Study on Interfacial Diffusion Mechanism of The Nonstoichiometric ratio TiN0.3 and AlN composite in the process of sintering (Englisch)
- Neue Suche nach: He, ZhanWen
- Neue Suche nach: Wang, M Z
- Neue Suche nach: He, ZhanWen
- Neue Suche nach: Wang, M Z
In:
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
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1198-1201
;
2018
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Study on Interfacial Diffusion Mechanism of The Nonstoichiometric ratio TiN0.3 and AlN composite in the process of sintering
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Beteiligte:He, ZhanWen ( Autor:in ) / Wang, M Z ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.08.2018
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Format / Umfang:3701583 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power ElectronicsZhang, Dongxiao / Liu, Shengfa / Chen, Zhiwen / Liu, Li et al. | 2018
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Application of Non-UV BG Tape on Assembly of Flip-Chip Package with Copper Pillar BumpYang, Yang / Sun, Tuobei / Ren, Xiaoli / Pang, Jian et al. | 2018
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Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature GradientZhao, Ning / Chen, Shi / Liu, Chunying / Zhong, Yi / Ma, Haitao / Wang, Yunpeng et al. | 2018
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The characters of WO3 electrochromic film prepared by sol-gel methodNing, Honglong / Zhang, Xiaochen / Zhang, Guanguang / Shi, Muyang / Huang, Zhiwei / Ni, Haozhi / Tao, Ruiqiang / Yao, Rihui / Peng, Junbiao / Fang, Zhiqiang et al. | 2018
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Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0Ag–0.5Cu/Cu jointsLe, Wen-Kai / Ning, Xiang / Huang, Jia-Qiang / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2018
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Reliability Analysis of System-in-Package Module Based on Physics of FailureXiao, Hui / Liu, Shuqiang / Li, Yong et al. | 2018
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Shear creep and fracture behavior of micro-scale BGA structured Cu/Sn–3.0Ag–0.5Cu/Cu joints under electro-thermo-mechanical coupled loadsLe, Wen-Kai / Zhu, Zhi-Wei / Cao, Shanshan / Zhang, Xin-Ping et al. | 2018
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The study of MLCC assembly Reliability based on PCB strain measurementGao, Weina / Fei, Jingming / Gao, Zhandi / Wang, Jun / Zhang, Binbin / Wu, Qiong et al. | 2018
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Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applicationsHo, Cheng-Yu / Wang, Chen-Chao / Hsieh, Sheng-Chi / Ting, Chun-Yen et al. | 2018
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Study of the curing kinetics and heat resistance of isotropic conductive adhesiveJiang, Han / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2018
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The application and case study of FIB system in the PCB with OSP final finish failure analysisShen, Jianghua / He, Xiao / Li, Enliang et al. | 2018
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A cost-effective and high performance assembly technology for interconnecting the Cu/Al bilayer electrode and lead wire of ZnO varistor using a low Ag-containing solder pasteWang, Kai / Chen, Guo-Liang / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2018
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Frequency-domain lifetime prediction methods for the PoP under wide-band random vibration loadingXia, Jiang / Shen, ZhongHong / Peng, Qi / Xu, HuaWei / Huan, LinYi / Liu, BinHui / Yue, YaJiao / Li, GuoYuan et al. | 2018
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Fluxless Bump Reflow in Activated Hydrogen AtmosphereDong, C. Christine / Yu, Fisher / Bao, Tim / Zhang, Wenqi / Dai, Fengwei / Yang, Dengfen et al. | 2018
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Reliability Improvement of CBGA Solder Ball Joint in LTCC-based SiP ModuleLi, Yangyang / Zeng, Yuanqi / Dong, Dong / Wang, Hui / Tan, Jiyong / Zhang, Jifan et al. | 2018
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Research on the thermal fatigue life of CQFN packagingYang, Zhen-Tao / Peng, Bo / Gao, Ling et al. | 2018
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Effect of Ni thickness on the IMC and reliability of ultrathin ENEPIGPan, Hongfa / Wang, Yibo / Luo, Weiguo / Gao, Liming / Li, Ming et al. | 2018
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Effect of Pretreatment on Copper Filling of High Aspect Ratio Through-Silicon Via (TSV)Pan, Hongfa / Zhang, Yumei / Li, Ming / Gao, Liming et al. | 2018
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Corrosion Resistance of Electrodeposited Nanocrystalline Ni from Citrate BathsXia, Jiangbing / Li, Hongmo / Wang, Yuequan / Hang, Tao / Li, Ming et al. | 2018
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Study on Droplet Movement on Superhydrophobic Surfaces under Electric FieldsLiu, Jie / Zhou, Shangru / Yan, Yuping / Zheng, Huai / Liu, Sheng et al. | 2018
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An effective way to solve the void problem of traditional underfill based on NCP technologyLiu, Guoheng / Xue, Jianrui / Gao, Liming / Li, Ming et al. | 2018
- 691
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Application of Finite Element Simulation Analysis and Calculation in Process Design OptimizationZou, Yabing / Lu, Tao / He, Xiao et al. | 2018
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Failure analysis of insufficient bonding strength of electrolytic nickel gold spring soldering interfaceXu, Hui / Xiong, Feng et al. | 2018
- 701
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Effect of Crystal Boundary Character and Crystal Orientation on Electromigration in Lead-free Solder Interconnects with Cyclic Twinning StructureFu, Xing / Chen, Hongtao / Zhou, Bin / Chen, Si / Yao, Ruohe / He, Xiaoqi et al. | 2018
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Design, Fabrication and Characterization of Silicon based Microfluidic Structures for High Heat-flux Cooling ApplicationLi, Yangyang / Lu, Qian / Chen, Xiancai / Zhang, Jian / Lin, Jia / Xiang, Weiwei et al. | 2018
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Simulation and Optimization of High Performance On-Chip Solenoid MEMS InductorZhou, Shengrui / Xu, Ling / Lu, Jicun / Yang, Yinglin et al. | 2018
