Explore IEL IEEE's most comprehensive resource (Englisch)
In:
IEEE Transactions on Semiconductor Manufacturing
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20
, 4
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588
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2007
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Explore IEL IEEE's most comprehensive resource
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Erschienen in:IEEE Transactions on Semiconductor Manufacturing ; 20, 4 ; 588
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.11.2007
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Format / Umfang:348760 byte
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 20, Ausgabe 4
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 341
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2006 Best Paper AwardBoning, Duane et al. | 2007
- 343
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Special Section on Advanced Process ControlMoyne, James R. / Patel, Nital S. et al. | 2007
- 343
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SPECIAL SECTION GUEST EDITORIAL - Special Section on Advanced Process ControlMoyne, J.R. et al. | 2007
- 345
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SPECIAL SECTION PAPERS - Fault Detection Using the k-Nearest Neighbor Rule for Semiconductor Manufacturing ProcessesHe, Q.P. et al. | 2007
- 345
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Fault Detection Using the k-Nearest Neighbor Rule for Semiconductor Manufacturing ProcessesHe, Q.P. / Jin Wang, et al. | 2007
- 355
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An Unsupervised Diagnosis for Process Tool Fault Detection: The Flexible Golden PatternLacaille, J. / Zagrebnov, M. et al. | 2007
- 355
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SPECIAL SECTION PAPERS - An Unsupervised Diagnosis for Process Tool Fault Detection: The Flexible Golden PatternLacaille, J. et al. | 2007
- 364
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An Approach for Factory-Wide Control Utilizing Virtual MetrologyKhan, A.A. / Moyne, J.R. / Tilbury, D.M. et al. | 2007
- 364
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SPECIAL SECTION PAPERS - An Approach for Factory-Wide Control Utilizing Virtual MetrologyKhan, A.A. et al. | 2007
- 376
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Critical Dimension Uniformity Via Real-Time Photoresist Thickness ControlWeng Khuen Ho, / Tay, A. / Ming Chen, / Jun Fu, / Haijing Lu, / Xuechuan Shan, et al. | 2007
- 376
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SPECIAL SECTION PAPERS - Critical Dimension Uniformity via Real-Time Photoresist Thickness ControlHo, W.K. et al. | 2007
- 381
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SPECIAL SECTION PAPERS - Performance Assessment of Run-to-Run EWMA ControllersPrabhu, A.V. et al. | 2007
- 381
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Performance Assessment of Run-to-Run EWMA ControllersPrabhu, A.V. / Edgar, T.F. et al. | 2007
- 386
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An Evaluation of the Benefits of Integrating Run-to-Run Control With Scheduling and Dispatching SystemsAnderson, M. / Hanish, C.K. et al. | 2007
- 386
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SPECIAL SECTION PAPERS - An Evaluation of the Benefits of Integrating Run-to-Run Control With Scheduling and Dispatching SystemsAnderson, M. et al. | 2007
- 393
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A Fab-Wide APC Sampling ApplicationHolfeld, A. / Barlovic, R. / Good, R.P. et al. | 2007
- 393
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SPECIAL SECTION PAPERS - A Fab-Wide APC Sampling ApplicationHolfeld, A. et al. | 2007
- 400
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An MILP Approach to Wafer Sampling and SelectionGood, R.P. / Purdy, M.A. et al. | 2007
- 400
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SPECIAL SECTION PAPERS - An MILP Approach to Wafer Sampling and SelectionGood, R.P. et al. | 2007
- 408
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SPECIAL SECTION PAPERS - SEMI E133 -- The Process Control System Standard: Deriving a Software Interoperability Standard for Advanced Process Control in Semiconductor ManufacturingMoyne, J.R. et al. | 2007
- 408
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SEMI E133—The Process Control System Standard: Deriving a Software Interoperability Standard for Advanced Process Control in Semiconductor ManufacturingMoyne, J.R. / Hajj, H. / Beatty, K. / Lewandowski, R. et al. | 2007
