Thermal component model for electrothermal analysis of IGBT module systems (Englisch)
- Neue Suche nach: Chan-Su Yun,
- Neue Suche nach: Malberti, P.
- Neue Suche nach: Ciappa, M.
- Neue Suche nach: Fichtner, W.
- Neue Suche nach: Chan-Su Yun,
- Neue Suche nach: Malberti, P.
- Neue Suche nach: Ciappa, M.
- Neue Suche nach: Fichtner, W.
In:
IEEE Transactions on Advanced Packaging
;
24
, 3
;
401-406
;
2001
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Thermal component model for electrothermal analysis of IGBT module systems
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Beteiligte:Chan-Su Yun, ( Autor:in ) / Malberti, P. ( Autor:in ) / Ciappa, M. ( Autor:in ) / Fichtner, W. ( Autor:in )
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Erschienen in:IEEE Transactions on Advanced Packaging ; 24, 3 ; 401-406
-
Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.08.2001
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Format / Umfang:242345 byte
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 24, Ausgabe 3
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