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Simulation and Low Cost Process Development of Thin Wafer Level TSV Last Integration Scheme for RF ApplicationsRahim, Md Kaysar / England, Luke / Wang, Yeye / Yu, Daquan / Wang, Teng et al. | 2018
- 722
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Directional Solidification Structure and Deformation Behavior of Silver Bonding WireKang, Feifei / Wu, Yongjin / Zhou, Wenyan / Pei, Hongying / Kong, Jianwen / Zhang, Kunhua et al. | 2018
- 728
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Failure analysis and case study of wire bondingMa, Lili / Chen, Hang et al. | 2018
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Investigation of ENEPIG/Sn-10Sb solder jointGu, Xin / Huang, Liangsong / Wang, Guohui et al. | 2018
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Research on Motion Simulation of Wafer Handling Robot Based on SCARAHe, Yunbo / Chen, Jiajun / Gao, Jian / Cui, Chengqiang / Yang, Zhijun / Chen, Xun / Chen, Yun / Zhang, Kai / Tang, Hui et al. | 2018
- 740
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Simulation Analysis on Thermal Drift of MEMS Sandwich AccelerometerMei, Wei / Hu, Qifang / Xing, Chaoyang / Li, Nannan / Xu, Yuxin et al. | 2018
- 745
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The mechanical simulation of a special biosensorWang, Shuaipeng / Tian, Hongxun / Zhang, Xinghui / Li, Jianqiang / Chen, Yanning / Wang, Wenhe / Yuan, Yidong / Zhang, Haifeng / Wang, Yubo / Zhao, Dongyan et al. | 2018
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A Micro-Hotplate for MEMS Based Gas SensorNiu, Gaoqiang / He, Lingxiang / Yang, Zhitao / Zhao, Changhui / Gong, Hiuming / He, Wei / Wang, Fei et al. | 2018
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Effects of nano-SiO2 additions on wettability and interfacial IMC growth of SAC solder on Ni-xSiO2 composite electroless clad layerWang, Yong / Xie, Xiaochen / Liu, Ying / Zhao, Xiuchen et al. | 2018
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Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging (FO-WLP) TechnologyLi, Yang / Ming, Xuefei / Ji, Yong / Wu, Xin / Gao, Nayan / Wang, Bo et al. | 2018
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Thermo-mechanical Modelling of Cu Wire Parallel Gap Micro-resistance Welding ProcessWu, Bingying / Hang, Chunjin / Li, Yue / Liu, Yang / Tian, Yanhong / Zhang, Weiwei et al. | 2018
- 766
-
Leveraging 3D Packaging Technology to Enhance Integrated Circuits Security and ReliabilityZhu, Chunsheng / Yan, Yingjian / Guo, Pengfei / Li, Junwei et al. | 2018
- 770
-
Packaging flat micro heat pipe using low melting point alloyLUO, Yi / JIA, Chen / LI, Congming / WANG, Xiaodong et al. | 2018
- 774
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Design and implementation of semiconductor Laser reliability testing platformSu, Meng / Lu, Guoguang / Xu, Huawei / Peng, Qi / Huang, Linyi et al. | 2018
- 777
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High Density On-Package Direct Cable Attachment for Hundred-Gbps Chip-to-Chip Interconnects| 2018
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Improvement of barrier performance in thin film encapsulation for organic light-emitting diodes by a prior planarization processQin, Cunping / Yang, Jun / Xu, Tao / Ding, Xingwei / Zhang, Jianhua et al. | 2018
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Temperature and stress distribution of IGBT module in DC power cycling test with different switching frequenciesChao, FANG / Tong, AN / Fei, QIN / Jingyi, ZHAO / Xuequan, YUAN et al. | 2018
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Case study of SBD burnout failure caused by non electric overstressXu, Guangning / zhou, Jian et al. | 2018
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Design and Optimization of a Novel Silicone Rubber Elastic Button based on BPNN ModelWang, Siyu / Liang, Zhi / Yang, Zhangping / Cai, Miao / Yang, Daoguo / Li, Jinyang et al. | 2018
- 801
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Failure Analysis on Insufficient ACF Bonding StrengthLi, Weiming et al. | 2018
- 804
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Effect of zincate immersion pretreatment on corrosion resistance of electroless plated nickel-phosphorus film for advanced packagingGan, Weixing / Li, Ming / Hang, Tao et al. | 2018
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High Density Silicon Substrates for Processor-Memory IntegrationLi, Baoxia / Sun, Chengcheng / Yang, Chunyan / Liu, Zongxi / Wang, Yanling / Su, Yanyan / Xue, Yahui et al. | 2018
- 812
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Method to Prevent Thin Film Cracking of Thin Film Encapsulation in Flexible AMOLEDAo, Wei / Zhu, Yinghui / Zhang, Jianhua / Xin, Xiaogang / Gao, Feng / Peng, Chaochi / Liu, Xiangchao / Li, Chunhong / Wang, Yan et al. | 2018
- 815
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Effect of rapid inducted heating on the microstructure of solder joint in ICChen, Jibing / Wan, Nong / Li, Juying / Wu, Yiping et al. | 2018
- 819
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Effect of eddy current inducted heating on optical property and thermostability of high power LEDChen, Jibing / Wan, Nong / Li, Juying / He, Zhanwen / Wu, Yiping et al. | 2018
- 823
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Light extraction efficiency enhancement of 265nm UVC-LED with Micro-array structureWang, Lei / Yang, Daoguo / Wang, Xiyou / Yang, Zhangping / Cai, Miao et al. | 2018
- 828
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Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro BumpsDai, Fengwei / Zhang, David Wei / Zhang, Wenqi / Wang, Guojun / Yang, Dengfeng / Chen, Lin / Cao, Liqiang et al. | 2018
- 832
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3D Module in Fan-out PackagingZhan, Lihua / Li, Hao / Zhu, Fuguo / Zhou, Zhipeng et al. | 2018
- 834
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A highly reliable cleaning processJun, ZHANG / Fei, Ye Xiao / Hailin, SHI et al. | 2018
- 841
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Research on LTCC - based Flat Optocoupler Assembly TechnologyJun, ZHANG / Fei, Ye Xiao / Meng Lin, LI / Hailin, SHI et al. | 2018
- 850
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Microstructure and properties of AuSn20 solder ribbons prepared by rapid solidification processChen, Chen / Zhang, Xuemei / Chen, Zhenhua / Wei, Mingzhen / Jian, Zhou / Xue, Feng et al. | 2018
- 854
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Multi-chip Power Distribution Network Modeling and Analysis Based on Multi-Input ImpedanceZHANG, Jincan / CUI, Xiaole / MIAO, Min / HAN, Bo et al. | 2018
