Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint (Englisch)
- Neue Suche nach: Jie-Bao,
- Neue Suche nach: Cao, Lihua
- Neue Suche nach: Chen, Chunhuan
- Neue Suche nach: Liu, Zhi-Quan
- Neue Suche nach: Jie-Bao,
- Neue Suche nach: Cao, Lihua
- Neue Suche nach: Chen, Chunhuan
- Neue Suche nach: Liu, Zhi-Quan
In:
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
;
469-472
;
2017
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint
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Beteiligte:Jie-Bao, ( Autor:in ) / Cao, Lihua ( Autor:in ) / Chen, Chunhuan ( Autor:in ) / Liu, Zhi-Quan ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.08.2017
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Format / Umfang:795593 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Table of contents| 2017
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Author index| 2017
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[Copyright notice]| 2017
- 1
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Thermal-mechanical analysis of high power LED packaging during power cycling testPan, Yongjun / Zhu, Fulong / Fan, Jiajie / Lin, Xinxin / Tao, Jiaquan / Liu, Sheng et al. | 2017
- 6
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Modeling study of the dynamics of silicone-phosphor in jet dispensing process for LED packagingChen, Yun / Wang, Xiaochu / Zhang, Yu / Gao, Jian / Chen, Xin / Gao, Bo / He, Yunbo / Wong, Ching-Ping et al. | 2017
- 10
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The study of the growth behavior of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system during the ultrasonic-assisted transient liquid phase solderingLiu, Jihou / Zhao, Hongyun / Li, ZhouLin / Song, Xiaoguo et al. | 2017
- 14
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Package stiffener optimization for high speed signal integrity and electromagnetic compatibilityWu, Boping et al. | 2017
- 20
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Influence of thermomigration on creep behavior of Cu/Sn0.7Cu/Cu solder jointWei, Guo-qiang / Ma, Si / Li, Da-lei / Jia, Yin-pei / Liu, Heng-lin et al. | 2017
- 25
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Study the effect of the temperature on the PCB assembly and solder joints in the vehicleZhou, Jia-cheng / Liu, Fang / Nu, Yan et al. | 2017
- 30
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The development of electric coupling for RF IC package substrateLiu, Qi / Wang, Huimei / Liu, Weidong / Wang, Xiaolong / Zhang, Rui et al. | 2017
- 35
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Removal of high dose ion-implanted photoresists using dry processWang, Shuaipeng / Li, Jianqiang / Chen, Yanning / Zhao, Dongyan / Wang, Yubo / Zhang, Haifeng et al. | 2017
- 38
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Design, packaging and test of a planar double-side cooling IGBT power moduleZheng, Libing / Liu, Zhuming / Wang, Chunlei / Fang, Huachao / Han, Li et al. | 2017
- 44
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Pb-free silver pastes with SnO-B2O3 glass frits for crystalline silicon solar cellsJiang, Jiachu / Li, Changli / He, Yue / Wei, Jinquan / Li, Liangliang et al. | 2017
- 50
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Grafting of perfluorinated organic film on the Si surface in aqueous solutionZhang, Shanshan / Li, Ming / Zhang, Wenlong / Zhang, Junhong et al. | 2017
- 54
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Preparation of pine-like Cu-Ni-P coating and its application in 3D integrationZhang, Wenjing / Wang, Yinghui / Suga, Tadatomo / Kawai, Hiromu / Yamamoto, Michitaka / Higurashi, Eiji / Fujino, Masahisa / Li, Ming et al. | 2017
- 59
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A study for open circuit failure of PCB with direct plating using conductive polymersHe, Xiao / Wu, Junming / Lu, Tao / Shen, Jianghua et al. | 2017
- 63
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Effect of thermal cycling on tensile behaviour of SAC305 solderLong, Xu / Yao, Yao / Wu, Yanpei / Xia, Weijuan / Ren, Lianfeng et al. | 2017
- 69
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Investigation on the ESD failure mechanism of integrated circuits in a 0.11µm CMOS processShao, Jin / Qiao, Yanbin / Ma, Qiang / Li, Jianqiang / Chen, Yanning / Yuan, Yidong / Tang, Xiaoke / Zhang, Haifeng / Zhao, Dongyan et al. | 2017
- 72
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White light-emitting diodes with enhanced luminous efficiency and high color rendering using separated quantum dots@silica/phosphor structureXie, Bin / Cheng, Yanhua / Yu, Xingjian / Shu, Weicheng / Luo, Xiaobing / Hao, Junjie / Wang, Kai et al. | 2017
- 76
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Competitive adsorption between suppressor and accelerator in copper methanesulfonic acid bath for electrodepositionWang, Dongfan / Miao, Xiaoying / Ling, Huiqin / Li, Ming / Dai, Fengwei / Zhang, Wenqi / Cao, Liqiang et al. | 2017
- 80
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The mechanism of Al contents (0–0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/CuNiu, Xi / Lin, Kwang-Lung et al. | 2017
- 89
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The stability study of lead-free solder pasteHao, Juanjuan / Lei, Yongping / Lin, Jian et al. | 2017
- 94
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Mechanical properties analysis of polyimide insulating layer for the multilayer circuit boards based on 3D printing technologyXiao, Lei / Zhou, Dejian / Qiao, Lvlin et al. | 2017
- 98
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Effect of assembly sequence on shear behavior of solder joints in BGA under board-level structureJia, Keming / Wang, Lifeng et al. | 2017
- 103
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Sintering process of mixed solvent system frit to improve the performance of the film in glass/glass laser bondingLi, Yi / Tian, Rui / Yin, Luqiao / Zhang, Jianhua et al. | 2017
- 108
