Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages (Englisch)
- Neue Suche nach: Klengel, Sandy
- Neue Suche nach: Klengel, Robert
- Neue Suche nach: Stephan, Tino
- Neue Suche nach: Klengel, Sandy
- Neue Suche nach: Klengel, Robert
- Neue Suche nach: Stephan, Tino
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:11.09.2023
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Format / Umfang:1999445 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Table of Contents| 2023
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Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic PackagesKlengel, Sandy / Klengel, Robert / Stephan, Tino et al. | 2023
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Application of Reactive Bonding Methods on LTCC SubstratesWiss, Erik / Schulz, Alexander / Yuile, Adam / Maeller, J ens / Wiese, Steffen et al. | 2023
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Index| 2023
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Partial Discharge Characterization of Ceramic Power Electronics Circuit Carriers Assisted by Machine LearningDrechsel, Johannes / Barth, Henry / Rebenklau, Lars et al. | 2023
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