- 860
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Plasma Impact on PI RoughnessCheng, Qiang / Gao, Liming / Zhang, Li et al. | 2018
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Fast room-temperature sintering of Ag nanoparticles on polyethylene terephthalate filmZhang, Zhihao / Wei, Cunwei / Han, Jiajia / Cao, Huijun / Zhang, Yinggan / Yu, YuXi / Gao, Yuan / Xu, Yuping et al. | 2018
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Aging effect on defect evolution and shear strength of nano-silver solder jointGong, He / Yao, Yao / Wang, Jundong / Wang, Shaobin / Long, Xu et al. | 2018
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Design and Analysis of Microchannel for the Thermal Management of Multi-stacked LTCC LaminatesYU, Hejie / HAN, Bo / MIAO, Min / CUI, Xiaole / ZHAO, Kai et al. | 2018
- 876
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Thermal analysis and optimization of air trench structures for thermally tunable devicesDuan, Fei / Chen, Kai / Yu, Yonglin et al. | 2018
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Research on the influence of dimpled ceramic SMD on mechanical strength of solder joint in LTCC-based BGA packagesZeng, Yuanqi / Li, Yangyang / Wang, Hui / Dong, Dong et al. | 2018
- 883
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Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC IntegrationZhang, Yuanxiang / Wang, Jiankun / Yu, Sijia et al. | 2018
- 886
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Numerical simulation on wafer warpage during molding process of WLCSPMengke, YANG / Fei, QIN / Daquan, YU et al. | 2018
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Research on Evolution Behaviors of SnPb Solder Under High Current StressingCao, Huijun / Zhang, Zhihao / Yu, Yuxi et al. | 2018
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Interconnection Reliability for MCM of Large Micromirror Arrays and High Voltage Driving ASIC Based on High-density SubstrateHu, Zhenggao / Zhang, Weibo / Gai, Wei / Wu, Yaming / Cheng, Gong / Xu, Gaowei et al. | 2018
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Research on Thermal Analysis of Iris Recognition Module Package StructureYang, Zhangping / Yang, Daoguo / Wang, Lei / Wang, Xiyou / Cai, Miao et al. | 2018
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Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering MaterialWang, Hu / Yang, Daoguo / Cai, Miao / Wang, Xiyou / Liang, Zhi et al. | 2018
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Effect of Magnetic Field on Activation Performance of Silicon/Glass Dielectric Barrier DischargePan, Mingqiang / Yao, Furong / Liu, Jizhu / Wang, Yangjun / Sun, Lining et al. | 2018
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Researchon Mechanical Behavior of Through silicon via of 2.5D InterposerYang, Jun / Yao, Quanbin / Lin, Pengrong / Xie, Xiaochen / Lian, Binhao et al. | 2018
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Design, Fabrication, and Calibration of a Full Silicon WLP MEMS Sandwich AccelerometerHu, Qifang / Li, Nannan / Xing, Chaoyang / Mei, Wei / Sun, Peng et al. | 2018
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Preparation and Thermal Analysis of the nano-silver /Graphene composite material for packaging moduleLiu, Dongjing / Lin, Haiying / Fan, Yasong / Zhu, Haidong / Yan, Haidong / Yang, D.G. et al. | 2018
- 928
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Effects of sintering temperature on microstructure and magnetic properties of NiCuZn ferrites for NFC applicationYang, Yan / Zhang, Huaiwu / Li, Jie et al. | 2018
- 933
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Preparation of Metallic Materials for Electronic Packaging Based on Space EnvironmentXia, Zhenchao / Xue, Yahui et al. | 2018
- 937
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Analysis of RF transmission performance of 3D TSV interposerWang, Zhengduo / Wu, Fengshun / Lang, Liang / Wang, Bo et al. | 2018
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Modulation of Gas Adsorption on SnS by strainHu, Fafei / Ye, Huaiyu / Tang, Hongyu / Chen, Xianping et al. | 2018
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An Exhaustive Search of the Optimal 6C Level Static Shielding Scheme for Rectangle TSV ArraysCui, Xiaole / Luo, Mengying / Lin, Qiujun / Miao, Min / Jin, Yufeng et al. | 2018
- 949
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Study on Ultrasonic Assisted Chemical Debonding ProcessFan, Zengyan / Lin, Huiqin / Chen, Tony / Li, Ming et al. | 2018
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Microwell as a biomedical deviceWang, Zetian / Li, Xuanyang / Chen, Jing / Xia, Yanming et al. | 2018
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Reliability Investigation of 4H-SiC MOSFET Based on TCAD SimulationLuo, Houcai / Huang, Yiping / Zheng, Kai / Tan, Chunjian / Wang, Liming / Wang, Shaogang / Ye, Huaiyu / Chen, Xianping et al. | 2018
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Paper Title The Breakdown Voltage of AlGaN/GaN HEMT is Restricted to The Structure Parameters of The Device: A Study Based on TCADWang, Liming / Tan, Chunjian / Luo, Houcai / Wang, Shaogang / Ye, Huaiyu / Chen, Xianping et al. | 2018
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Effects of MnZn ferrite doping on magnetic and electrical properties of NiZnCu ferrite toroid cores for power applicationsLiu, Junchang / Mei, Yunhui / Li, Xin / Lu, Guo-Quan et al. | 2018
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Comparison of performance between PID and LADRC algorithm in linear motion platformYaoBin, He / ZhiJun, Yang / Qian, Li et al. | 2018
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Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technologyZhao, Sheng-jun / Huang, Chun-yue / Tang, Xiang-qiong / Lu, Liang-kun et al. | 2018
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Noise Analysis and Transmission Coding Optimization for High-speed InterconnectionCHEN, Tianfang / MIAO, Min / HAN, Bo / LI, Zhensong / ZHAO, Kai / CUI, Xiaole et al. | 2018
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Thermal stress-strain simulation analysis of BGA solder joint reflow soldering processTang, Xiang-qiong / Zhao, Sheng-jun / Huang, Chun-yue / Lu, Liang-kun et al. | 2018
- 987
-
Mechanical Response of Low Silver Lead-Free Solder under Dynamic Vickers IndentationsChen, Cong / Shen, Linlin / Niu, Xiaoyan et al. | 2018