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Study on temperature factor of LED control gear reliabilityHe, Zhiyuan / Huang, Linyi / Xu, Huawei / Wang, Shen / Liu, Qunxing et al. | 2017
- 113
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Enhanced magnetic and dielectric properties of BiFeO3-BaFe12O19 solid solutionLi, Qiang / Bao, Shengxiang / Li, Jie / Hong, Tao / Ai, Libo / Sun, Yanhua / Luo, Chuan / Jing, Yulan / Hu, Yongda et al. | 2017
- 117
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A low loss of Y-doped BiFeO3 ceramics and its magnetic and dielectric propertiesLi, Qiang / Bao, Shengxiang / Li, Jie / Hong, Tao / Ai, Libo / Hu, Yongda / Sun, Yanhua et al. | 2017
- 122
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Low temperature co-fired Sn-Ca co-substituted Y3Fe5−2xSnxCaxO12 ferrites for microwave devices applicationLi, Jie / Qiu, Tianhui / Wen, Dandan / Liu, Yingli / Jing, Yulan / Huang, Weixun et al. | 2017
- 126
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Failure analysis for bad wetting on HASL PCBYang, Ying et al. | 2017
- 130
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Introduction of capacitive fingerprint sensor packaging technologyDongdong, Wang et al. | 2017
- 135
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A study on shield cover fall-off failure of ENIG surface finish padsLi, Xiaoqian et al. | 2017
- 139
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Effect of annealing process on the properties of through-silicon-via electroplating copperGuan, Yong / Zeng, Qinghua / Chen, Jing / Meng, Wei / Jin, Yufeng / Ma, Shenglin et al. | 2017
- 143
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Oxygen and water barrier performance of the composite thin film of graphene and polydimethylsiloxane (PDMS)Liu, Shiqi / Chen, Zhangfu / Xu, Xiaoxue / Yang, Lianqiao / Wei, Bin et al. | 2017
- 148
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Ultra-compact warm WLEDs fabricated by multi-color phosphor-in-glass directed bonding on flip-chip UV-LEDsJiang, Pengqiang / Peng, Yang / Mou, Yun / Cheng, Hao / Chen, Mingxiang et al. | 2017
- 151
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An evaluation method for the restored time-constant function based on the network identification by deconvolution methodShu, Wenhao / Zhang, Jianhua / Xu, Xiaoxue / Yang, Lianqiao et al. | 2017
- 157
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Modeling and fabrication of the redistribution layer on the 2.5D Si interposerSun, Yunna / Jin, Zhiyu / Luo, Jiangbo / Li, Jian / Sun, Yating / Wang, Yan / Ding, Guifu et al. | 2017
- 162
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Fabrication of the micromachined poly-dimethylsiloxane pyramidal tips arrays for biotechnology packaging applicationsGuan, Yong / Zeng, Qinghua / Chen, Jing / Meng, Wei / Jin, Yufeng / Ma, Shenglin et al. | 2017
- 165
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Aging effect on wettability of negative photoresist with fine-pitch micro-holes after O2 plasma treatmentRen, Wen / Sun, Menglong / Ling, Huiqin / Hu, Anmin / Li, Ming / Zhang, Wenqi / Dai, Fengwei / Cao, Liqiang et al. | 2017
- 169
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Effect of Ni/Au plating on the interconnection reliability of bond padCao, Yuyuan / Yao, Xin / Zeng, Yanping / Yang, Bing / Ming, Xuefei et al. | 2017
- 173
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Multi-chip plastic package technology with new substrateZhang, Rongzhen / Zhu, Yuan / Liao, Xiaoping / Gao, Nayan et al. | 2017
- 177
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A design of S-band monolithic integrated switched filter bankYang, Xiaodong / Xing, Mengjiang / Wang, Erfan / Zhang, Lei / Li, Nan / Qian, Zhouqiang et al. | 2017
- 182
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Multi points temperature measurement of infrared scanning method on surface mount technologyZhao, Xiangxi / Zhang, Wei / Kong, Lingchao et al. | 2017
- 187
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A study on a simplified liquid cooling system with a pump serving as cold plateLiu, Falong / Duan, Bin / Yu, Xingjian / Wu, Ruikang / Luo, Xiaobing et al. | 2017
- 192
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Antenna-on-package on low-cost organic substrate for 60 GHz wireless communication applicationsHo, Cheng-Yu / Jhong, Ming-Fong / Pan, Po-Chih / Ting, Chun-Yen / Wang, Chen-Chao et al. | 2017
- 197
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Micromechanical modeling of the cyclic behavior of Sn-0.7Cu solder based on micromechanical polycrystalline approachLiu, Lu / Yao, Yao et al. | 2017
- 203
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Construction analysis of flip chip package for aerospace applicationZhao, Liyou / Kong, Zebin / Li, Zhen / Wang, Kunshu et al. | 2017
- 207
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Impact of substrate surface condition and epoxy mixture properties on the overflow/incomplete flowLou, Xun / Yang, Li / Zhu, Rui / Wu, Huan / Chen, Lei / Zhang, Wenfeng / Jia, Chong / Yeoh, Hwai Peng / Xu, Junhong et al. | 2017
- 212
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Microstructure and mechanical properties of Au60AgCu joints brazed with Sn63Pb solderWang, Xiuli / Wang, Xinhua et al. | 2017
- 215
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Process emulation for predicting die shift and wafer warpage in wafer reconstitutionYang, C.-Y. / Liu, Y.-C. / Chen, K.-S. / Yang, T.-S. / Wang, Y.-C. / Lee, S.-S. et al. | 2017
- 221
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Quasi in situ study about growth kinetics of Ag3Sn at the interface of eutectic SnPb/electroplated Ag soder joint in the long-term satelliteJi, Xiaoliang / An, Rong / Wang, Chunqing et al. | 2017
- 226
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Silver nanoparticle deposited boron nitride nanosheet/nanofibrillated cellulose composites with enhanced thermal conductivitySun, Jiajia / Zeng, Xiaoliang / Sun, Rong / Xu, Jian-bin / Wong, Ching-ping et al. | 2017
