A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests (Englisch)
- Neue Suche nach: Peng Su,
- Neue Suche nach: Howell, J.
- Neue Suche nach: Chopin, S.
- Neue Suche nach: Peng Su,
- Neue Suche nach: Howell, J.
- Neue Suche nach: Chopin, S.
In:
IEEE Transactions on Electronics Packaging Manufacturing
;
29
, 4
;
246-251
;
2006
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests
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Beteiligte:
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Erschienen in:IEEE Transactions on Electronics Packaging Manufacturing ; 29, 4 ; 246-251
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.10.2006
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Format / Umfang:2277469 byte
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 29, Ausgabe 4
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- 229
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Foreword Special Section on Tin Whiskers| 2006
- 229
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Special Section on Tin WhiskersGedney, R. W. et al. | 2006
- 231
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Tin Whisker Test Method DevelopmentSchroeder, V. / Bush, P. / Williams, M. / Nhat Vo, / Reynolds, H.L. et al. | 2006
- 231
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SPECIAL SECTION PAPERS - Tin Whisker Test Method DevelopmentSchroeder, V. et al. | 2006
- 239
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SPECIAL SECTION PAPERS - Humidity Effects on Sn Whisker FormationOberndorff, P. et al. | 2006
- 239
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Humidity Effects on Sn Whisker FormationOberndorff, P. / Dittes, M. / Crema, P. / Peng Su, / Yu, E. et al. | 2006
- 246
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A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity TestsPeng Su, / Howell, J. / Chopin, S. et al. | 2006
- 246
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SPECIAL SECTION PAPERS - A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity TestsSu, P. et al. | 2006
- 252
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The Effect of Annealing on Tin Whisker GrowthFukuda, Y. / Osterman, M. / Pecht, M. et al. | 2006
- 252
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SPECIAL SECTION PAPERS - The Effect of Annealing on Tin Whisker GrowthFukuda, Y. et al. | 2006
- 259
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Stress-Induced Tin Whisker Initiation Under Contact LoadingShibutani, T. / Qiang Yu, / Yamashita, T. / Shiratori, M. et al. | 2006
- 259
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SPECIAL SECTION PAPERS - Stress-Induced Tin Whisker Initiation Under Contact LoadingShibutani, T. et al. | 2006
- 265
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Microstructure-Based Stress Modeling of Tin Whisker GrowthJie-Hua Zhao, / Peng Su, / Min Ding, / Chopin, S. / Ho, P.S. et al. | 2006
- 265
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SPECIAL SECTION PAPERS - Microstructure-Based Stress Modeling of Tin Whisker GrowthZhao, J.-H. et al. | 2006
- 274
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SPECIAL SECTION PAPERS - Analysis of the Effects of Tin Whiskers at High FrequenciesEvans, R. et al. | 2006
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Analysis of the Effects of Tin Whiskers at High FrequenciesEvans, R. et al. | 2006
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Real-Time Quality Evaluation of Wire Bonding Using Input ImpedanceShih-Fu Ling, / Dong Zhang, / Sung Yi, / Say Wee Foo, et al. | 2006
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Multiple Orders Per Job Compatible Batch SchedulingErramilli, V. / Mason, S.J. et al. | 2006
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Preventing of Dewetting Effects for Inorganic–Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface PretreatmentsUhlig, S. / Domann, G. / Houbertz, R. / Frohlich, L. / Schroder, H. / Krissler, J. / Lang, G. / Robertsson, M. et al. | 2006
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Using Transmission Laser Bonding Technique for Line Bonding in Microsystem PackagingTseng, A.A. / Jong-Seung Park, et al. | 2006
- 319
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IEEE Transactions on Advanced Packaging - Table of contents| 2006
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IEEE Transactions on Components and Packaging Technolog - Table of contents| 2006
- 323
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2006 Index| 2006
- C1
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Table of contents| 2006
- C2
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IEEE Transactions on Electronics Packaging Manufacturing publication information| 2006
- C3
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2006
- C4
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2006