Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive Applications (Englisch)
- Neue Suche nach: Ma, Yiyi
- Neue Suche nach: Talledo, Jefferson
- Neue Suche nach: Luan, Jing-en
- Neue Suche nach: Ma, Yiyi
- Neue Suche nach: Talledo, Jefferson
- Neue Suche nach: Luan, Jing-en
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive Applications
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.08.2019
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Format / Umfang:1307282 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
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- 1
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Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronicsZhang, Wenwu / Cao, Yichen / Zhang, Lin / Ji, Hongjun / Li, Mingyu et al. | 2019
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3D SiP Simulation Technology and ApplicationLi Li Yang, Suny et al. | 2019
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LQFP Warpage Optimization Based on Variance Analysis MethodJIN, Lingyue / SUN, Haiyan / ZHAO, Jicong / SUN, Ling / FANG, Jiaen et al. | 2019
- 1
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Phosphor particle spatial patterning for high angular color uniformity LED packaging through selective curing and settlingLu, Xinyao / Wang, Weixiang / Su, Zhenpeng / Liu, Sheng / Zheng, Huai et al. | 2019
- 1
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Microstructure and Property of Au stud/Lead-free solder composite jointZhang, Yongzhong / Ji, Hongjun / Wang, Jiao et al. | 2019
- 1
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Detection and Classification of Typical Defects in TSV and RDLLUO, Changhao / ZHAO, Kai / Sun, Xiaoxia / MIAO, Min / LI, Zhensong et al. | 2019
- 1
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Molecular Dynamics Simulation of Stress in AlN Thin Films on Sapphire SubstrateZhang, Libin / Li, Ling / Wu, Yifan / Suo, Yalun / Gan, Zhiyin et al. | 2019
- 1
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Investigation on thermal stress of bondline based on Cu@Sn preform at high temperature applicationxu, Hongyan / Ning, Puqi / zheng, libing / Xu, Ju / Zhang, Shuting et al. | 2019
- 1
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Sinter Ag joining on different metallization substrate and their high temperature reliabilityChen, Chuantong / KiM, Dongjin / Suganuma, Katsuaki et al. | 2019
- 1
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Size effects on segregated growth kinetics of interfacial IMC between Sn solder and Cu substrateShang, Shengyan / Wu, Shaocheng / Feng, Tuo / Li, Weifeng / Wang, Yanfeng / Kunwar, Anil / Ma, Haoran / Ma, Haitao et al. | 2019
- 1
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Facile Preparation of Cu Micro-Nano Composite Particle Paste for Low Temperature BondingMou, Yun / Peng, Yang / Li, Junjie / Liu, Jiaxin / Sun, Qinglei / Chen, Mingxiang et al. | 2019
- 1
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Thermal and optical performance investigations of laser-excited phosphor layer on a semiconductor chilling plateLiang, Yifu / Tang, Yong / Yu, Binhai / Li, Zongtao / Wu, Kejian / Ding, Xinrui et al. | 2019
- 1
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Study on photoelectrical properties of Nb-MoS2, theoretically and experimentallyQu, Zuopeng / Yang, Huiru / Du, JiHe / Gao, Pan / Zhao, Zeheng / Ye, Huaiyu / Zhang, Guoqi et al. | 2019
- 1
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Electromigration Reliability of Au Wire Bonding after MoldingDu, Yahong / Wen, Ming / Liu, Zhi-Quan et al. | 2019
- 1
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Study on solder void for PiP large solder area ultrathin die in solder reflowYang, Jianwei et al. | 2019
- 1
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Effects of temperature gradients on the growth kinetics of CoSn3 at Co-P/Sn/Co-P interfaceDu, Fei / Yang, Donghua / Ran, Teng / Zhai, Xiang / Gan, Guisheng / Tian, Jiang et al. | 2019
- 1
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Research on Preparation Technology of Nano Glass-Particles for High Density TGV ApplicationDu, Xiaohui / Liu, Shuai / Zhu, Minjie et al. | 2019
- 1
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Analysis of diamond-like carbon film on enhancing thermal radiation of substrate of high-power LEDWu, Xingyang / Duan, Weilin / Wu, Siwei / Zhang, Jianhua et al. | 2019
- 1