- 231
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Study on delamination variation trend of two plastic packaging devices in combination reliability testLiu, Liyuan / Li, Enliang / Luo, Xia et al. | 2017
- 235
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Effect of interfacial intermetallic compounds morphology on mechanical properties of solder joint with finite element simulationTian, Shuang / Cao, Ruihua / Zhou, Jian / Xue, Feng et al. | 2017
- 240
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Microstructure and mechanical properties of resistor chip joints fabricated by laser soldering using Sn-58Bi solder on Ni(P)/Cu padsTian, Shuang / Cao, Ruihua / Zhou, Jian / Xue, Feng / Tu, Fuqiang / Li, Saipeng et al. | 2017
- 244
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Effective synthesis of Al2O3-silver nanoparticles hybridsPan, Guiran / Zeng, Xiaoliang / Sun, Rong / Xu, Jian-bin / Wong, Ching-Ping et al. | 2017
- 249
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Effects of Ga addition on microstructure and properties of Sn-0.3Ag-0.7Cu solderYao, Xin / Ming, Xuefei / Cao, Yuyuan / Zeng, Yanping / Ji, Yong / Gao, Nayan / Zhou, Xiufeng et al. | 2017
- 253
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The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder jointsWang, Fengjiang / Huang, Ying / Li, Dongyang et al. | 2017
- 258
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Facile fabrication of microstructured fluoropolymer encapsulation for light extraction enhancement of deep ultraviolet LEDsPeng, Yang / Mou, Yun / Cheng, Hao / Jiang, Pengqiang / Chen, Zhen / Chen, Mingxiang et al. | 2017
- 262
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Study on the process of fluid Jet dispensing based on high and low voltage driveCheng, Xikang / Deng, Guiling / Zhou, Can / Wang, Na / Cui, Wenjian et al. | 2017
- 266
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The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compoundWang, Fengjiang / Li, Dongyang / Huang, Ying et al. | 2017
- 271
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Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs)Li, Saipeng / Wang, Dapeng / Zhou, Jian / Xue, Feng / He, Xinyue et al. | 2017
- 275
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Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)Li, Saipeng / He, Xinyue / Hao, Jian / Zhou, Jian / Xue, Feng et al. | 2017
- 280
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Effect of electromigration and aging on evolution of interfacial intermetallic compounds in Cu-Solder-Cu solder jointsTian, Wenya / Li, Junhui et al. | 2017
- 286
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Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substratesWang, Fengjiang / Xiao, Zhiping / Zhou, Lili et al. | 2017
- 291
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Design and simulation of a 2.4GHz bandpass filter on silicon substrateSima, Ge / Hu, Wenhua / Xu, Jian / Sun, Peng et al. | 2017
- 296
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Etching process development for 3D wafer level via last TSV packageRen, Yulong / Geng, Fei / Sun, Peng / Sun, Yanan / Sima, Ge et al. | 2017
- 301
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Research on microstructures of double interfaces SAC305 solder joint by RPCChen, Jibing / Wan, Nong / Li, Juying / He, Zhanwen / Wu, Yiping et al. | 2017
- 305
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Performances and microstructures of a high-power LED based on rapid thermal cyclingChen, Jibing / Wan, Nong / Li, Juying / He, Zhanwen / Wu, Yiping et al. | 2017
- 309
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Copper pillar bump surface smoothness simulation studies in through-silicon via technologyDong, Wenhao / Li, Ming / Gao, Liming / Zhao, Wen et al. | 2017
- 313
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Simulations on the effective thermal dissipation of the microchannel heat sink with different pin finsJin, Zhiyu / Sun, Yunna / Luo, Jiangbo / Ding, Guifu et al. | 2017
- 318
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Research on the temperature field of piezoelectric stack based on different driving modeYang, Zhixiang / Deng, Guiling / Zhou, Can / Shen, Qian et al. | 2017
- 322
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Package & board level reliability study of 0.35mm fine pitch wafer level packageSun, Peng / Liu, Jun / Xu, Cheng / Cao, Liqiang et al. | 2017
- 327
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Residual stress distribution in wafers ground by different grinding parametersSun, Jinglong / Qin, Fei / Chen, Pei / An, Tong et al. | 2017
- 332
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Experimental study on the viscoelastic property of siliconeShan, Xiuyang / Chen, Yun et al. | 2017
- 336
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Design analysis of minichannel heat sink with indented fins under impingement flow conditionSui, Yang / Zhang, Hengyun / Li, Peichao / Lin, Tingyu et al. | 2017
- 342
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Thermal analysis and characterization of electronic packages with alternative lid coatingsZhang, Hengyun / Xu, Shen / Chen, Hao / Lin, Tingyu et al. | 2017
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Thermal investigation of high-power UV-LEDs using graphene oxide silicone encapsulantLiang, Renli / Xu, Linlin / Peng, Yang / Dai, Jiangnan / Chen, Changqing et al. | 2017
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The effect of the material and size of the flip-chip plastic package on warpingGao, Nayan / Wang, Jianfeng / Zou, Xi / Chen, Bo / Ming, Xuefei et al. | 2017
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Atomistic simulation on mechanical behaviors of Al/SiC nanocompositesYan, Yuping / Zhou, Shangru / Liu, Sheng et al. | 2017
