 801
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Wdm power-level monitor with micro pyramid mirrors formed in arrayed optical waveguideKouta, M. / Oda, M. / Kaneko, T. / Urino, Y. / Huada, T. et al. | 2003
- 805
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Development of internal wavelength lockers for tunable laser applicationsHongtao Han, / Hammond, B. / Boye, R. / Bingzhi Su, / Mathews, J. / TeKolste, B. / Cruz, A. / Knight, D. / Padgett, B. / Aichele, D. et al. | 2003
- 809
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Microstructural and performance implications of gold in Su-Ag-Cu-Sb interconnectionsWeiqun Peng, / Dunford, S. / Viswanadham, P. / Quander, S. et al. | 2003
- 816
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Characterization of solder joint electromigration for flip chip technologyJong-Kai Lin, / Jin-Wook Jang, / White, J. et al. | 2003
- 822
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Tin Whisker formation - results, test methods and countermeasuresDittes, M. / Obemdorff, P. / Petit, L. et al. | 2003
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Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modelingFarooq, M. / Goldmann, L. / Martin, G. / Goldsmith, C. / Bergeron, C. et al. | 2003
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Advances in fine pitch lead free assembly processDoraiswarni, R. / Sankaxwaman, S. / Woopoung Kim, / Jing Li, / Zhuqing Zhang, / Gupta, P. / Nakanishi, K. / Borkar, M. / Madhavan, R. / Govind, V. et al. | 2003
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Fluxless flip chip technique with Sn-rich Au/Sn solder bumpsDongwook Kim, / Chin C. Lee, / Sokolowski, W.M. et al. | 2003
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Fracture toughness of Cu-Sn intennetallic compounds in electronic packagesZhong Chen, / Cahyadi, T. / Ming Li, / Balakrisnan, B. / Chan Choy Chum, et al. | 2003
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Room temperature bonding of ultra-fine pitch and low-profiled Cu electrodes for bump-less interconnectShigetou, A. / Itoh, T. / Matsuo, M. / Hayasaka, N. / Oktumura, K. / Suga, T. et al. | 2003
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Improvement in WL-CSP reliability by wafer thinningLi Wetz, / White, J. / Keser, B. et al. | 2003
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An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configurationGonzalez, M. / Vandevelde, B. / BuIcke, M.V. / Winters, C. / Beyne, E. / Lee, Y.I. / Larson, L. / HArkness, B.R. / Mohamed, M. / Meynen, H. et al. | 2003
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Multi-chip memory module vvith a flip-chip-on-chip structure and an optional center via hole for underfill dispensingLee, S.W.R. / Yat Kit Tsui, / So, R. / Le Luo, et al. | 2003
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High-speed SMT compatible dispenseless underfill process for CSP BGA flip chip assemblyJian Zhang, / Baldwin, D.F. et al. | 2003
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Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packagesPolyakov, A. / Mendes, P.M. / Sinaga, S.M. / Bartek, M. / Rejaci, B. / Correia, J.H. / Burghartz, J.N. et al. | 2003
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Highly reliable and low-cost multi-chip module composed of wafer process packagesNaka, Y. / Tanaka, N. / Naito, T. et al. | 2003
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A non-destructive visual failure analysis technique for cracked BGA interconnectsBragg, J. / Bookbinder, J. / Sanders, G. / Harper, B. et al. | 2003
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-
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solderYoung-Bae Kim, / Noguchi, H. / Amagai, M. et al. | 2003
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-
Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behaviorSahasrabudhe, S. / Monroe, E. / Tandon, S. / Patel, M. et al. | 2003
- 905
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Characterization of die stresses in flip chip on laminate assemblies usingRahim, M.K. / Sulding, J.C. / Copeland, D.S. / Jaeger, R.C. / Lall, P. / Johnson, R.W. et al. | 2003