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Laser-assisted Glass Frit Bonding Combined With Blue Light-shieldingYang, Yanan / Li, Yi / Yang, Jun / Yin, Luqiao / Chen, Longlong / Zhang, Jianhua et al. | 2019
- 1
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Study on the Effect of Thin Resistive Film’s Structure on the Reliability of Automotive ElectronicsDaotan, Lin / Yong, Wang / Zhenfeng, Xie / Qin, Wu / Shengzong, He et al. | 2019
- 1
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Development of Laser-Induced Deep Etching Process for Through Glass ViaChen, Li / Wu, Heng / Zhang, Mingchuan / Jiang, Feng / Yu, Tian / Yu, Daquan et al. | 2019
- 1
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Performance Investigation on Hemispherical Lens used in Photodetector for Visible Light CommunicationsYu, Binhai / Liang, Shunming / Ding, Xinrui / Yang, Yi / Shao, Changkun / Zhao, Qiliang / Li, Zongtao et al. | 2019
- 1
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Study on Water Bath Pulling Method Mechanism for Implementing the Equidistant Arrangement of - Ag NWs on Flexible SubstrateZhang, Lin / Yu, Jiaao / Zhao, Changyao / Li, Mingyu / Ji, Hongjun et al. | 2019
- 1
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Gate and barrier layer design of E-mode GaN HEMT with p-GaN gate structureLi, Wanjie / Chen, Xianping / Wang, Liming / Zhang, Xu / Li, Xiandong / Tao, Luqi et al. | 2019
- 1
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Reliability of nano-silver soldering paste with high thermal conductivityYu, Chunyu / Yang, Dongsheng / Zhao, Donglei / Sheng, Zhong et al. | 2019
- 1
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Analysis of residual stress after reflow soldering of QFN packageZhao, Sheng-jun / Huang, Chun-yue / Tang, Xiang-qiong / Liang, Ying et al. | 2019
- 1
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Preparation of Silicon Nanowires by Metal-assisted Chemical Etching with Ethylene Glycol AdditiveDeng, Xin / Wang, Yan / Yang, Yi / Zhu, Chuangmin / Wang, Fuliang et al. | 2019
- 1
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Design, Fabrication and Test of Dual Redundant TSV Interconnection for Millimeter Wave ApplicationsWang, MengCheng / Ma, Shenglin / Cai, Han / Hu, Liulin / He, ShuWei et al. | 2019
- 1
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Stress distribution of bonding wire of IGBT module under DC power cycling conditionWu, Wei / Wang, Liang / Lin, Zhongkang / Zhang, Zhe et al. | 2019
- 1
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RF Switch Squeeze Film Damping Analysis and Input Shaping ControlChen, Shirong / Xiao, Jing / Sun, Peng et al. | 2019
- 1
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A 3D packaging cover structure with optical filter and low signal-transmission loss for MEMS infrared detectorsMingmin, GE / Haiyan, SUN / Ling, SUN / Jicong, ZHAO et al. | 2019
- 1
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Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic PackagingLiu, Jiaxin / Mou, Yun / Peng, Yang / Chen, Mingxiang et al. | 2019
- 1
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Condensation heat transfer enhancement via electric fieldsGong, Zheng / Zhang, Mingming / Wang, Yan / Zheng, Huai et al. | 2019
- 1
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Reliability of Ultrathin Organic Insulating Films for 3D PackageDong, Mengya / Liu, Yang / Xiong, Lishuang / Li, Ming et al. | 2019
- 1
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Study on Thermal Conductivity of Micro-arc Alumina Substrate for High Power LEDJiu, Lei / Pan, Mingqiang / Sheng, Jun et al. | 2019
- 1
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The Process Parameter Simulation of Press-fit Pin in a Power ModuleYang, Esther / Qian, Richard / Yao, Alex / Liu, Yong et al. | 2019
- 1
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Study on conductive paste of silver particles for power semiconductor devices packageZhou, Jianwen / Li, Gang / Zhu, Pengli / Sun, Rong / Wong, Ching-ping et al. | 2019
- 1
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Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrateSun, Tao / Zhou, Min-Bo / Zhang, Ze-Jun / Zhang, Xin-Ping et al. | 2019
- 1
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Study on warpage evolution for six-side molded WLCSP based on finite element analysisZHAO, Shuai / QIN, Fei / YANG, Mengke / XIANG, Min / YU, Daquan et al. | 2019
- 1
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Thermal distribution measurement upon micro-resistance lines using Thermoreflectance techniqueSi, Weikang / Zheng, Libing / Wei, Shuhua et al. | 2019