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Simulation research on wafer warpage and internal stress in the First Passivation process of eSiFO packageYUAN, Shichao / CAI, Anwen / YU, Huiping / YU, Daquan / XIANG, Min / QIN, Fei et al. | 2018
- 995
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Thermal conductivity of epoxy resin using molecular dynamics simulationPI, Bensong / YU, Huiping / QIN, Fei / CHEN, Pei / CAI, Anwen et al. | 2018
- 999
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A novel organic coating assisted laser drilling method for TSV fabricationMai, Xiquan / Chen, Yun / Shi, Dachuang / Xun, Chen / Xin, Chen / Gao, Jian / Cui, Chengqiang / He, Yunbo / Wong, Ching-Ping et al. | 2018
- 1003
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Smith-ADRC Based Z Axis Impact Force Control for High Speed Wire Bonding MachineLiu, Yachao / Gao, Jian / Zhang, Lanyu / Chen, Yun / Tang, Hui / Chen, Xin / Cui, Chengqiang et al. | 2018
- 1009
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3ω method based experimental measurements on Kapitza resistance of Si/SiO2 interfacesZheng, Guang / Zhu, Wenhui / He, Hu et al. | 2018
- 1013
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Flexible strain sensors based on CNTs/PDMS nanocompositeGuo, Dengji / He, Hu et al. | 2018
- 1019
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Random vibration analysis of BGA with different size of the SAC0307 solder jointShen, Linlin / Chen, Cong / Niu, Xiaoyan et al. | 2018
- 1022
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Highly Conductive Stretchable Wirings Composed of Ag Foils and ElastomerLi, Cai-Fu / Zhang, Bowen / Suganuma, Katsuaki / Zhang, Hao / Sugahara, Tohru / Li, Wanli / Liu, Zhi-Quan et al. | 2018
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Sintering Of Hybrid Nano Sliver Paste Achieve Cone-Structured Cu Bonding in die attachmentLiu, Zhihui / Sun, Yaozhong / Chen, Zhuo / Li, Junhui / Zhu, Wenhui et al. | 2018
- 1032
-
Reliability Optimization of a 3D Packaged Micro-machined Wind SensorGao, Shi-Xuan / Huang, Qing-An / Qin, Ming et al. | 2018
- 1036
-
Mathematical simulation and experimental verification for through silicon via with additivesLiu, Wei / Wang, Fuliang / Wang, Yan / Zhu, Wenhui et al. | 2018
- 1042
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Investigation on Copper Clip Bonding Structure for Power PackageLiu, Linqi / Jiang, Wei / Liu, Qiang / Lin, Wei / Miao, Xiaoyong / Shi, Lei et al. | 2018
- 1047
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The study on LED droop of flip-chip GaN LEDZhang, Yu / Qin, Wei Qi / Zhu, Xin-Feng / Xiao, Jing / Yao, Cheng et al. | 2018
- 1051
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Investigation of microstructure and growth behavior of CoSn3 full intermetallic joints in electronic packagingTian, Shuang / Zhang, Xuemei / Zhou, Jian / Xue, Feng et al. | 2018
- 1055
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Laser Grooving Technology Study at Dicing Process in Wafer Level PackageChen, Chao / Li, Ming / Cao, Kenny et al. | 2018
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Optimization of Gold Wire Bonding Process for Microwave Components by DOE MethodLiu, Xiaojian / Kang, Nan / Jing, Cui / Shi, Lei / Liu, Yawei / Yin, Mengmeng et al. | 2018
- 1064
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The failure analysis of LED sulfur corrosionChenlan / Huanxiang, Xu / Hao, Zhao / Zhenbo, Zhao et al. | 2018
- 1070
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Investigation of Characteristics of the Capillary-driven Underfill FlowWang, Kanglun / Wang, Yan / Zhu, Wenhui et al. | 2018
- 1075
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A novel interposer fabrication method for integration of bandpass filter applied in high frequencyZhang, Weibo / Xu, Gaowei / Luo, Le et al. | 2018
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Research On Position&Force Control Based on Voice Coil MotorHe, Yunbo / Zhang, Chang / Gao, Jian / Cui, Chengqiang / Yang, Zhijun / Chen, Xun / Zhang, Kai / Chen, Yun / Tang, Hui et al. | 2018
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Laser bonding of glass and glass with constant temperature outputFu, Xianliang / Li, Yi / Li, Xifeng / Tian, Rui / Yin, Luqiao / Zhang, Jianhua et al. | 2018
- 1089
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Effects of Current Density and Concentration of Sn2+ on Solder VoidsGuo, Liang / Li, Ming / Zhang, Li et al. | 2018
- 1092
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Effect of oxide layers on MONOS device performance based on TCAD simulationSun, Chuang / Yi, Dandan / Li, Ming / Gao, Liming et al. | 2018
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The Effect of Glass Frit Paste Levelling Property on EncapsulationTian, Rui / Yin, Luqiao / Li, Yi / Zhang, Jianhua / Wang, Yibin et al. | 2018
- 1102
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Mercury-plated iridium-based microelectrode arrays for trace metal detectionCao, Zhi / Shang, Haiping / Wang, Yinghui / Wang, Weibing et al. | 2018
- 1108
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Remaining Useful Life Estimation of Solder joints using an ARMA Model Optimized by Genetic AlgorithmLong, Yiwen / Luo, Hongwei / Zhi, Yue / Wang, Xiaoqiang et al. | 2018
- 1112
-
Enhanced high temperature stability of printed Cu wirings based on large Cu particle ink, Ag element addition, and intense pulsed light sinteringLi, Wanli / Li, Linying / Li, Cai-Fu / Jiu, Jinting / Suganuma, Katsuaki et al. | 2018
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Case study of no fault founds in household appliancesShi, Gaoming / Yuan, Guanghua / Chen, Xuanlong / Xie, Zhenfeng / Chen, Cheng et al. | 2018
- 1119
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Influence of observed anelasticity of Cu on the wafer warpage evolution during thermal processesCheng, Gong / Xu, Gaowei / Gai, Wei / Luo, Le et al. | 2018
- 1123
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The Signal Integrity Design And Optimization of High Speed RF Optical Receiver ModuleWei, Juan / Liu, Fengman / She, Qian / Ma, Pengcheng / Zhao, Man / Cao, Liqiang et al. | 2018
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Li0.43La0.56Ti0.95Ge0.05O3/PEO composite solid electrolytes for flexible all-solid-state lithium batteriesHu, Zhixiong / Ye, Huangqing / Chen, Jiahui / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2018
- 1130
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Duration Effect of Pulsed High-Brightness Organic Light-emitting DiodesYang, Jiali / Li, Chunya / Wei, Bin et al. | 2018