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A novel defect detection technique using active transient thermography for high density package and interconnectionsChai, T.C. / Wongi, B.S. / Bai, W.M. / Trigg, A. / Lain, Y.K. et al. | 2003
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Application of digital speckle correlation to micro-deformation measurement of a flip chip assemblyPang, J.H.L. / Shi, X.Q. / Zhang, X.R. / Liu, Q.J. et al. | 2003
- 933
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Implementation of low-cost failure detection system using resistance spectroscopyBatra, A. / Lee Fang, / Constable, J.H. et al. | 2003
- 940
-
Novel reworkable fluxing underfill for board level assemblyZhuqing Zhang, / Haiying Li, / Wong, C.P. et al. | 2003
- 946
-
The effects of rheological properties on underfifl processingJinlin Wang, et al. | 2003
- 951
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Nanocomposite underfills for flip-chip applicationsGross, K. / Hackett, S. / Schultz, W. / Thompson, W. et al. | 2003
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Underfill-induced stresses in flip chip assembliesHurley, J.M. / Berfield, T.L. et al. | 2003
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Lead-free molded underfill technology for exposed die flip chip packages assembled in a molded matrix array packages formChoong Kooi Chee, / Szu Shing Lim, / Rudge, V.A. / Periaman, S. / Ai Lin Ong, / Hwa Wei Chan, / Then, E. et al. | 2003
- 971
-
Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level applicationZhuqing Zhang, / Wong, C.P. et al. | 2003
- 978
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Materials characterization and requirements of package applied underfillJayesh Shah, / Morganelli, P. / Wheelock, B. et al. | 2003
- 983
-
Electrical modeling of global interconnects with electromagnetic accuracyAosheng Rong, / Cangellaris, A.C. et al. | 2003
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-
Accurate HSPICE modeling of arbitrary package geometries using transmission-line equivalent techniquesBudell, T. / Clouser, P. / Tremble, E. / Welch, B. et al. | 2003
- 1004
-
Investigation of the impact of conductor surface roughness on interconnect frequency-dependent ohmic lossProekt, L. / Cangellaris, A.C. et al. | 2003
- 1011
-
Waveguide type shield model for LSI chip that reduces EMI and temperatureKikuchi, H. / lbaragi, O. et al. | 2003
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3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effectJun So Pak, / Joungho Kim, et al. | 2003
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A new dispersive, hybrid phase-pole macromodel for frequency-dependeut lossy transmission linesBing Zbong, / Dvorak, S.L. / Prince, J.L. et al. | 2003
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Accurate modeling of multilayer packaging structures with a hybrid FDTD methodDalton, E.T.K. / Kunze, M. / Heinrich, W. / Tentzeris, M.M. et al. | 2003
- 1032
-
Multi-channel optical interconnects for short-reach applicationsDolfi, D.W. et al. | 2003
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10 Gbit/s per channel parallel optical transmitter and receiver modules for high-capacity interconnectsShishikura, M. / Ban, T. / Ichikawa, H. / Ido, T. / Takahashi, M. / Nakahara, K. / Nomoto, E. / Matsmoka, Y. / Ishikawa, K. / Ito, K. et al. | 2003
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High speed optical interconnection using embedded PDs on electrical boardsSang-Yeon Cho, / Hall, J.D. / Chellappa, A. / Jokerst, N.M. / Brooke, M. et al. | 2003
- 1053
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Planar glass waveguides for ffigh performance electrical-optical-circuit-boards (EOCB) - the glass-layer-conceptSchroder, H. / Amdt-Staufenbiel, N. / Cygon, M. / Scheel, W. et al. | 2003
- 1060
-
Performance comparison of parallel optical interconnects for enterprise serversDeCusatis, C. / Atkins, R. et al. | 2003
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Comparison of electrical and optical interconnectJaernin Shin, / Chung-Seok Seo, / Chellappa, A. / Brooke, M. / Chattejce, A. / Jokerst, N.M. et al. | 2003
- 1073
-
Opto-electronic backplane technology for cost effective bandwidth managementMeis, M.A. et al. | 2003
- 1080