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The simulation and verification of the passivation layer's residual stress aiming at a silicon-based fan-out package structureWang, Jianfeng / Gao, Nayan / Li, Yang / Ming, Xuefei / Wang, Shusheng et al. | 2017
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An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishesWang, Jing / Chen, Guang / Forbes, Henry / Christopoulos, Katerina / Liu, Changqing / Sun, Liangquan / Shang, Panju et al. | 2017
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Design of miniaturized tunable band - pass filter based on LTCC processWang, Erfan / Yang, Xiaodong / Xing, Mengjiang et al. | 2017
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Simulation analysis and optimization of pin failure of a CSOP-packaged devicesZhu, Yuan / Gao, Nayan / Zhang, Rongzhen et al. | 2017
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Feasibility analysis of the stacked-die ceramic packaging process in automotive electronicsMao, Chongchong / Zhu, Yuan / Li, Lianghai et al. | 2017
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Study on the reliability of the solder joint in the cryogenic environmentXu, Xing / Chen, Gaiqing / Cheng, Mingsheng et al. | 2017
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A comparative study of phosphor scattering model for phosphor-converted light-emitting diodesMa, Yupu / Cheng, Yanhua / Shu, Weicheng / Liu, Falong / Hu, Run / Luo, Xiaobing et al. | 2017
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Silica doped quantum dots film with enhanced light conversion efficiency for white light emitting diodesCheng, Yanhua / Xie, Bin / Ma, Yupu / Shu, Weicheng / Luo, Xiaobing et al. | 2017
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Effect of the substrate temperature on the phosphor sedimentation of phosphor-converted LEDsShu, Weicheng / Yu, Xingjian / Hu, Run / Chen, Qi / Ma, Yupu / Luo, Xiaobing et al. | 2017
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Design of a hydro-dynamically levitated centrifugal micro-pump for the active liquid cooling systemWu, Ruikang / Duan, Bin / Liu, Falong / Wu, Han / Cheng, Yanhua / Luo, Xiaobing et al. | 2017
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Structural design of LED packaging in terms of lumen reliability by a statistical methodChen, Qi / Shang, Bofeng / Shu, Weicheng / Cheng, Yanhua / Luo, Xiaobing et al. | 2017
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Thermo-fluid simulation of the advanced IGBT module in a power stackSun, Xin-Yu / Ma, Sichao / Li, Ming / Gao, Liming et al. | 2017
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Hierarchically interconnected epoxy/BN-SCMC polymer composites with enhanced thermal conductivityHu, Jiantao / Zeng, Xiaoliang / Sun, Rong / Xu, Jian-bin / Wong, Ching-ping et al. | 2017
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A rapid PID control method for high-speed macro-micro composite positioning stageTan, Yutao / Gao, Jian / Zhang, Langyu / Jiang, Yongjun / Tang, Hui / He, Yunbo et al. | 2017
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The influence of pulse and ultrasonic agitation on TSV fillingZeng, Peng / Ren, Xinyu et al. | 2017
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Thermal-stress co-simulation of a Ka-band millimeter-wave T/R System in PackageXu, Gang / Zhong, Wei / Zeng, Rong / Li, Zhaorong / Huang, Xuejiao / Li, Zhipeng / Lv, Liming et al. | 2017
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Polyurethane-based flexible conductive adhesivesHongru, Ma / Shaocun, Yan / Zhe, Li / Xun, Tian / Lei, Ma / Yanqing, Ma et al. | 2017
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Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder jointJie-Bao, / Cao, Lihua / Chen, Chunhuan / Liu, Zhi-Quan et al. | 2017
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3D wafer level compression molding process development for image sensor packageMa, Shuying / Li, Mengqiang / Xiao, Zhiyi / Huang, Xiaohua / Yu, Daquan et al. | 2017
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A novel copper-coated ceramic substrate prepared by nano thermocompression bondingMou, Yun / Peng, Yang / Cheng, Hao / Hao, Ziliang / Chen, Mingxiang et al. | 2017
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Research on the structural reliability of the ceramic package for packaging SIPYang, Zhen-tao / Bo Peng, / Ling Gao, et al. | 2017
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Influence of lens structure on the mechanical strength of high-power light emitting diodesYu, Shudong / Chen, Kaihang / Zhuang, Baoshan / Tang, Yong / Li, Zongtao / Yu, Binhai et al. | 2017
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Low-temperature sintering of bimodal Ag nanoparticles for power electronics applicationsXiao, Yong / Cao, Yong / Zhang, Zhihao / Yang, Ming / Wang, Shuai / Li, Mingyu et al. | 2017
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The influence of the DC current on directional crystallization process of peritectic alloys simulationWang, Guotian / Ding, Hongsheng / Sun, Hongzhe et al. | 2017
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Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shapeZhao, Jingyi / Qin, Fei / An, Tong / Bie, Xiaorui / Fang, Chao et al. | 2017
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The effect of voids at the Cu3Sn/Cu interface on the failure behavior of the Cu/Sn63Pb37 solder joints under high-speed shear loadingLin, Qi / Hailong, Li / Wang, Chunqing et al. | 2017
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Effects of multiple reflow cycles on the reliability of Sn-Sb solders for power electronics packagingLi, Bin / Zhao, Zhenqing / Li, Mingyu / Wang, Tao / Li, Hui et al. | 2017
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Rapid sintering of copper nanopaste by pulse current for power electronics packagingHuang, Yuan / Hang, Chunjin / Tian, Yanhong / Zhang, He / Wang, Chenxi / Wang, Xiuli et al. | 2017
- 565