- 1
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Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSELShieh, Brian / Zeng, Fangyun / Yang, Guoming / Zhao, Fanny / Sher, Chin-Wei / Ricky Lee, S. W. et al. | 2019
- 1
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Silicon-Glass-Silicon Triple Stacked Structure for Fabrication of MEMS Resonator AccelerometerLi, Nannan / Xing, Chaoyang / Sun, Peng / Zhu, Zhengqiang et al. | 2019
- 1
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Study on chip component no-fillet solder joint stress and strain under three point bendingGao, Chao / Huang, Chunyue / Fu, Yuxiang / Liang, Ying et al. | 2019
- 1
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Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out TechnologyYu, Tian / Chen, Cheng / Jiang, Feng / Chen, Li / Zhang, Mingchuan / Yu, Daquan et al. | 2019
- 1
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Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloyLu, Chunyan / Huang, Feifei / Huang, Mingliang et al. | 2019
- 1
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An analysis case on the crack failure of CBGA solder jointsLi, Weiming et al. | 2019
- 1
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P Doped GaS: A Promising Candidate for NH3 Sensor With High Sensitivity and SelectivityGao, Chenshan / Du, Jihe / Qu, Zuopeng / Wang, Lei / Kong, Lingnan / Li, Jun / Ye, Huaiyu / Zhang, Guoqi et al. | 2019
- 1
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Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED ApplicaitonsTU, Ning / Ricky LEE, S. W. et al. | 2019
- 1
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Research on Vibration Failure of Solder Joints for Different Packaging FormsJia, Rourou / Zhou, Bin / Chen, Si / An, Tong / Qin, Fei / Liang, Chen et al. | 2019
- 1
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Nickel-Cobalt Sulfide Nonwoven Cloth with UltraHigh Areal Capacitance for Flexible SupercapacitorsLiang, Caiwu / Zou, Peichao / Wang, Xuanyu / Liang, Bin / Yang, Cheng et al. | 2019
- 1
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Warpage simulation method development considering moiré inhomogeneous temperature fieldWang, Zhen / Li, Shengxian / Zhou, Yonghua / Li, Xiaoqing / Wu, Jun / Chen, Qiang et al. | 2019
- 1
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MnO2@Nickel Nanocone Arrays Coated Paper Electrode for Flexible SupercapacitorsWang, Min / Hu, Shengyu / Su, Songyang / Wang, Xuanyu / Liu, Jiaxing / Yang, Cheng et al. | 2019
- 1
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Thermal design and analysis of power LED packaging based on grapheneBao, Jie / Xu, Yuan / Ning, Renxia / Hou, Li / Chen, Zhenhai / Xu, Wenyi / Zhou, Bin et al. | 2019
- 1
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Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive ApplicationsMa, Yiyi / Talledo, Jefferson / Luan, Jing-en et al. | 2019
- 1
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Investigation on Nonlinear Electromechanical Behavior of Conductive Polymer Composites-based Flexible Strain SensorPan, Xudong / Guo, Dengji / He, Hu et al. | 2019
- 1
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How to pressureless sinter-bond power chips with bare copper substrates using nanosilver paste?Chen, Yue / Mei, Yunhui. / Feng, Zhihong / Lu, Panpan / Wang, Meiyu / Yang, Yingkun / Lu, Guo-Quan et al. | 2019
- 1
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Design of an accelerometer in inclination monitoring of power transmission poleChen, Yanning / Wang, Shuaipeng / Zhang, Haifeng / Zhao, Dongyan / Fu, Zhen / Yuan, Yidong / Wang, Yubo et al. | 2019
- 1
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Investigation on the Interface Thermal Resistance of Copper-TitaniumXu, Yixin / Zhu, Fulong / Wang, Miaocao / Lu, Zilin / Hu, Jianxiong / Zeng, Pengjun et al. | 2019
- 1
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Effect of Er2O3 on the properties of AlN ceramics by tape castingBai, Hong-bo / Zhang, Xiao-hui / Wu, Ya-guang / Zhang, Yi-zheng / Zhao, Duo / Gao, Ling et al. | 2019
- 1
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A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave ModulesTian, Jun / Wang, Congsi / Liu, Shaoyi / Zhu, Cheng / Zhou, Cheng / Liu, Jing / Wang, Zhihai / Yu, Kunpeng / Wang, Lu / Zheng, Yuanpeng et al. | 2019
- 1
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Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic ConnectorsXu, Qianwen / Lee, Shi-Wei Ricky / Chi Chuen Lo, Jeffery et al. | 2019