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Chip-to-wafer stacking technology for 3D system integrationKlumpp, A. / Merkel, R. / Wieland, R. / Ramm, P. et al. | 2003
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Ultra-high-density 3D chip stacking technologyTanida, K. / Umemoto, M. / Tomita, Y. / Tago, M. / Nemoto, Y. / Ando, T. / Takahashi, K. et al. | 2003
- 1090
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Planar metallization intemonnected 3-D multi-chip moduleZhenxian Liang, / van Wyk, J.D. et al. | 2003
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Design and stacking of an extremely thin chip-scale packageYoshida, A. / Ishibashi, K. et al. | 2003
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Stacked 3-D MCP with plastic ball vertical interconnectionsMiettinen, J. / Tanskaneu, J. / Ristolainen, E.O. et al. | 2003
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Board level reliability of three-dimensional systems in package (SIPs)Sugiyama, T. / Yano, Y. / Ishihara, S. / Maruyama, T. / Juso, H. / Kirnura, T. / Kada, M. et al. | 2003
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Development of distributed sensing systems of autonomous micro-modulesBarton, J. / Delaney, K. / Bellis, S. / O'Mathuna, C. / Paradiso, J.A. / Benbasat, A. et al. | 2003
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Development of a novel technology for building flexible and wearable integrated systemsHealy, T. / Donnelly, J. / O'Neill, B. / O'Mahoney, C. / Alderman, J. / Mathewson, A. et al. | 2003
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New assembly technologies for textile transponder systemsKallmayer, C. / Pisarek, R. / Neudeck, A. / Cichos, S. / Gimpel, S. / Aschenbrenner, R. / Reichlt, H. et al. | 2003
- 1127
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Optical solder effects of self-written waveguides in optical circuit devices couplingHirose, N. / Ibaragi, O. et al. | 2003
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A novel technology for stacking microvias on printed wiring boardFuhan Liu, / White, G.E. / Sundaram, V. / Aggarwal, A.O. / Hosseini, S.M. / Sutter, D. / Tummala, R.R. et al. | 2003
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Laser ablation as an enabling technology for opto-boardsVan Daele, P. / Geerinck, P. / Van Steenberge, G. / Van Put, S. / Cauwe, M. et al. | 2003
- 1147
-
Demonstration of on-PCB optical interconnection using surface-mount package and polymer waveguideIshii, Y. / Tsuyoshi, / Hayashi, / Takahara, H. et al. | 2003
- 1153
-
Embedded optical interconnections on printed wiring boardsSuzuki, T. / Nonaka, T. / Sang-Yeon Cho, / Jokerst, N.M. et al. | 2003
- 1160
-
Prediction of delamination in a Bi-material system based on free-edge energy evaluationFan, H.B. / Yuen, M.M.F. / Suhir, E. et al. | 2003
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A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packagesTay, A.A.O. / Phang, J.S. / Wong, E.H. / Ranjan, R. et al. | 2003
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Failure analysis of full delamination on the stacked die leaded packagesLin, T.Y. / Xiong, Z.P. / Yao, Y.E. / Tok, L. / Yue, Z.Y. / Njurnan, B. / Chua, K.H. et al. | 2003
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Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesivesCaers, J.F.J.M. / Zhao, X.J. / Wong, E.H. / Ong, C.K. / Wu, Z.X. / Ranjan, R. et al. | 2003
- 1181
-
RF PA module substrate via reliabilityDarveaux, R. / Jicheng Yang, / Sheridan, R. / Buella, B. / Villareal, P. et al. | 2003
- 1190
-
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder jointsWon Kyoung Choi, / Sung K. Kang, / Yoon Chul Sohn, / Da-Yuan Shih, et al. | 2003
- 1197
-
Reliability evaluation structures for stacked thin dice packagingKarjalainen, P. / Tanskanen, J. / Ristolainen, E.O. et al. | 2003
- 1203
-
Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMsYoung-Doo Jeon, / Ostmann, A. / Reichl, H. / Kyung-Wook Paik, et al. | 2003
- 1209
-
Investigation of electroplating Ni UBM for Pb-free soldersShu-Ming Chang, / Uang, R. / Dau-Chi Liou, / Hsu-Tien Hu, / Kuo-Chuan Chen, / Yu-Fang Chen, / Yu-Hua Chen, et al. | 2003
- 1215
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Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal historiesLehman, L.P. / Kinyanjui, R.K. / Zavalij, L. / Zribi, A. / Cotts, E.J. et al. | 2003