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Reliability evaluation of sintered silver and Sn-3Ag-0.5Cu solder joints using a thermal cycling testLi, Bin / Zhao, Zhenqing / Li, Mingyu / Wang, Tao / Li, Hui et al. | 2017
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Finite-element calculations of elastic fields within flip-chip solder bumps and Cu-pillar bumps under the influences of thermal stresses and joule heatingZhou, Peng / Zhao, Baojie / Zhen, Yubao / Liu, Shuo / Hu, Yuehua / Li, Jiayu et al. | 2017
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Flexible connection for reflow free fine pitch SMT componentsMa, Xiaosong / Xu, Bo / Cheng, Yongfa / Liu, Feiyang / Liang, Zhishen / Chen, Baiqiang / Li, Shiwang / Mo, Hanzhong / Zhong, Zhengqi / Wang, Hua et al. | 2017
- 580
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Reliability prediction of different size solder bumps in thermal shock test using FEMJia, Yongheng / Hang, Chunjin / Tian, Yanhong / Liu, Wei / Wang, Chunqing / Guo, Xuguang / Wang, Xiuli et al. | 2017
- 584
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Design and optimization of thermal-mechanical reliability of a TSV 3D Packaged Thermal Wind SensorGao, Shixuan / Yi, Zhenxiang / Ye, Yizhou / Huang, Qing-An / Qin, Ming et al. | 2017
- 588
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The preparation of monodisperse silver nanoparticles and its application in flexible printed electronicsShao, Weifang / Zhu, Pengli / Hu, Yougen / Sun, Rong / Wong, Chingping et al. | 2017
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Characterization of TSV transition properties using TRL methodYang, Jiapeng / Zhou, Jun / Shen, Ya et al. | 2017
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Study of the wafer warpage evolution by cooling to extremely low temperaturesCheng, Gong / Gai, Wei / Xu, Gaowei / Luo, Le et al. | 2017
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Fabrication of high Q factor integrated passive devices based on embedded Fan-out wafer level packageZhou, Xiufeng / Ming, Xuefei / Ji, Yong / Gao, Nayan / Li, Yang / Yao, Xin / Xue, Kai et al. | 2017
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Low-energy consumption and high-color-quality white organic light-emitting diodesTang, Zhenyu / Guo, Kunping / Si, Changfeng / Pan, Saihu / Wei, Bin et al. | 2017
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Analysis of the structure evolution and crack propagation of Cu-Filled TSV after thermal shock testDou, Haixiao / Yang, Miaomiao / Chen, Yanning / Qiao, Yanbin et al. | 2017
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Investigation on transient catastrophic optical damage in high power AlGaAs/GaAs laser diodesChen, Yanning / Qiao, Yanbin / Ma, Qiang / Li, Jianqiang / Shao, Jin / Yuan, Yidong / Tang, Xiaoke / Zhang, Haifeng / Zhao, Dongyan et al. | 2017
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The effect of loading rate on the shear behavior of BGA solder joints under board-levelZhang, Shiyong / Wang, Lifeng / Wang, Min / Bai, Yuhui / Jia, Keming et al. | 2017
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Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devicesZhang, Hao / Chen, Chuantong / Jiu, Jinting / Suganuma, Katsuaki et al. | 2017
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Flat blowing feeding method on performance improvement of SMD LED chip sortingLou, Yuxian / Wu, Tao et al. | 2017
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Finite element analysis of micro-scale CSP solder joint in 3D packaging under random vibrationHan, Li-shuai / Huang, Chun-yue / Yin, Rui / Ying, Liang / Huang, Gen-xin / Li, Tian-ming et al. | 2017
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Influence of solder cap thickness on the interfacial reaction in Cu/Sn/Ni copper pillar bumpLi, Ya / Rao, Li / Ling, Huiqin / Hu, Anmin / Li, Ming et al. | 2017
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The effect of curing agent on the properties of silver paste Electrically Conductive Adhesives(ECAs)Hao, Jian / He, Xinyue / Li, Saipeng / Zhou, Jian / Xue, Feng et al. | 2017
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Analysis of microstructure and interface morphology of Sn- based solder / Cu during pulsed hot - pressing weldingWang, Min / Zhao, Zhili / Liu, Xin / Zhang, Shiyong et al. | 2017
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Microstructure and intermetallic compounds in Sn-3Ag-3Bi-3In solder joints on Cu matrixLi, Peng / Han, Jing / Wang, Yan / Guo, Fu / Ma, Limin / Wang, Yishu et al. | 2017
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SiC wafer bonding using surface activation method for power deviceMu, Fengwen / Fujino, Masahisa / Suga, Tadatomo / Iguchi, Kenichi / Nakazawa, Haruo / Takahashi, Yoshikazu et al. | 2017
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Investigation on wafer warpage evolution and wafer asymmetric deformation in fan-out wafer level packaging processesZhu, Chunsheng / Guo, Pengfei / Dai, Zibin et al. | 2017
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Inhomogeneous evolution of microscopic structure and crystal orientation in Sn3Ag0.5Cu under tensile stressQian, Yuhan / Han, Jing / Ma, Limin / Wang, Yishu / Guo, Fu et al. | 2017
- 674
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One failure analysis of switching filterHong, Tao / He, Zijun / Hu, Yongda / Bao, Shenxiang et al. | 2017
- 677
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Study on the influence of LED PN junction area on modulation bandwidth in visible light communicationZhou, Zheng / Liu Li-Lin, / Wang, Gang et al. | 2017
- 683
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Flexible connection for reflow free fine pitch SOP SMT componentsLiu, Feiyang / Ma, Xiaosong / Xu, Bo / Cheng, Yongfa / Liang, Zhishen / Chen, Baiqiang / Li, Shiwang / Mo, Hanzhong / Zhong, Zhengqi / Wang, Hua et al. | 2017