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Investigation on the Joule heat and thermal expansion in flip chip package by electro-thermo-mechanical coupling analysisLiu, Zhan / Li, Junhui / Zhu, Wenhui et al. | 2018
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A Perspective Study of Mechanical Characterisation of Graphene for Potential Applications in Thermal Management of MicrosystemsXue, Xiangdong / Yang, Jianxin / Wang, Yuming / Du, Wenyi et al. | 2018
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Numerical study on a novel microchannel structure towards high efficient heat dissipation in high power electronicsLi, Fang / Zhu, Wenhui / He, Hu et al. | 2018
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A First Principles Study of Blue Phosphorene as A Superior Media for Gas SensorNiu, Fanfan / Yang, Daoguo / Cai, Miao / Li, Xiaoling / Liu, Dongjing et al. | 2018
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Magnetic and dielectric properties of Sm-doped M-type barium ferrites for LTCC applicationYu, Ximeng / Li, Sheng / Li, Jie / Chen, Daming / Yang, Yan / Gan, Gongwen et al. | 2018
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The influence of sintering process on thermal properties of nano-silver pasteLu, Xiuzhen / Ke, Wei / Zhou, Cheng / Wu, Yanpei / Zhang, Qiaoran / Huang, Shirong / Xia, Weijuan / Ye, Lilei / Zehri, Abdelhafid / Liu, Johan et al. | 2018
- 1161
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Indium Sealing of Metal Shell for Precision Devices PackagingWANG, Xiaodong / YU, Xiaoli / CHEN, Xiaoyi / LUO, Yi et al. | 2018
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NiCo oxyfluoride non-woven cloth with ultra-high area capatitance for wearable supercapacitorsWang, Xuanyu / Zou, Peichao / Wang, Yang / Lai, Wenhui / Yang, Cheng et al. | 2018
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The Influence of Mechanical Properties of Dielectric Material and Structure of Electrodes on Capacitive Sensor PropertiesSun, Yun / Wang, Ying / Wang, Zijun / Li, Chao / Meng, Xiangfei / Qi, Yao et al. | 2018
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Study on the SnAgCu solder joint between LED chip and heat sinkLiu, W. / Qian, X.X. / Lin, J.T et al. | 2018
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Scaling Optical Communication for On-Chip InterconnectBinggeli, Mat / Li, Feng et al. | 2018
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A Synthetic Method for Extremely Stable Thin Film of CsPbBr3 QDs and its Application on Light-emitting DiodesLu, Hanguang / Du, Xuewei / Rao, Longshi / Song, Cunjiang / Tang, Yong / Li, Zongtao et al. | 2018
- 1189
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A Packaged 2×2 Switch Array for Power Handling and Isolation ImprovementZhang, Yulong / Gong, Zhuhao / Guo, Xin / Liu, Zewen et al. | 2018
- 1193
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Recent Advances in 3D Packaging for Medical ApplicationsYang, Yi / Li, Feng et al. | 2018
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Study on Interfacial Diffusion Mechanism of The Nonstoichiometric ratio TiN0.3 and AlN composite in the process of sinteringHe, ZhanWen / Wang, M Z et al. | 2018
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Design and Fabrication of Silicon-cavity Band-pass Filters Based on MEMS TechnologyDong, Peng / Duan, Bin / Pan, Xiongwen / Li, Qi / Li, Zhidong / Wang, Qi et al. | 2018
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Preparation and Characterization of Al2O3-AgNP hybrids for Application in Thermally Conductive Polymer CompositesRen, Linlin / Xu, Jianbin / Zeng, Xiaoliang / Wong, Ching-Ping / Sun, Rong et al. | 2018
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High Reliability Power Package Design for Automotive RequirementsKim, Byong Jin / Su Ryu, Dong / Ting, Jia Yunn / Jeon, HyeongIl / Chim, Weng Tuck / Whitchurch, Nathan et al. | 2018
- 1213
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Fabricating 3D BT-BN/epoxy Composites with High Dielectric PerformanceZhu, Xiaodong / Luo, Suibin / Yu, Shuhui / Chu, Baojin / Sun, Rong / Wong, Ching-Ping et al. | 2018
- 1219
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Design and development of power module co-packaged with SiC GTO and SiC PiNYang, Yingkun / Gao, Lei / Li, Zhiqiang / Zhou, Kun / Zhang, Lin / Zhang, Long / Li, Juntao / Mei, Yunhui et al. | 2018
- 1223
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A Novel Hole-Path and Carrier-Stored IGBT with Low Switching Loss and On State VoltageWang, Shaogang / Luo, Houcai / Chen, Xianping / Tan, Chunjian / Li, Shaolin / Wang, Liming / Ye, Huaiyu et al. | 2018
- 1227
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Model and Analysis of Planar Spiral Inductor Based on Package SubstrateHaiyan, SUN / Wenjun, SUN / Ling, SUN / Jicong, ZHAO / Jiaen, FANG / Xiaoyong, MIAO / Honghui, WANG et al. | 2018
- 1232
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FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBTZHAO, Jingyi / QIN, Fei / AN, Tong / BIE, Xiaorui / FANG, Chao / YUAN, Xuequan et al. | 2018
- 1237
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New Surface Treatment Method for Silver AlloyWire and Its Performance EvaluationYang, Bin / Cui, Chengqiang / Zhang, Yu / Zhang, Kai / Zhou, Zhangqiao / Chen, Xun / Chen, Xin / Gao, Jian / He, Yunbo / Tang, Hui et al. | 2018
- 1241
-
Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductorYang, Lin-Lin / Gao, Li-Yin / Chen, Chunhuan / Liu, and Zhi-Quan et al. | 2018
- 1246
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Study on Electrostatic Discharge Damage and Defect Damage Failure Analysis Technology for Semiconductor DevicesLin, HU / Sheng-zong, HE / You-liang, WANG / Xiao-si, LiANG / Qi-zheng, JI et al. | 2018
- 1250
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Study on the composite coating process of oxide particles in magnetic thin filmsLi, Biao / Liu, Guangming / Liu, Zhi-Quan et al. | 2018
- 1254
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Room-Temperature Synthesis of Cesium Lead Halide Perovskite NanorodsDu, Xuewei / Li, Zongtao / Ding, Xinrui / Lu, Hanguang / Rao, Longshi / Tang, Yong et al. | 2018
- 1259
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EMC Modeling and Simulation in Quad Flat PackageHaiyan, SUN / Shoukun, HUANG / Ling, SUN / Jicong, ZHAO / Yihong, PENG / Jiaen, FANG / Xiaoyong, MIAO / Honghui, WANG et al. | 2018
- 1263
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Mechanism of Ni3Sn4 rapid formation of Sn-Ni mixed particles paste in ultrasound-assisted TLP for power electronic chip attachmentHuang, Jiayi / Ji, Hongjun / Pan, Hao / Yin, Fanqi / Liu, Hao / Yu, Jiaao / Li, Mingyu et al. | 2018