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UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packagingSeung Wook Yoon, / Kripesh, V. / Wong Wai Kwan, / Li Chao Yong, / Chen Man Tong, / Gui Dong, / Rasiah, I.J. / Iyer, M.K. et al. | 2003
- 1230
-
Investigation of Co UBM for direct bumping on Cu/LowK diesLabie, R. / Beyne, E. / Ratchev, P. et al. | 2003
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Effects of antimony on the growth of intermetallic compounds in Sa-Ag-Cu Pb-free solder jointsChen, B.L. / Li, G.Y. et al. | 2003
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-
Interfacial reaction of eutectic AuSi solder with SiJin-Wook Jang, / Hayes, S. / Jong-Kai Lin, / Frear, D. et al. | 2003
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Model-to-hardware correlations in the design of a 50Gb/s packageShan, L. / Meghelli, M. / Rylyakov, A. / Trewhella, J. / Oprysko, M. et al. | 2003
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Analysis of PF flip-chip on-chip inductance with novel measurement technologyGye-An Lee, / Megahed, M. / De Flaviis, F. et al. | 2003
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-
Broadband characterization of package dielectricsBraunisch, H. / Dong-Ho Han, et al. | 2003
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High frequency modeling and characterization of pin and land grid array socketsDong-Ho Han, / Prokofiev, V. / Leigh, W. / Polka, L. / Ruttan, T. et al. | 2003
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Electrical modeling and characterization of packaging solutions utilizing lead-free second level interconnectsO'Connor, D.P. / Hamel, H. / Spring, C. / Audet, J. et al. | 2003
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-
Simple and accurate determination of complex permittivity and skin effect of FR4 material in gigahertz regimeBois, K.J. / Kirk, B. / Tsuk, M. / Quint, D. et al. | 2003
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Effect of decoupling capacitor on signal integrity in applications with reference plane changeJunho Lee, / La, A.W. / Wei Fan, / Lai L. Wai, / Joungho Kim, et al. | 2003
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Micro photonic integrated circuits for low-cost optical systemsIshak, W.S. et al. | 2003
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High performance and highly functional semiconductor optical amplifiers based on hybrid and monolithic integrationDagenais, M. / Heim, P.S. / Wilson, S.W. / Saini, S.S. / Bowler, D. / Horton, T. / Yimin Hu, / Yu, A. / Leavitt, R. / Stone, D.R. et al. | 2003
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Automated assembly and packaging of hybrid optical modulesMadsen, H. / Shiv, L. / Eiger, G. / Hase, A. / Heschel, M. / Kulunann, J. et al. | 2003
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Quasi-hermetic photonic packages with polymer sealants in a central office environmentXu, F.Y. et al. | 2003
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Direct-coupling fiber retention using laser soldering: technical and economic benefitsFlanagan, C. / Trask, S. / Heyler, R. et al. | 2003
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High coupling efficiency actively aligned laser modules using micro-heaters and pre-compensastionDatta, M. / Dagenais, M. et al. | 2003
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Silicon microlens on V-groove platform for low-cost and high-performance optical modulesShimura, D. / Uckawa, M. / Komni, K. / Macao, Y. / Sasaki, H. / Takamori, T. et al. | 2003
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Novel method of separating probe and wire bond regions without increasing die sizeLois Yong, / To Anh Tran, / Lee, S. / Williams, B. / Ross, J. et al. | 2003
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Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebondingTay, A.A.O. / Ng, B.H. / Ong, S.H. et al. | 2003
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Assembly challenges related to fine pitch in-line and staggered bond pad devicesRuston, M. / Tu Anh Tran, / Yong, L. / Youngblood, A. / Ravenscraft, D. / Harun, F. / Kok Wai Mui, et al. | 2003