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Fabrication and thermal conduction mechanism of epoxy/modified SiCNP polymer compositesHuang, Yun / Zeng, Xiaoliang / Sun, Rong / Xu, Jian-bin / Wong, Ching-ping et al. | 2017
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Effect of annealling process on microstructure of Cu-TSVLi, Zeliang / Ma, Limin / Zhao, Xuewei / Wang, Yishu / Guo, Fu et al. | 2017
- 697
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Channel concatenated coding transmission scheme for TSV array transmissionDuan, Xiaoyang / Li, Zhensong / Chen, Tianfang / Miao, Min / Zhang, Yuexia et al. | 2017
- 703
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The evaluation of mechanical properties of Sn58BiXTi solder by tensile testZhou, Shiqi / Liu, Xiangdong / Mokhtari, Omid / Nishikawa, Hiroshi et al. | 2017
- 708
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Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5CuChen, Bingjie / Wang, Kaimin / Yao, Yao et al. | 2017
- 712
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Research on the corrosion resistance of SAC305 solder added with Ag3Sn and Cu3Sn nanoparticlesHuang, Chao / Rao, Li / Ling, Huiqin / Hu, Anmin / Li, Ming et al. | 2017
- 716
-
Study of the growth behavior of prism-type Cu6Sn5 in the liquid solderZhang, Shuo / Han, Jing / Ma, Limin / Wang, Yishu / Guo, Fu et al. | 2017
- 720
-
Chip-scale scalar atomic magnetometer operating in geomagnetic environmentZhihua, Pan / Jintang, Shang / Lin, Lu / Yu, Ji et al. | 2017
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The study of natural exposure testing for LED lighting systemBin, Yao / Huawei, Xu / Zhou Zhenwei, / Lu, Guoguang / Lai, Canxiong / Li Ruguan, et al. | 2017
- 731
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An analysis case on the failure of BGA solder jointsLi, Weiming / Sun, Xiaowei et al. | 2017
- 735
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Studies of the failure mechanisms in LED and its driving moduleLu, Guoguang / Lai, CanXiong et al. | 2017
- 740
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Vibrational characteristics evaluation on mid-infrared solid state laserGuo-guang, Lu / Long, Han / Wei Lei, et al. | 2017
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The influence of thermal aging on reliability of Sn-58Bi interconnectsWang, Dapeng / Hao, Jian / Zhou, Jian / Xue, Feng / Tian, Shuang / Li, Saipeng et al. | 2017
- 750
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Study of EM and TM of Sn0.3Ag0.7Cu solder joints under high current stress and thermal gradientSun, Zhijie / Ma, Limin / Wang, Yishu / Han, Jing / Zuo, Yong / Guo, Fu et al. | 2017
- 755
-
A rate-dependent constitutive model considering effects of temperature cycles for lead-free soldersWang, Kaimin / Chen, Bingjie / Yao, Yao et al. | 2017
- 759
-
The degradation behaviors of white LEDs under highly accelerated stress testing (HAST)Yan, Bing / Teng, Dongdong / Liu, Lilin / Wang, Gang et al. | 2017
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Impact of substrate materials on packages warpageHao, Jianxia / Shang, Jing / Liu, Xiaodong / Hang, Tao / Gao, Liming / Li, Ming et al. | 2017
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Thermo-electric coupling reliability model of copper pillar bump based on Black equationZhou, Bin / Fu, Zhiwei / Huang, Yun / Yao, Ruohe / Zhang, Jinyuan et al. | 2017
- 774
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Fully-coupled electromigration simulation of sweat structureJiang, Yi-Ming / Li, Hai-Long et al. | 2017
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Silicon@conductive porous copper layer anode for rechargeable lithium-ion batteriesJu, Hanzhi / Hang, Tao / Li, Ming et al. | 2017
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Design of a Ku band 7-bit PIN diode phase shifterLan, Wanfei / Zhong, Dan / Dalin Jin, / Yang, Dan / Zhu, Zhaojun / Jia, Baofu et al. | 2017
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On reproducing the copper extrusion of through-silicon-vias from the atomic scaleLiu, Jinxin / Huang, Zhiheng / Conway, Paul P. / Altmann, Frank / Petzold, Matthias / Naumann, Falk et al. | 2017
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Process optimization for backward compatible reflow solderingYabing Zou, / Li, Weiming et al. | 2017
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The effect of conductive filler on the properties of electrically Conductive Adhesives(ECAs)Hao, Jian / Wang, Dapeng / Li, Saipeng / He, Xinyue / Zhou, Jian / Xue, Feng et al. | 2017
- 809
-
Study on mechanical properties of low silver lead-free solders under combined compression and shear loadingChen, Cong / Yu, Yingjie / Niu, Xiaoyan et al. | 2017
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The stress strain analysis under the reverse load of the embedded baseplate micro-scale grid array welderYin, Rui / Huang, Chun-yue / Huang, Gen-xin / Ying, Liang / Han, Li-shuai / Wang, Jian-pei / Li, Tian-ming et al. | 2017
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Microstructure and properties of AlCrFeNi intermetallic for electronic packaging shellRen, Mingxing / Wang, Guotian / Li, Bangsheng et al. | 2017
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Analysis and characterization of interconnect failure of Infrared Focal Plane ArrayLai, Canxiong / Yang, Shaohua / Lei, Dengyun / Hao, Lichao / Lu, Guoguang / Ye, Zhenhua et al. | 2017
- 824
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Hollow PdCu alloy catalysts for electroless copper/nickel depositionSheng, Guoqing / Chen, Jiahui / Zhang, Futao / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
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Aluminum coated spherical particles filled paraffin wax as a phase-change thermal interface materialsMao, Dasha / Xie, Jinqi / Sheng, Guoqing / Ye, Huangqing / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
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A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materialsKang, Jia-Hui / Sheng, Jia-Li / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