- 1269
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Electrical-Thermal Co-Simulation for LFBGAHaiyan, SUN / Bo, GAO / Ling, SUN / Jicong, ZHAO / Yihong, PENG / Jiaen, FANG / Xiaoyong, MIAO / Honghui, WANG et al. | 2018
- 1273
-
Prognostics and Health Management Technology of LED LampGuo-guang, Lu / Gan-xiong, Lai / Bin, Yao et al. | 2018
- 1278
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Processes-based Multistep Simulation of Thermal- mechanical Reliability of a 3D-TSV MEMSZeng, Qinghua / Chen, Jing / Jin, Yufeng et al. | 2018
- 1283
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Effect of ZnS size on the dielectric and energy storage properties of ZnS/polymer compositesSong, Zijie / Luo, Suibin / Wang, Chao / Yu, Shuhui / Sun, Rong / Wong, Ching-Ping et al. | 2018
- 1288
-
Significantly Improved Stability of PDMS- Packaged Silver Nanowire Film under Multiple EnvironmentsWang, Kaiqing / Jin, Yunxia / Wang, Jianzhong / Xiao, Fei et al. | 2018
- 1293
-
Comparison Studies on Joint Process for ENEPIG Surface Finished Chip for Double-sided Cooling ModuleLou, Shuxun / Xu, Ju / Zhang, Long / Gao, Lei et al. | 2018
- 1297
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Synthesis and characterization of 3D CoMoO4/rGO aerogel for supercapacitor electrodesWang, Chao / Guan, Zhishu / Wei, Min / Yu, Shuhui / Sun, Rong / Wong, Ching-Ping et al. | 2018
- 1301
-
Electrical Research of Silicon Substrate Packaging Technology Based on the CavityZhao, Man / Ma, Pengcheng / Xue, Haiyun / Zhang, Meiju / Liu, Fengman / He, Huimin / Sun, Siwei / Zheng, Lian / Sun, Yu / Wei, Juan et al. | 2018
- 1305
-
Highly conductive, flexible PU/PANI based conductive adhesives for flexible electronicsYan, Shaocun / Ma, Hongru / Li, Zhe / Ma, Yanqing / Ma, Lei et al. | 2018
- 1309
-
Application of Ag/graphene composites in flexible electrical conductive adhesivesMa, Hongru / Yan, Shaocun / Li, Zhe / Ma, Yanqing / Ma, Lei et al. | 2018
- 1312
-
Molecular dynamics study of copper wire bonding processWang, Xiyou / Wang, Lei / Yang, Daoguo / Yang, Zhangping et al. | 2018
- 1317
-
Dual Effects of CTAB on Co-deposition of SiC/Cu in Micro ViaWu, Houya / Wang, Fuliang / Wang, Yan / Zhu, Wenhui / Li, Zhiyi et al. | 2018
- 1322
-
Mechanisms of power module metallization degradation under ageingXuequan, YUAN / Tong, AN / Fei, QIN / Jingyi, ZHAO / Chao, FANG et al. | 2018
- 1326
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Highly sensitive pressure sensing coatings based on silicone/expandable microspheres compositesZhang, Yuhan / Zheng, Peng / Shao, Tianyu / Li, Zhuo / Zuo, Zhengqing et al. | 2018
- 1329
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A Numerical Model for Joule heating in Sn Solder Balls of Two Different SizesKunwar, Anil / Shang, Shengyan / Raback, Peter / Song, Xueguan / Malla, Prafulla Bahadur / Wang, Yunpeng / Ma, Haitao et al. | 2018
- 1333
-
Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloyWei, Song / Zhou, Li-Jun / Guo, Jing-Dong et al. | 2018
- 1337
-
Analysis and optimization of coupling noise in TSV arrayMei, Zheng / Dong, Gang / Zhu, Weijun / Chai, Jingrui / Zheng, Junping / Song, Dongliang et al. | 2018
- 1343
-
Signal Integrity Design For QSFP interface applicated in RF Optical transmitter ModuleMa, Pengcheng / Liu, Fenman / Zhao, Man / He, Huimin / Wei, Juan / Cao, Liqiang et al. | 2018
- 1346
-
A study on Pd distribution effect on the reliability of Au coated PCC wire bondingNa, SeokHo / Jeon, SungHo et al. | 2018
- 1351
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Application of Three-Dimensional X-Ray Microscopy in Failure Analysis for Sealed RelayLin, Daotan et al. | 2018
- 1355
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Synthesis of copper nanoparticles using copper hydroxideZeng, Xian / Zhang, Yu / Cui, Chengqiang / Zhang, Kai / Chen, Xun / Chen, Xin / Gao, Jian / He, Yunbo / Tang, Hui et al. | 2018
- 1359
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Resin-Free Color Converter Based on Phosphor-in- Glass for Laser-excited White LightingPeng, Yang / Mou, Yun / Liu, Xingxing / Chen, Mingxiang / Luo, Xiaobing et al. | 2018
- 1363
-
Effect of In addition on the properties of Sn-Au-Cu lead-free solderYin, Siqi / Huang, Mingliang / Chen, Yu et al. | 2018
- 1368
-
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnectsKuang, Jiameng / Huang, Mingliang et al. | 2018
- 1372
-
A novel approach to calculate the deposition uniformity of multi-target sputtering systemZhu, Guo / Sun, Jiangping / Gan, Zhiyin et al. | 2018
- 1378
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Cu film surface reduction through formic acid vapor/solution for 3-D interconnectionYang, Wenhua / Zhou, Chenggong / Zhou, Jie / Lu, Yangting / Lu, Yingchun / Suga, Tadatomo et al. | 2018
- 1382
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Research on the Board Level Reliability of High Density CBGA and CCGA under Thermal CyclingTong, Liangyu / Jiang, Changshun / Ao, Guojun et al. | 2018
- 1387
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Batch-Mode μUSM Process for Surrounding Air Cavity and TCV Holes of AlN Ceramic Substrate Application for Patch AntennaXia, Yanming / Ma, Shenglin / Song, Lu / Wang, Tao / Wang, Zetian / Li, Xuanyang / Chen, Jing / Jin, Yufeng / Wang, Wei et al. | 2018
- 1391
-
Study on 3D stack package with anodic alumina substrateLuo, Yan / Wang, Lichun / Liu, Mifeng / Zhao, Yong / Wu, Weiwei / Ren, Weipeng et al. | 2018
- 1396
-
The influence of solder on the thermal stress in a FCOL deviceTao, Xin / Li, May / Wang, Jun et al. | 2018
- 1400
-
Effect of Indium, Bismuth and Copper Doping on Microstructure and Mechanical Properties of Sn5Sb and Sn3.5Ag Lead free Solder AlloysLiu, Zhuhao / Pan, Hongfa / Wang, Yibo / Xu, Ling / Lu, Jicun / Wu, Daike / Wu, Jian / Li, Ming / Gao, Liming et al. | 2018
- 1406
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Si interposer with multiple cavities for 3D stacked fan-out packageHu, Xinxin / Luo, Rongfeng / Shen, Zhen / Cai, Han / Yan, Jun / Gong, Dan / Ma, Shenglin et al. | 2018
- 1411
-
The Study of Thermally Induced Warpage of BGA Package during Reflow SolderingBin, Yao / Xiaofeng, Wang / Yabing, Zou et al. | 2018
- 1415
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Wettability and Shear Strength of SAC305 Based Composite Solder with co-doping X (Ni or Al2O3) and CNTs ReinforcementsMo, Liping / Hu, Sicong / Zhou, Zheng / Wu, Fengshun / Liu, Shiyuan / Liu, Hui et al. | 2018
- 1421