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Reliability of bond over active pad structures for 0.13-/spl mu/m CMOS technologyHess, K.J. / Downey, S.H. / Halt, G.B. / Lee, T. / Mercado, L.L. / Miter, J.W. / Ng, W.C. / Wontor, D.G. et al. | 2003
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Problems with wirebonding on probe marks and possible solutionsSauter, W. / Aoki, T. / Hisada, T. / Miyai, H. / Petrarea, K. / Beaulied, F. / Allard, S. / Power, J. / Agbesi, M. et al. | 2003
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Improving the deflection of wire bonds in stacked chip scale package (CSP)Yao, Y.F. / Lin, T.Y. / Chua, K.H. et al. | 2003
- 1364
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Design optimization of wire bonding for advanced packagingLu, A.C.W. / Wei Fan, / Lai L. Wai, / Wang, C.K. / Low, H.G. et al. | 2003
- 1373
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Effect of sacrificial anodic fillers on contact resistance stability of electrically conductive adhesives onto lead-free alloy surfacesHaiying Li, / Kyoung-Sik Moon, / Wong, C.P. et al. | 2003
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Effect of void in the anisotropic conductive assemblyYeung, N.H. / Chan, Y.C. / Tan, S.C. / Lee, K.K. / Chan, K.K. et al. | 2003
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Thermal conductivity and RF signal transmission properties of Ag-filled epoxy resinKimura, T. / Nakai, T. / Ishikawa, H. / Ooyama, C. / Oosawa, K. / KoWnata, S. et al. | 2003
- 1391
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A reworkable epoxy resin for isotropically conductive adhesiveHaiying Li, / Wong, C.P. et al. | 2003
- 1398
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Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applicationsMyung-Jin Yim, / In ho Jung, / Hyung-Kyu Choi, / Kijoong Kim, / Jia-Sang Hwang, / Jin-Yong Ahn, / Woonseong Kwon, / Kyung Wook Paik, et al. | 2003
- 1404
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Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT componentsCavasin, D. / Ken Brice-Heames, / Arab, A. et al. | 2003
- 1408
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Thermo-mechanical behavior of a novel light modulatorZhimin Mo, / Kristiansen, H. / Eliassen, M. / Shiming Li, / Liu, J. et al. | 2003
- 1413
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Modeling the performance of embedded gridded plane structures in LTCCGuang Chen, / Virga, K.L. / Winkler, G. / Prince, J.L. et al. | 2003
- 1419
-
Substrate design optimization for high speed linksde Aranjo, D.N. / Cases, M. / Nam Pharn, / Rubin, B. et al. | 2003
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Dependence of bus performance on the choice of BGA package used for a formatter chip in a printer cardKaw, R. / Kelly, M.G. / Casprowiak, J.H. / Batey, R.M. et al. | 2003
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Pentium 4 processor package design and developmentHasan, A. / Sathe, A. / Wood, D. / Viswanath, R. et al. | 2003
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Split-ground effects of electronic package on the input-level of high-speed DRAMJongjoo Lee, / Junghwan Choi, / Dong-Ho Lee, et al. | 2003
- 1445
-
Electrical design and characterization of differential pairs of low cost PBGA package for 10 Gbps applicationsXingling Zhou, / Fang, N.J. et al. | 2003
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Package electrical specifications for giga bit signaling I/OsShrivastava, U.A. / Prokofiev, V. / Chee Hoo Lee, / Augustine, A. / Polka, L. et al. | 2003
- 1459
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Wafer deposition/metallization and back grind, process-induced warpage simulationIrving, S. / Youg Liu, et al. | 2003
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Cost-performance wafer thinning technologyWu, L. / Chan, J. / Hsiao, C.S. et al. | 2003
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Lead-free solder bumping process for high temperature automotive applicationTeutsch, T. / Blankenhorn, R.G. / Zakel, E. et al. | 2003
- 1472
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Establishing control factors of intermetallic formation mithin Pb-free solder bumps at flip chip gometriesJackson, G.J. / Hendriksen, M.W. / Horsley, R. / Hoo, N. / Salam, B. / Ekere, N.N. et al. | 2003