- 1
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Effect of TADF fluorescent isomers on the solar cell performance and dielectric characteristics of organic Schottky junctionsTANG, Jie / LI, Weiguang / YU, Junle / ZHENG, Yanqiong / WEI, Bin / LI, Xifeng et al. | 2019
- 1
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Mechanical properties of a novel multi-scale silver paste for electronics interconnect applicationSun, Yongqian / Lu, Xiuzhen / Zhang, Qiaoran / Zhang, Xiaoxin / Liu, Johan / Ye, Lilei et al. | 2019
- 1
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Dielectric self-healing BNNS/PU nanocomposites based on DA chemistryHuang, Jingyu / Wu, Xudong / Liu, Feng / Yu, Shuhui / Zhang, Guoping / Sun, Rong / Wong, Ching- Ping et al. | 2019
- 1
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Influence of the BGA solder joint microstructure on the thermal cycling reliabilitySun, Xiaowei / Li, Weiming / Chen, Mingsheng et al. | 2019
- 1
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Study on High Density Fine pitch PCBA Cleaning Process Optimization Based on Ceramic Board and Flexible PlateLi, Jianqiang / Ji, Lianhe / Wang, Wenhe / Pang, Zhenjiang / Zhang, Haifeng / Liu, Dongmei et al. | 2019
- 1
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Fabrication of a temperature sensor for monitoring the temperature of Smart meter terminalsWang, Shuaipeng / Zhang, Haifeng / Zhao, Dongyan / Fu, Zhen / Chen, Yanning / Yuan, Yidong / Wang, Yubo et al. | 2019
- 1
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Ohmic Contact Characteristic of Ti/Al/Ni/Au on AlGaNLi, Ling / Zhang, Libing / Sun, Yalun / Wang, Yifang / Gan, ZhiYing et al. | 2019
- 1
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The Effect of Different Stress Conditions on MONOS Breakdown for 3D NAND Flash MemoryHe, Junpeng / Tian, Xuan / Zhang, Hekun / Song, Zhe / Yu, Qianqian / Li, Liang / Li, Ming / Gao, Liming et al. | 2019
- 1
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The comparison of Qian-Liu model and Anand model for uniaxial tensile test of SAC305Zhang, Zhao / Chen, Zhiwen / Liu, Sheng / Dong, Fang / Liang, Kang / Ma, Kun et al. | 2019
- 1
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Microstructural and mechanical reliability of a GaN/DBA die-attached module with Ag sinter joining in harsh thermal environmentsKim, Dongjin / Chen, Chuantong / Suganuma, Katsuaki et al. | 2019
- 1
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Intrinsic low dielectric constant and low dielectric loss polyimides: the effect of molecular structureZhang, Fan / Li, Jinhui / Liu, Feng / Zhang, Guoping / Sun, Rong / Wong, Ching-ping et al. | 2019
- 1
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Reliability evaluation and selection of underfill adhesivesYong, Ding / Chunchao, Lai / Peiqiang, Zhang / Bingjie, Zhen / zilian, Liu / zhanping, Zheng et al. | 2019
- 1
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Plasma treatment achieving enhanced thermal conductivity of a thermal interface materialMa, Jiake / Wang, Yu / Gao, Ming / Ren, Linlin / Huang, Yifan / Sun, Rong et al. | 2019
- 1
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Study on the degradation of wire bonding wedges and a proposed method for the prolongation of wedge service lifeYilong, WU / Zehai, WEN / Pingsheng, ZHANG / Yuhua, PAN / Qian, LU / Yangyang, LI et al. | 2019
- 1
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The Study on Cracking Reasons of LED Encapsulation SiliconeXu, Huanxiang / Tang, Yanhuang / Wu, Jingxi / Peng, Bo / Chen, Zijun / Liu, Zilian et al. | 2019
- 1
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Copper wire off-center ball and 2nd smash bond issue resolution on XQFP packageLi, Jun / Han, Ming-chuan / Liu, Mei / Wang, Han-Sheng / Wang, Zhi-Jie et al. | 2019
- 1
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Growth behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering InterfaceMa, Haoran / Dong, Chong / Chen, Shi / Shang, Shengyan / Liu, Yiling / Wang, Yunpeng / Li, Xiaogan / Ma, Haitao et al. | 2019
- 1
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Numerical Simulation of Thermal Analysis and Geometric Parameter Optimization of IGBTLi, Fang / Lun, Yinghui / Peng, Cheng / Zhu, Wenhui / He, Hu et al. | 2019
- 1
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Effect of pressure during graphitization on mechanical properties of graphene filmsZhang, Maomao / Chen, Shujing / Zhang, Xiaoxin / Wang, Nan / Lu, Xiuzhen / Jiang, Ziwei / Wang, Qianlong / Liu, Xiaohua / Liu, Johan / Ye, Lilei et al. | 2019
