Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging (Englisch)
- Neue Suche nach: Yang, Yiqun
- Neue Suche nach: Hui Ye,
- Neue Suche nach: Wei Ke,
- Neue Suche nach: Huang, Shirong
- Neue Suche nach: Wang, Nan
- Neue Suche nach: Xiuzhen Lu,
- Neue Suche nach: Jie Bao,
- Neue Suche nach: Ye, Lilei
- Neue Suche nach: Liu, Johan
- Neue Suche nach: Yang, Yiqun
- Neue Suche nach: Hui Ye,
- Neue Suche nach: Wei Ke,
- Neue Suche nach: Huang, Shirong
- Neue Suche nach: Wang, Nan
- Neue Suche nach: Xiuzhen Lu,
- Neue Suche nach: Jie Bao,
- Neue Suche nach: Ye, Lilei
- Neue Suche nach: Liu, Johan
In:
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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125-128
;
2017
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
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Beteiligte:Yang, Yiqun ( Autor:in ) / Hui Ye, ( Autor:in ) / Wei Ke, ( Autor:in ) / Huang, Shirong ( Autor:in ) / Wang, Nan ( Autor:in ) / Xiuzhen Lu, ( Autor:in ) / Jie Bao, ( Autor:in ) / Ye, Lilei ( Autor:in ) / Liu, Johan ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.06.2017
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Format / Umfang:1231375 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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- 194
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Author index| 2017
- 196
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Committees| 2017
- c1
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[Front cover]| 2017
- c4
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[Back cover]| 2017
- I
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[Title page]| 2017
- II
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[Copyright notice]| 2017
- III
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Table of contents| 2017