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The study on the improvement of lead broken failure in TCP using new Sn pre-plating methodDea-Woo Son, / Kwan-Jae Lee, / Ji-Hwan Hwang, / Si-Hoon Lee, / Ye-Chung Chung, / Kang, S.Y. et al. | 2003
- 1484
-
Development of interconnect technologies for embedded organic packagesSunohara, M. / Murayama, K. / Higashi, M. / Shimizu, M. et al. | 2003
- 1490
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Development of improved thermal performance embedded heat slug plastic ball grid array packageZahn, B.A. / Carson, F. / Lee, T.K. / Coronado, R. / Mitchell, D. et al. | 2003
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Design rule development for electrical modeling of RF multilayer packaging inductorsDavis, M.F. / Pratap, R.J. / Pinet, S. / Jalan, U. / Kim, D.-K. / Laskar, J. / May, G.S. et al. | 2003
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A new system-on-a-chip (SOC) technology high Q post passivation inductorsLin, M.S. / Ling Chen, / Lee, J.Y. / Wan, K.H. / Chen, H.M. / Chou, K. / Hsiao, R. / Lin, E. et al. | 2003
- 1510
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Analysis of high-Q on-chip inductors realized by wafer-level packaging techniquesSun, X. / Carchon, G. / De Raedt, W. / Beyne, E. et al. | 2003
- 1516
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New design for high reliability, fillet-less thick film chip resistorsKadim, Y. / Akhtman, L. et al. | 2003
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Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)Balaraman, D. / Raj, P.M. / Abothu, I.R. / Bhattacharya, S. / Dalmia, S. / Lixi Wan, / Swaininathan, M. / Tummala, R. et al. | 2003
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Development of PWBs with resin composite capacitors for RF module substratesShimada, Y. / Otsuka, K. / Mata, Y. et al. | 2003
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Tunable ferroelectric capacitor with low-loss electrodes fabricated using reverse side exposureYong-Kyu Yoon, / Allen, M.G. / Hunt, A.T. et al. | 2003
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TopFinder: a new and efficient tool for topology construction and parameter extraction for RF/merowave transistorsAbdeen, M. / Yagoub, M.C.E. et al. | 2003
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Design of RF and wireless packages using fast hybrid electromagnetic/statistical methodsBushyager, N. / Martin, L. / Khushrushahi, S. / Basat, S. / Tentzeris, M.M. et al. | 2003
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RF evaluation of low-cost leadless packages and development of distributed electrical modelsChandrasekhar, A. / Brebels, S. / Beyne, E. / De Raedt, W. / Nauwelaers, B. / Van Bever, T. et al. | 2003
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RLC effects in fine pitch anisotropic conductive film connectionsDou, G.B. / Chan, Y.C. / Monis, J.E. / Yeung, N.H. et al. | 2003
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Model based alignment of optical waveguidesElsey, J. / Law, S. / Poladian, L. et al. | 2003
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Variations in package radiation due to changes in on-die and on-package capacitanceHill, M.J. / Jiangqi He, / Parmar, P. et al. | 2003
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A limiting amplifier module using wafer level package for 10Gbps optical transmission systemChul-Won Ju, / Kyu-Ha Pack, / Hee-Tae Lee, / Eun-Su Nam, / Kyoung-lk Joe, et al. | 2003
- 1576
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Electrical analysis and simulation solution for RF SAW filter packageDongyoung Kim, / Heuisung Jang, / Sungkil Hwang, et al. | 2003
- 1582
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A new efficient equivalent circuit extraction method for multi-port high speed package using multi-input multi-output transmission matrix and polynomial curve fittingHeeseok Lee, / Kiwon Choi, / Kyoung-Lae Jang, / Taeje Cho, / Seyong Oh, et al. | 2003
- 1589
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Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packagesJunwoo Lee, / Yeo Mui Seng, / Rotaru, M.D. / lyer, M.K. / Joungho Kim, et al. | 2003