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Fabrication of Phosphor Pillar Based on Electrohy-drodynamic for High Angular Color Uniformity of White Light-emitting DiodesZou, Jingling / Han, Feng / Zhang, Zefeng / Zheng, Huai / Liu, Sheng et al. | 2018
- 1426
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Light Extraction Enhancement of Deep Ultraviolet Light-Emitting Diodes by Using Aluminum Reflector CupLiu, Xingxing / Mou, Yun / Peng, Yang / Chen, Mingxiang / Wang, Hao / Liang, Renli et al. | 2018
- 1429
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Enhancing optical performance of quantum dot-converted LEDs via electrospun fiber rodsLiang, Guanwei / Chen, Junchi / Yu, Shudong / Feng, Siyang / Yan, Caiman / Yu, Binhai / Li, Zongtao et al. | 2018
- 1433
-
Effect of LED Chip Displacement on its Optical Performance and ReliabilityPei, Naiqi / Chen, Qi / Hu, Run / Luo, Xiaobing et al. | 2018
- 1437
-
Research on centrifugal sedimentation for improving luminous flux of the quantum-dots LED devicesYan, Caiman / Wang, Huiyu / Cao, Kai / Fan, Dongqiang / Li, Jiasheng / Li, Zongtao / Ding, Xingrui et al. | 2018
- 1442
-
Fabrication and characterization of AlN based Piezoelectric Micromachined Ultrasonic Transducer for contact sensingGong, Dan / Cai, Han / Xia, Yanming / Ma, Shenglin / Liu, Huan / Chiu, Yihsiang / Jin, Yufeng et al. | 2018
- 1448
-
VUV/O3 activated bonder for low-temperature direct bonding of Si-based materialsXu, Jikai / Wang, Chenxi / Qi, Xiaoyun / Wu, Bin / Zhou, Shicheng / Tian, Yanhong et al. | 2018
- 1453
-
Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding MethodQi, Xiaoyun / Wang, Chenxi / Kang, Qiushi / Li, Daoyuan / Tian, Yanhong / Kong, Lingchao et al. | 2018
- 1457
-
Research on Vibration Reliability of DIP Surface-Mounted Solder Joint after Pin BendLu, Tao / Zou, Yabin / He, Xiao / Qiu, Baojun / Xiao, Hui / Zhou, Bin et al. | 2018
- 1461
-
Enhancing Color Conversion Efficiency of Quantum Dot LED by Electric Field AssistanceChen, Junchi / Liang, Guanwei / Yu, Shudong / Li, Zhi / Lu, Hanguang / Yu, Binhai / Li, Zongtao et al. | 2018
- 1466
-
Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball JointXu, Ling / Zhou, Shengrui / Lu, Jicun et al. | 2018
- 1472
-
Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnectsYue, Wu / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2018
- 1476
-
The performance of sintered nanocopper interconnections for high temperature deviceLiu, Qipeng / Chen, Xianping / Zhu, Jie / Zhang, HuanKun / Zhang, Jiang Song / Zhang, Jing Guo / Wang, Li Gen / Ye, Huaiyu / Koh, Sau Wee / Zhang, G.O. et al. | 2018
- 1479
-
Investigation on two realizations of miniaturized integrated passive devices in a SiP transceiver front-endBan, Yu / Liu, Jie et al. | 2018
- 1483
-
Interfacial reaction of micro Co-P/Solder/Co-P interconnection under large temperature gradientsDu, Fei / Yang, Donghua / Zhang, Chunhong / Jiang, Xin / Gan, Guisheng / Yang, Aining et al. | 2018
- 1488
-
The influence of microstructure characteristic on the electromigration behaviour of line-type Sn58Bi solder jointsLi, Yi-Kang / Guo, Lei / Liang, Zheng-Chao / Qin, Hong-Bo / Luan, Xing-He / Hou, Bin et al. | 2018
- 1492
-
Study on the Reliability of Large Size LCCCWang, Liquan / Wang, Suhuan / Sui, Songyin et al. | 2018
- 1496
-
Diffusion films fabricated by phase separation of polymer blend and their application on color uniformity enhancement of LEDsYu, Jiadong / Yu, Shudong / Liang, Guanwei / Tang, Yong / Li, Zongtao et al. | 2018
- 1500
-
Process Development of Ultra-Fine Pitch High Density Micro BumpsYang, Dengfeng / Dai, Fengwei / Zhang, Wenqi / Wang, Guojun / Cao, Liqiang et al. | 2018
- 1504
-
SIMS Analysis of Impurity in HgCdTe Epilayers of Infrared Focal Plane ArrayLai, Canxiong / Yang, Shaohua / Lu, Guoguang / Zhou, Songmin / Wang, Xi et al. | 2018
- 1507
-
Analysis of the failure of power amplifier caused by tiningHong, Tao / Hu, Yongda / Bao, Shengxiang / Luo, Chuan / Li, Qiang / Ai, Libo / Jiang, Pengbo / Chen, Jie / Duan, Zongzhi et al. | 2018
- 1511
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Challenges in Predicting the Solder Interconnect Lifetime of High Power ElectronicsZhao, X. / Watte, Piet / de Vries, Hans / van Hees, Ger et al. | 2018
- 1518
-
A HIGHLY DENSE TSV SWITCH ARRAY INTEGRATED WITH LTCC CONTROL UINTZhao, Fei / Jia, Shiwang / Dang, Yuanlan / Chen, Jing et al. | 2018
- 1524
-
Miniaturization of Low Temperature Co-fired Ceramic Packaging for Microwave FiltersLi, Yan-Lin / Zhu, Xu / Liu, Ji-Chao / Zhou, Li-Jie / Wang, Zhi-Hua et al. | 2018
- 1528
-
Reliability Evaluation of Interconnection in COM PackageWang, Jin / Hou, Xinnan / Li, Jianming / Wang, Qian / Du, Ke / Cai, Jian et al. | 2018
- 1533
-
Hygrothermal stress analysis for a micro-camera module under the moisture sensitivity level oneZhao, Zhihao / Yang, Sangpu / Wang, Jun et al. | 2018
- 1538
-
Effect of Zinc Oxide Filler on Electrical Conductivity of Crosslinked Polyethylene Nonlinear CompositesDong, Gaqiang / Ma, Limin / Wang, Yishu / Guo, Fu / Han, Jing et al. | 2018
- 1542
-
The Research of Application Reliability and Failure Modes of Wire Bonding ProcessKang, Min / Zhao, He-ran / Liu, Di / Li, Jing-yang / Ma, Yan-yan / Liu, Qing-chuan et al. | 2018
- 1546
-
A review on the copper bond pad application in wire bond techniqueJinzhi, Lois Liao / Yan, Chen / Bisheng, Wang / Xiaomin, Li / Chao, Fu / Younan, Hua et al. | 2018
- 1554
-
A new multi-layer AiP solution based on organic substrateZhou, Shengjuan / Cai, Jian / Wang, Qian / Chen, Yu / Zhang, Xuesong et al. | 2018
- 1558
-
Discussion on failure mechanism and corresponding evaluation technology for the reliability of IC’s applications in board-level assemblyHe, Xiao / Shen, Jianghua / Lu, Tao / Peng, Zeya et al. | 2018
- 1564
-
Wafer-level integration of micro heaters on an alkali vapor cell for chip-scale atomic magnetometersLi, Guoliang / Shang, Jintang / Zhang, Jin / Ji, Yu et al. | 2018
- 1568
-
Polymorphic impedance matching technique for MEMS phase shifterZhao, Shumin / Zhang, Hao Chi / Zhao, Jiahao et al. | 2018
- 1575
-
Corrosion of Cu/Ni/Au coating caused by F elementLiyou, Zhao / Zebin, Kong et al. | 2018
- 1578
-
High Power Module Package Mounting and Temperature Cycling Reliability Study by SimulationQian, Richard / Yao, Alex / Xu, Bruce / Liu, Yong / Chew, CH et al. | 2018
- 1585
-
Application of worst case analysis to failure analysis of hybrid ICWang, Tong / Wang, Xu / Meng, Meng / Ding, Zhimin / He, Ming et al. | 2018
- 1588
-