- 421
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Self-Assembly for Semiconductor IndustryWei Lu, / Sastry, A.M. et al. | 2007
- 421
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Process Technology, Characterization, and Optimization - Self-Assembly for Semiconductor IndustryLu, W. et al. | 2007
- 432
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Process Technology, Characterization, and Optimization - A Coupled-Simulation-and-Optimization Approach to Nanodevice Fabrication With Minimization of Electrical Characteristics FluctuationLi, Y. et al. | 2007
- 432
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A Coupled-Simulation-and-Optimization Approach to Nanodevice Fabrication With Minimization of Electrical Characteristics FluctuationYiming Li, / Shao-Ming Yu, et al. | 2007
- 439
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Process Technology, Characterization, and Optimization - Modeling of Wafer Topography's Effect on Chemical-Mechanical Polishing ProcessWu, L. et al. | 2007
- 439
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Modeling of Wafer Topography's Effect on Chemical–Mechanical Polishing ProcessLixiao Wu, et al. | 2007
- 451
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Nonuniformity of Wafer and Pad in CMP: Kinematic Aspects of ViewTyan Feng, et al. | 2007
- 451
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Process Technology, Characterization, and Optimization - Nonuniformity of Wafer and Pad in CMP: Kinematic Aspects of ViewFeng, T. et al. | 2007
- 464
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Pad Conditioning Density Distribution in CMP Process With Diamond DresserTyan Feng, et al. | 2007
- 464
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Process Technology, Characterization, and Optimization - Pad Conditioning Density Distribution in CMP Process With Diamond DresserFeng, T. et al. | 2007
- 476
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Electrical and Reliability Characteristics of 12- $\hbox{\rm \AA}$ Oxynitride Gate Dielectrics by Different Processing TreatmentsTung-Ming Pan, et al. | 2007
- 476
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Reliability - Electrical and Reliability Characteristics of 12-Å Oxynitride Gate Dielectrics by Different Processing TreatmentsPan, T.-M. et al. | 2007
- 476
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Electrical and Reliability Characteristics of 12-A Oxynitride Gate Dielectrics by Different Processing TreatmentsPan, T.-M. et al. | 2007
- 482
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A Method to Recover Defective Aluminum Interconnect Films in Mass ProductionChew, P. / Yeap, C.B. / Cham, J. / Goh, A. / Rossi, N. / Singh, R. / Ong, K. / Toh, H.T. et al. | 2007
- 482
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Reliability - A Method to Recover Defective Aluminum Interconnect Films in Mass ProductionChew, P. et al. | 2007
- 488
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Across Wafer Critical Dimension Uniformity Enhancement Through Lithography and Etch Process Sequence: Concept, Approach, Modeling, and ExperimentQiaolin Zhang, / Poolla, K. / Spanos, C.J. et al. | 2007
- 488
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Advanced Process Control - Across Wafer Critical Dimension Uniformity Enhancement Through Lithography and Etch Process Sequence: Concept, Approach, Modeling, and ExperimentZhang, Q. et al. | 2007
- 506
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Model Context Selection for Run-to-Run ControlVanli, O.A. / Patel, N.S. / Janakiram, M. / Del Castillo, E. et al. | 2007
- 506
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Advanced Process Control - Model Context Selection for Run-to-Run ControlVanli, O.A. et al. | 2007
- 517
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Factory Modeling and Control - The Integrated Room Layout for a Semiconductor Facility PlanChung, J. et al. | 2007
- 517
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The Integrated Room Layout for a Semiconductor Facility PlanJaewoo Chung, / Jaejin Jang, et al. | 2007
- 528
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Factory Modeling and Control - Using Rough Set Theory to Recruit and Retain High-Potential Talent for Semiconductor ManufacturingChien, C.-F. et al. | 2007
- 528