- 1
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Microstructure evolution and mechanical properties of Cu interconnects bonded with Ni-foam reinforced pure Sn solderHe, Huang / Huang, Shangyu / Xiao, Yong et al. | 2019
- 1
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Solder size effect on interfacial reaction and growth behavior of Cu–Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processesXu, Tao / Zhou, Min-Bo / Zhang, Ze-Jun / Zhao, Xing-Fei / Zhang, Xin-Ping et al. | 2019
- 1
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Effect of pressure on nano copper sintering in interconnections of power deviceQian, Jing / Chen, Xianping / Tan, Chunjian / Li, Xiandong / Li, Qiumei / Tao, Luqi / Huang, Yiping / Wu, Lingmei et al. | 2019
- 1
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Study on Performances of High-power LED Based on RTC by Electromagnetic Induced HeatingHe, Zhanwen / Wu, Guangsong / Chen, Jibing et al. | 2019
- 1
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Simulation and Characterization of Si-based Microchannel for Module Level CoolingLi, Yangyang / Lu, Qian / Xiang, Weiwei / Zhang, Jian / Jiang, Miaomiao / Zhang, Yanming et al. | 2019
- 1
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Development of flip chip solders joint defects under temperature cycling testingSu, Dezhi / Guan, Peijie / Zhao, Dan / Niu, Yucheng / Wang, Quanwen / Wang, Shangzhi / Yang, Huihui / Wang, Cen et al. | 2019
- 1
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Validation of submodel technique for fracture evaluation in wafer-level package under thermal loadingZHANG, Min / QIN, Fei / DAI, Yanwei / AN, Tong / CHEN, Pei et al. | 2019
- 1
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Dynamic stress and reliability analysis for bonded wafer during wafer grinding processZhao, Wenxuan / Zhang, Lixiang / Qin, Fei / Chen, Pei et al. | 2019
- 1
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First-principle study of gas adsorption on SiGe monolayer as sensor applicationsSun, Xiang / Liang, Kang / Dong, Fang / Wang, Zhen / Liu, Sheng et al. | 2019
- 1
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Analysis and Solution of Glass Cracking of Low Frequency Connector in Multi-Chip ModuleJin, J. F. / Ren, R. / Gou, H. Z. et al. | 2019
- 1
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Effect of space environment on the reliability of sintered silver nanoparticles reinforced by SiC particlesWu, Yanpei / Feng, Xiaojing / Xia, Weijuan / Zou, Cheng / Lu, Xiuzhen / Liu, Johan / Long, Xu et al. | 2019
- 1
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Effect of corrosion on mechanical and biological properties of nano-silver jointsGong, He / Zhao, Fanfan / Yao, Yao et al. | 2019
- 1
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10 mils Al wire heavy wedge bond wire deformation thickness studyLi, Lu / Xu, Sean / Liang, Y.k. / Wei, Peter et al. | 2019
- 1
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Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperaturesLi, Wang-Yun / Peng, Guan-Qiang / Cheng, Tian-Xiang / Qin, Hong-Bo / Huang, Jia-Qiang / Yang, Dao-Guo et al. | 2019
- 1
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A stretchable and transparent triboelectric nanogenerator based on prestretching PDMS with silver nanowires as electrodeYu, Xuecheng / Zhang, Leicong / Liang, Xianwen / Zhu, Pengli / Sun, Rong / Wong, Ching-Ping et al. | 2019
- 1
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Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loadsLe, Wen-Kai / Sun, Tao / Zhou, Jie-Ying / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2019
- 1
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Influence of Solder Layer Void on Thermal Stability for Power Semiconductor DeviceGao, Wei / Guo, Qiao / Peng, Yuyu / Ren, Min / Zhang, Bo / Cai, Shaofeng et al. | 2019
- 1
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Corrosion induced reliability degradation due to pad design variationMeng, Zhong / Zhou, Yonghua et al. | 2019
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ICEPT 2019 Cover Page| 2019
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ICEPT 2019 Author Index| 2019
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ICEPT 2019 Copyright Page| 2019
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ICEPT 2019 Table of Contents| 2019