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PdCu alloy nanoparticles supported on reduced graphene oxide as active catalyst for electroless copper platingYe, Huang-Qing / Mao, Da-Sha / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
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Investigation of design and material optimization on high bandwidth Package on PackageHu, Ian / Lai, Wei-Hong / Wang, Ming-Han et al. | 2017
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Hermeticity test of low-melting point sealing glass and analysis of encapsulation failureTian, Rui / Li, Yi / Yin, Luqiao / Zhang, Jianhua et al. | 2017
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Electroless deposition of nickel conductive patterns using nickel-ion catalystsZhang, Futao / Xu, Lu / Xie, Jin-Qi / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
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Highly sensitive flexible pressure sensor based on microstructured PDMS for wearable electronics applicationZhang, Yuan / Hu, Yougen / Zhao, Tao / Zhu, Pengli / Sun, Rong / Wong, Chingping et al. | 2017
- 857
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ACU improvement of CCT-tunable LED device by electrospun nanofiber filmLiang, Guanwei / Chen, Junchi / Yan, Caiman / Li, Zongtao / Tang, Yong et al. | 2017
- 862
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High efficient Pd-based bimetallic alloyed catalyst for Electroless deposition of metallic copperSheng, Jia-Li / Kang, Jia-Hui / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
- 865
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Cu/adhesive hybrid bonding through a Cu-first bonding approach by using H-containing HCOOH vapor surface treatmentHe, Ran / Fujino, Masahisa / Akaike, Masatake / Suga, Tadatomo / Sakai, Taiji / Sakuyama, Seiki et al. | 2017
- 871
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Enhancement of thermal conductivity of epoxy adhesives by ball milling copper flakesXu, Lu / Wen, Hao-Ran / Zhang, Futao / Yuen, Matthew M.F. / Fu, Xian-Zhu / Sun, Rong / Wong, Ching-Ping et al. | 2017
- 875
-
Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solderWang, Qiwei / Xiao, Yong / Zhang, Xingyi et al. | 2017
- 879
-
Study on organic/inorganic hybrid light emitting diodeXu, Xiaoxue / Chen, Zhangfu / Tang, Zhenyu / Wei, Bin / Yang, Lianqiao et al. | 2017
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Surface modification of nano-size SiO2 filler for flip chip underfill applicationsLi, Gang / He, Yachuan / Zhu, Pengli / Zhao, Tao / Lu, Daoqiang Daniel / Sun, Rong / Wong, Chingping et al. | 2017
- 888
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A facile route to prepare metal nanostructure applied in SERS active substrateOuyang, Qionglin / Li, Gang / Shao, Weifang / Zhu, Pengli / Hu, Yougen / Sun, Rong / Wong, Chingping et al. | 2017
- 894
-
Dynamic finite element modeling of backside grinding process for TSV waferSun, Bo / Qin, Fei / Sun, Jinglong / Chen, Pei / An, Tong et al. | 2017
- 898
-
Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C-SVMWang, Rui / Zhili, Long / Xing, Zhou et al. | 2017
- 904
-
Power integrity design for package-board system based on BGASun, Haiyan / Wang, Xuemin / Sun, Ling / Zhao, Jicong / Sun, Wenjun et al. | 2017
- 908
-
Fine tuning development software for high precision and Multi-Axis Motion Control SystemZeng, Zhiping / He, Yunbo / Hu, Yongshan / Chen, Xun / Feng, Wenxian / Chen, Xin / Gao, Jian / Yang, Zhijun / Chen, Yun / Zhang, Kai et al. | 2017
- 912
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A failure analysis of the NTC thermistorsMo, Fuyao / Cai, Wei et al. | 2017
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Study on the factors which affecting the conductive anodic filament reliability for packing substrateHu, Chaohui et al. | 2017
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Failure analysis on the sealing glass insulator of semiconductor device with low resistance abnormityMeng, Meng / Wang, Xu / Wang, Zhibin / Sun, Jiajia et al. | 2017
- 923
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The Study of LED Silver Plated Lead Frame Discoloration MechanismXu, Huanxiang / Zhao, Zhenbo / Chen, Lan / Wang, Youliang et al. | 2017
- 927
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The effects of temperature and humidity on the optical properties of PMMA: A hybrid first principle calculation and molecular dynamic simulationMa, Ding / Yang, Daoguo / Chen, Xuanyou / Zhang, Maofen / Wang, Xiyou / Cai, Miao et al. | 2017
- 932
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A coupled thermal and mechanical modeling to investigate the stress of TSVs considering insulation layerYang, Hanjie / Cao, Sen / Chen, Zhuo / Zhu, Wenhui et al. | 2017
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Research on surface anti-reflection properties of nanowire array structure based on silicon solar cellsYao, Qin / Mo, Liping / Zhou, Zheng / Wu, Fengshun / Wu, Yinming et al. | 2017
- 940
-
Electro-thermal modelling of multichip power modules for high power converter applicationShahjalal, Mohammad / Lu, Hua / Bailey, Chris et al. | 2017
- 946
-
Research on the reliability of Cu/Sn copper pillar bumpZhao, Wen / Rao, Li / Hu, Anmin / Gao, Liming / Li, Ming et al. | 2017
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Thermal conductivity of thin finite-size β-SiC calculated by molecular dynamics combined with quantum correctionXiao, Chengdi / He, Hu / Li, Junhui / Cao, Sen / Zhu, Wenhui et al. | 2017
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Study on the microstructure of Si/solder/Si joint based on Al/Ni self-propagating exothermic reactionHu, Sicong / Zhou, Zheng / Liu, Hui / Zhu, Wenbo / Wu, Fengshun et al. | 2017
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The influence of heat transfer boundary conditions on the fusion zone size of Sn solder under localized and rapid heat sourceZhou, Zheng / Zhang, Anna / Liu, Hui / Mo, Liping / Wu, Fengshun et al. | 2017