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Intelligent network communicator: highly integrated system-on-package (SOP) testbed for RF/digital/opto applicationsKyntae Lim, / Davis, M.F. / Moonkyun Maeng, / Pinel, S. / Lixi Wan, / Laskar, J. / Sundaram, V. / White, G. / Swaminathan, M. / Tunimala, R. et al. | 2003
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Unique white LED packaging systemsOkuno, A. / Miyawaki, Y. / Oyama, N. / Wang Dongxu, et al. | 2003
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Degradation factors for eye diagrams using FDTD/SPICEOrhanovic, N. / Divekar, D. / Matsui, N. et al. | 2003
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Inductance calculation of complicated interconnects under the influence of a ground planeOn, J. / Yu-Ting Yeh, / Caggiano, M.F. et al. | 2003
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Multilayer power delivery network design for high-speed microprocessor systemScong-Geun Park, / JiSeong Kim, / Jong-Gwan Yook, / Han-Kyu Park, et al. | 2003
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A neural network model for sensitivity analysis of circuit parameters for flip chip interconnectsPratap, R.J. / Pinel, S. / Staiculescu, D. / Laskar, J. / May, G.S. et al. | 2003
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Design and electrical characterization of a novel wafer level package for RF MEMS applicationsRotaru, N.D. / Premachandran, C.S. / Iyer, M.K. et al. | 2003
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A method of multi-node thermal network extraction for SPICE compatible simulationsLei Shan, / Kuchta, D. / Young Kwark, et al. | 2003
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Measurements and modeling of the temperature dependent material behavior of underfill encapsulantsIslam, M.S. / Suhling, J.C. / Lall, P. / Baohua Xu, / Johnson, R.W. et al. | 2003
- 1644
-
Electrical and mechanical properties of carbon black filled ethylene propylene rubber during thermal oxidation agingYangyang Sun, / Shijian Luo, / Wong, C.P. et al. | 2003
- 1648
-
Microwave analogue to a subwavelength plasmon switehSweatlock, L.A. / Maier, S.A. / Atwater, H.A. et al. | 2003
- 1652
-
W-band characterization of finite ground coplanar transmission lines on liquid crystal polymer (LCP) substratesThompson, D. / Kirby, P. / Papapolymeron, J. / Tentzeris, M.M. et al. | 2003
- 1656
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Qualitative analysis of coupled transmission linesWenliang Tseng, / Sonfu Yeh, / Pojen Huang, / Chauchin Su, et al. | 2003
- 1664
-
Application of embedded edge terminations to reduce the edge radiation and noise in high-speed printed circuit boardsVaidya, S. / Adsure, V. / Swaininathan, M. / Kroger, H. et al. | 2003
- 1669
-
A new low cost optical transmitter package with uncooled thermal solution and J-down assemblyLing Xie, / Pinjala, D. / Sudharsanam, K. / Pamidighantam, R. / Iyer, M.K. / Ishimura, E. et al. | 2003
- 1674
-
High precision adhesives for free space micro-optics applicationsXu, F.Y. et al. | 2003
- 1681
-
Magnetic/semiconductor multilayer flip-chip-type tunable bandstop filterYoo, H.J. / Tseng, S.-H. / Tsai, C.S. et al. | 2003
- 1684
-
3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnectsYida Zou, / Lau, J. / Catnerlo, S. et al. | 2003
- 1691
-
Advances in low temperature co-fired ceramic (LTCC) for ever increasing microelectronic applicationsAnnas, S. et al. | 2003
- 1694
-
Test-structure free modeling method for de-embedding the effects of pads on device modelingCheolung Cha, / Zhaoran Huang, / Jokerst, N.M. / Brooke, M.A. et al. | 2003
- 1701
-
Microwave curing of anisotropic conductive film: effects of principal parameters on curing situationChan, K.K. / Yeung, N.H. / Chan, Y.C. / Tam, S.C. / Lee, K.K. et al. | 2003
- 1705
-
Electronics and the environmentCharles, H.K. / Simadurai, N. et al. | 2003
- 1714
-
Intermittency study of a stressed-metal micro-spring sliding electrical contactChow, E.M. / Klein, K. / Fork, D.K. / Hamschel, T. / Chua, C.L. / Lai Wong, / Van Schuylenbergh, K. et al. | 2003
- 1718
-
Optimization of variable frequency microwave curing using neural networks and genetic algorithmsDavis, C. / Tanikella, R. / Taehyan Sung, / Kohl, P. / May, G. et al. | 2003