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Using Rough Set Theory to Recruit and Retain High-Potential Talent for Semiconductor ManufacturingChien, C.-F. / Chen, L.-F. et al. | 2007
- 528
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Using Rough Set Theory to Recruit and Retain High-Potential Talents for Semiconductor ManufacturingChen-Fu Chien, / Li-Fei Chen, et al. | 2007
- 542
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Metrology - A Review of Metrology for NanoelectronicsGalatsis, K. et al. | 2007
- 542
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A Review of Metrology for NanoelectronicsGalatsis, K. / Potok, R. / Wang, K.L. et al. | 2007
- 549
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A Discussion on How to Define the Tolerance for Line-Edge or Linewidth Roughness and Its Measurement MethodologyYamaguchi, A. / Steffen, R. / Kawada, H. / Iizumi, T. / Sugimoto, A. et al. | 2007
- 549
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Metrology - A Discussion on How to Define the Tolerance for Line-Edge or Linewidth Roughness and Its Measurement MethodologyYamaguchi, A. et al. | 2007
- 556
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Metrology - Investigation of Detection Limits of Resistive Contact Plugs in Electron Beam Inspection Using Modeling and SimulationDe, I. et al. | 2007
- 556
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Investigation of Detection Limits of Resistive Contact Plugs in Electron Beam Inspection Using Modeling and SimulationDe, I. / Shadman, K. / Zapalac, G. et al. | 2007
- 566
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Metrology - Dual-Phase Virtual Metrology SchemeCheng, F.-T. et al. | 2007
- 566
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Dual-Phase Virtual Metrology SchemeFan-Tien Cheng, / Hsien-Cheng Huang, / Chi-An Kao, et al. | 2007
- 572
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Membrane-Coupled Methanogenic and Facultative Bioreactor in Wastewater TreatmentHuey-Song You, / Shanshan Chou, / Kuan-Foo Chang, / Ni, C.H. / Pan, J.R. / Chihpin Huang, et al. | 2007
- 572
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Ultraclean and Environmentally Benign Manufacturing - Membrane-Coupled Methanogenic and Facultative Bioreactor in Wastewater TreatmentYou, H.S. et al. | 2007
- 578
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Experimental Investigations on Particle Contamination of Masks Without Protective Pellicles During Vibration or Shipping of Mask CarriersSe-Jin Yook, / Fissan, H. / Asbach, C. / Jung Hyeun Kim, / Dutcher, D.D. / Pei-Yang Yan, / Pui, D.Y.H. et al. | 2007
- 578
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Ultraclean and Environmentally Benign Manufacturing - Experimental Investigations on Particle Contamination of Masks Without Protective Pellicles During Vibration or Shipping of Mask CarriersYook, S.A. et al. | 2007
- 585
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2008 Joint Non-Volatile Semiconductor Memory Workshop/International Conference on Memory Technology and Design (NVSMW)| 2007
- 585
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ANNOUNCEMENTS - Call for Papers: 2008 Joint Non-Volatile Semiconductor Memory Workshop-International Conference on Memory Technology and Design (NVSMW)| 2007
- 586
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The 20th International Symposium on Power Semiconductors and ICs (ISPSD'08)| 2007
- 586
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ANNOUNCEMENTS - Call for Papers: The 20th International Symposium on Power Semiconductors and ICs (ISPSD)| 2007
- 587
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ANNOUNCEMENTS - Call for Papers: The 2008 International ESD Workshop (IEW)| 2007
- 587
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The 2008 International ESD Workshop (IEW)| 2007
- 588
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Explore IEL IEEE's most comprehensive resource| 2007
- 589
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2007 Index IEEE Transactions on Semiconductor Manufacturing Vol. 20| 2007
- 589
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2007 INDEX| 2007
- C1
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Table of contents| 2007
- C2
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IEEE Transactions on Semiconductor Manufacturing publication information| 2007
- C3
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IEEE Transactions on Semiconductor Manufacturing Information for authors| 2007