Extraction of 3D interconnect impedances using edge elements without gauge condition (Englisch)
- Neue Suche nach: Charlet, F.
- Neue Suche nach: Carpentier, J.F.
- Neue Suche nach: Charlet, F.
- Neue Suche nach: Carpentier, J.F.
In:
International Conferencre on Simulation of Semiconductor Processes and Devices
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143-146
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2002
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Extraction of 3D interconnect impedances using edge elements without gauge condition
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Beteiligte:Charlet, F. ( Autor:in ) / Carpentier, J.F. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2002
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Format / Umfang:223867 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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- 63
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Extraction of 3D interconnect impedances using edge elements without gauge conditionCharlet, F. / Carpentier, J.F. et al. | 2002
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- 247
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- 261
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- 279
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- 279
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Monte Carlo simulation of electron transport in a carbon nanotubePennington, G. / Goldsman, N. et al. | 2002
- 283
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Author index| 2002
- i
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2002 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD 2002 (IEEE Cat. No.02TH8621)| 2002