- 1724
-
Optimization of stencil printing wafer bumping for fine pitch flip chip applicationsJing-Feng Gong, / Yau, E.W.C. / Chan, P.C.H. / Lee, R.S.W. / Yuen, M.M.F. et al. | 2003
- 1731
-
Analysis of solder joint fracture under mechanical bending testHarada, K. / Baba, S. / Qiang Wu, / Matsushima, H. / Matsunaga, T. / Ucgai, Y. / Kimura, M. et al. | 2003
- 1738
-
Investigations of void forming and shear strength of Sn42Bi58 solder joints for low cost applicationsHerzog, Th. / Wolter, K.-J. / Poetzsch, F. et al. | 2003
- 1746
-
Crack length analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studiesDonghyun Kim, / Dias Filho, J.M. / Changyoung Park, / Mawer, A. / Moon, T.J. / Masada, G.Y. et al. | 2003
- 1754
-
Technique and equipment for rework of flip chips with no flow underfillerKuerbis, G. / Heinze, R. / Wolter, K. et al. | 2003
- 1761
-
A thermal aging study on both Au-Cu and Au-Al wire-bonded interfacesChu-Chung Lee, / Tu-Anh Tran, / Yong, L. / Harun, F. / Yong, C.C. et al. | 2003
- 1767
-
Characterisation of intermetallic Ag\ing in flip chip solder bumpsLiuf, C. / Dezhi Li, / Conway, P. et al. | 2003
- 1772
-
Delamination modeling for IC package mrith multiple initial cracksYong Liu, / Irving, S. / Rioux, M. et al. | 2003
- 1777
-
Measurement and prediction of reliability for double-sided area array assembliesMeifunas, M. / Pitarresi, J.M. / Primavera, A. / Mandepudi, S.K. / Parupalli, S. et al. | 2003
- 1784
-
Analysis of flip-chip packaging challenges on copper low-k interconnectsMercado, L.L. / Goldberg, C. / Shun-Meen Koo, / Lee, T.T. / Pozer, S. et al. | 2003
- 1791
-
Adhesion improvement of thermoplastic conductive adhesives under humid environmentMoon, K. / Rockett, C. / Kretz, C. / Burgoyne, W.F. / Wong, C.P. et al. | 2003
- 1800
-
Microwave measurements on dielectric constants and dissipation factors of dielectric materialsJeong Park, / Lee, J.S. / Lee, C.C. et al. | 2003
- 1804
-
Use of dendirimers to control nanoparticle size in polymer-metal nanocomposites for embedded capacitor applicationPothukuchi, S. / Wong, C.P. et al. | 2003
- 1809
-
Comparison of the adhesion strength of epoxy and silicone based thermal interface materialsPrabhakumar, A. / Zhong, A. / Tonapi, S. / Sherman, D. / Cole, H. / Schattenmann, F. / Srihari, K. et al. | 2003
- 1815
-
Copper foils for high density IC packages - starting from foil/dielectric adhesionShichun Qu, / Goffell, R.E. / Kieschke, R.R. et al. | 2003
- 1820
-
A study on epoxy-based high K composite for embedded capacitor vath silver fillers coated self assembly monolayer insulating materialsYang Rao, / Ke Tang, / Wong, C.P. et al. | 2003
- 1823
-
Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAsShook, R.L. / Gilbert, J.J. / Thomas, E. / Vaccaro, B.T. / Dairo, A. / Horvath, C. / Libricz, G.J. / Crouthamel, D.L. / Gerlach, D.L. et al. | 2003
- 1829
-
Lead-free wave soldering development for pcb assemblySunappan, V. / Collier, P. et al. | 2003
- 1839
-
Thermal limits in reflow soldering processSvasta, P. / Simion-Zanescu, D. et al. | 2003
- 1843
-
Interfacial adhesion analysis of BCB/TiW/Cu/PbSn technology in waferlevel packagingTopper, M. / Achen, A. / Reichl, H. et al. | 2003
- 1847
-
Advanced equipment control (AEC) using knowledge management concept in semiconductor equipmentWang, J.C. / Min-Liang Huang, et al. | 2003
- 1850
-
Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologiesGuo-Wei Xiao, / Jing-Feng Gong, / Yau, E.W.C. / Chan, P.C.H. / Lee, R.S.W. / Yuen, M.M.F. et al. | 2003
- 1856
-
Evaluation of the oven reflow bonding and flip chip bonder bonding of lead free Sn0.7Cu solder bumped die on low-cost FR-4 substrate for flip-chip applicationsYau, E.W.C. / Hong, D.F.W. / Chan, P.C.H. et al. | 2003
- 1862
-
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloyQian Zhang, / Dasgupta, A. / Haswell, P. et al. | 2003
- 1869
-
SMT process robustness and board level solder joint reliability of C/sup 2/BGATiao Zhou, / Villa, C.M. / Tong Yan Tee, / Haibin Du, et al. | 2003
- i
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53rd Electronic Components A Technology Conference| 2003
- xxvii
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Author index - ECTC 2003| 2003