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling ApplicationsWang, Nan / Chen, Shujing / Nkansah, Amos / Darmawan, Christian Chandra / Ye, Lilei / Liu, Johan et al. | 2018
- 1593
-
Structure and luminescence properties study of Eu2+ doped Ca2Al2−xSi1+xO7−xNx phosphors based on size-mismatch modelChen, Lei / Jing, Gang / Lin, Jintian / Liu, Huaiyuan et al. | 2018
- 1598
-
Facile way to fabricate high quality white LED with yellow graphene quantum dotsZhou, Jipeng / Li, Chunya / Yin, Luqiao / Wang, Liang / Zhang, Jianhua et al. | 2018
- 1602
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Influence of P3HT molecular weight on film processing and solar cell performanceJunle, YU / Jie, TANG / Chao, WANG / Yanqiong, ZHENG / Chihaya, ADACHI / Chenghui, ZENG et al. | 2018
- 1605
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Modeling, Analysis and Implementation of Junction-to-Case Thermal Resistance Measurement for Press-Pack IGBT ModulesLi, Helong / Wang, Yafei / Plumpton, Ashley / Wang, Yangang / Li, Daohui / Dai, Xiaoping / Liu, Guoyou et al. | 2018
- 1611
-
Research on the Effect of Mechanical Bending on Signal Transmission Characteristics of FPCTang, Ruiqiang / Zhou, Dejian / Lei, Ting et al. | 2018
- 1615
-
Design of incremental grating ruler online measuring- displacement system based on LabVIEWYanFeng, Li / ZhiJun, Yang / Han, Sun / ShaoWang, Xiong / Qian, Li et al. | 2018
- 1619
-
Influence of different materials on thermal stress of conical TSVChen, Gudi / Wang, Zhiqi / Wang, Weiyin et al. | 2018
- 1624
-
Numerical Study on E-jet printing Cone Forming of Insulating Nozzle StructureWang, Zhiqi / Zhou, Dejian / Chen, Xiaoyong / Chen, Guidi et al. | 2018
- 1629
-
Design and Implementation of Energy Efficiency Metering System for Multi-terminal Flexible DC TransmissionZHANG, Jiangming / SHEN, Jianliang / YAO, li / HU, Yingjun et al. | 2018
- 1635
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A 2.4-GHz Digitally Controlled Ring Oscillator Based on MOS CapacitorsGeng, Xin / Wang, Zixuan / Guo, Yufeng / Zhang, Cong / Xia, Xiaojuan / Li, Haozheng / Han, Yuhui et al. | 2018
- 1638
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A 0.6-V Supply Two-Step Time-to-Digital Converter Using Dynamic Threshold TechnologyZhang, Cong / Wang, Zixuan / Xia, Xiaojuan / Geng, Xin / Guo, Yufeng / Tian, Zichen / Liu, Mei et al. | 2018
- 1642
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Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element SimulationFan, Jiajie / Hu, Aihua / Pecht, Michael / Chen, Wei / Fan, Xuejun / Xu, Dan / Zhang, Guoqi et al. | 2018
- 1649
-
Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3 systemhuanhuan, Wan / weijun, Zhang / zhuofeng, Liu et al. | 2018
- 1653
-
Electromigration in flip chip with Cu pillar having a shallow Sn-3.5Ag solder interconnectZhang, Haoliang / Li, Junhui / Zhu, Wenhui et al. | 2018
- 1657
-
Graphene-like Monolayer Yttrium Nitride: A Moderate Semiconductor and Pronounced Electronic Insensitivity to StrainCui, Heping / Zheng, Kai / Luo, Houcai / Ye, Huaiyu / Chen, Xianping et al. | 2018
- 1661
-
Thermal Analysis on the Degradation of GaN HEMTsZhou, Bin / Huang, Yun / Li, Ruguan / Chen, Si / He, Zhiyuan / Fu, Xing et al. | 2018
- 1666
-
STUDY ON DE-EMBEDDING APPROACH OF NON-COAXIAL MICROWAVE DEVICE TEST FIXTURESChen, Shouhong / Wang, Zhuang / Yang, Ping / Yan, Xuelong / Ma, Jun et al. | 2018
- 1671
-
Evaluation and Failure Mechanism of High Power Semiconductor Laser PackagingGuo-guang, Lu / Gan-xiong, Lai / Bin, Yao et al. | 2018
- 1675
-
Interconnect Reliability of Low Temperature Solder for Potential Application in Enterprise Computers, Portable, and Automotive ElectronicsWang, Dr. Paul / He, David / Cao, Vivi / Mai, Goterry / Song, Sy / Ge, Fred / Tan, KG et al. | 2018
- 1681
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Compensation Method for Die Shift in Fan-Out PackagingSun, Yue / Hou, Fengze / Chen, Feng / Liu, Haiyan / Zhang, Hengyun / Sun, Peng / Lin, Tingyu / Cao, Liqiang et al. | 2018
- 1687
-
Influence Factor Analysis of Thermal Resistance for Plastic PackageHu, Wenhua / Xu, Jian / Sun, Peng et al. | 2018
- 1692
-
Measurement of Dynamic Junction Temperature for LED Flash Units of CameraShieh, Brian / Zeng, Fangyun / Ricky Lee, S. W. / Yang, Guoming et al. | 2018
- 1696
-
Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-fluxXia, Da-quan / Yang, Dong-hua / Liu, Xin / Zhou, Yu-feng / Gan, Gui-sheng / Wu, Yi-ping et al. | 2018
- 1702
-
Synthesis of size-controlled pure copper nanoparticles for packaging interconnectLai, Tao / Zhang, Yu / Cui, Chengqiang / Zhang, Kai / Chen, Tao / Chen, Xun / Chen, Xin / Gao, Jian / He, Yunbo / Tang, Hui et al. | 2018
- 1706
-
Study on the structure of vertical Through Silicon Via with aspect ratio 2.5:1 for CMOS image sensorChen, Lijun / Dai, Fengwei / Zhang, Wenqi et al. | 2018
- 1709
-
Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatmentxu, Hongyan / Li, Jianqiang / Ning, Puqi / Xu, Ju et al. | 2018
- 1716
-
Development on Super-thin & High-Pixel CMOS Image Sensor ModuleHuang, Mark / Han, Huisheng / Wu, Huabin / Huang, Chuangwen / Zhang, Weiqing et al. | 2018
- 1720
-
Case Study of Resistor Failure Caused by Bi Migration and Preventive MeasuresChen, Jintao / Zhu, Binruo / Liu, Liyuan / Zhang, Yin / Mo, Fuyao / Gu, Zhen et al. | 2018
- 1723
-
Research on the Photoelectric Properties of Flexible PhotodetectorsChen, Xiaoyong / Zhou, Deian / She, Yulai / Liang, Tianshou et al. | 2018
- 1728
-
Research of inkjet printing process for flexible electronic interconnect structuresGong, Siming / Pan, Kailin / Wang, Wenhui / Fan, Kai / Cheng, Hao / Guo, Chen et al. | 2018
- 1735
-
Study of the interaction energy at the composite interface between PDMS and functionalized Graphene using molecular dynamics simulationsFan, Kai / Pan, Kailin / Gong, Siming / Wang, Wenhui / Cheng, Hao / Guo, Chen et al. | 2018
- 1741
-
Design and analysis of self-similar serpentine interconnects for stretchable electronicsYang, Fan / Wang, Yasong / Kuang, Xiaole / Nie, Yaoyao / Xia, Wei et al. | 2018
- 1744
-
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during AgingZhao, Ning / Wang, Mingyao / Zhong, Yi / Ma, Haitao / Wang, Yunpeng et al. | 2018
- 1748
-
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnectsZhong, Yi / Zhao, Ning / Dong, Wei / Wang, Yunpeng / Ma, Haitao et al. | 2018
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[Front cover]| 2018
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ICEPT 2018 TOC| 2018
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ICEPT 2018 Index| 2018
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[Copyright notice]| 2018