- 966
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Solidification microstructure of tin-based solder in the rapid cooling conditionZhang, Anna / Zhou, Zheng / Mo, Liping / Wu, Fengshun / Liu, Hui et al. | 2017
- 971
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Study of epoxy molding compound with high dielectric constantLiu, Hongjie / Tan, Wei / Li, Lanxia / Cheng, Xingming / Wang, Zhen et al. | 2017
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-
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stageGuo, Bingfeng / Jiang, Chengrong / Kunwar, Anil / Chen, Jun / Zhao, Ning / Wang, Yunpeng / Ma, Haitao et al. | 2017
- 980
-
Study of highly accelerated life test for merging unit of intelligent substationJia-yong, Zhong / Sheng-zong, He / Tie-zhu, Chen / Sheng-jun, Yuan et al. | 2017
- 984
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Impact of tensile strength on thermal fatigue properties and failure modes of Sn-Ag-Cu-Ni solder jointsLiu, Xiaodong / Shang, Jing / Hao, Jianxia / Hu, Anmin / Gao, Liming / Li, Ming et al. | 2017
- 988
-
A new approach to minimize package warpage in reflow processLiu, Chuwen / Li, Ming / Lu, Jicun / Gao, Liming et al. | 2017
- 992
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Simulation design of piezoresistive sensors based on COMSOLMo, Zhu-Er / Wei, Qi-Qin / Xiao, Jing et al. | 2017
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The effect of Sb content in InAs1−xSbx/GaSb type-II superlatticesYi, Dandan / Li, Ming / Zhao, Liancheng / Xie, Chaoying / Gao, Liming et al. | 2017
- 1000
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Effects of POSS on the interfacial reactions between Sn-3.5Ag solders and Cu substrates during solderingWang, Xue / Han, Jing / Guo, Fu / Ma, Limin / Wang, Yishu et al. | 2017
- 1006
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Modeling and analysis on the elastic performance of SMT silicone rubber keypadChen, Xuanyou / Ma, Ding / Wang, Siyu / Luo, Zhenhe / Wang, Xiyou / Cai, Miao / Yang, Daoguo et al. | 2017
- 1011
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Reliability analysis of smartwatchYip, Yuk Ngang Zita / Zhu, Ze / Chan, Yan Cheong et al. | 2017
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Simulation of the temperature field for bonding IGBT chip and DBC substrate using Al/Ni self-propagating foilXiang, Yuyan / Zhou, Zheng / Mo, Liping / Hui, Liu / Wu, Fengshun et al. | 2017
- 1021
-
Modelling the impact of conformal coating penetration on QFN reliabilityYin, Chunyan / Stoyanov, Stoyan / Bailey, Chris / Stewart, Paul et al. | 2017
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Chip-package co-design for optimization of 5.8GHz CMOS LNA performanceSun, Haiyan / Cheng, Xiuqing / Zhao, Jicong / Sun, Ling / Yang, Lingling et al. | 2017
- 1031
-
Investigation on thermal characteristics and fabrication of DUV-LEDs using copper filled thermal holeXu, Linlin / Liang, Renli / Long, Hanling / Dai, Jiangnan / Chen, Changqing et al. | 2017
- 1035
-
Effect of reflow time on shear property of Sn-9Zn solder bumpsSun, Menglong / Zhao, Qinghua / Wang, Dongfan / Hu, Anmin / Li, Ming et al. | 2017
- 1039
-
Analysis of wideband multilayer LTCC vertical via transition for millimeter-wave System-in-packageLi, Zhipeng / Wang, Ping / Zeng, Rong / Zhong, Wei et al. | 2017
- 1043
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Study on slip behavior of lead-free solder joints under uniaxial stressDong, Gaqiang / Tan, Shihai / Han, Jing / Wang, Yishu / Guo, Fu / Ma, Limin et al. | 2017
- 1046
-
Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase solderingMo, Liping / Zhou, Zheng / Wu, Fengshun / Liu, Shiyuan / Liu, Hui / Liu, Changqing et al. | 2017
- 1051
-
Easy-disassembly bonding of PDMS used for leak-tight encapsulation of microfluidic devicesWang, Jie / Wang, Shijie / Zhang, Peng / Li, Yujie et al. | 2017
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Fabrication and optical properties of CuInS2 quantum dotsWang, Zhe / Wang, Jie / He, Zhihao / Wang, Te / Zhang, Peng / Li, Yujie / Liu, Ronggang / Ma, Jinfeng et al. | 2017
- 1060
-
A study on the influence factors of parallel-gap welding heatLiu, Jing et al. | 2017
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Optimized design of high precision heating stage for die attach equipmentYao, Lixin / Wang, Junshuai / Wang, Zhiyue / Ye, Lezhi / Xu, Pinlie / Lang, Ping / Gao, Yue et al. | 2017
- 1069
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Design of super compact bandpass filter using silicon-based integrated passive device technologyLi, Nan / Li, Xiao-zhen / Xing, Meng-Jiang / Chen, Qi / Yang, Xiao-dong et al. | 2017
- 1073
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QFN cutting temperature measurement basing on the infrared thermal imagerYuan, Yue / Yu, Huiping / Qin, Fei / Yang, Liu / An, Tong / Chen, Pei et al. | 2017
- 1078
-
The electronic structure of new rare earth half-metallic materials TmSLiu, Qipeng / Chen, Xianping / Ye, Huaiyu / Zhang, G.O. et al. | 2017
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Research of SIR filter based on integrated passive device technologyZhang, Lei / Li, Xiao-zhen / Xing, Meng-Jiang / Chen, Qi / Yang, Xiao-dong et al. | 2017
- 1087
-
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stageGuo, Bingfeng / Jiang, Chengrong / Kunwar, Anil / Zhao, Ning / Chen, Jun / Wang, Yunpeng / Ma, Haitao et al. | 2017
- 1092
-
Design of microchannel heat sink using topology optimization for high power modules coolingXu, Ling / Li, Hao / Ding, Xiaohong / Liu, Sheng et al. | 2017
- 1098
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Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solderJiang, D.P. / Yao, Z.X. / Yin, L.M. / Wang, G. / Li, D. / Tian, X.K. et al. | 2017
- 1102
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Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesiveLi, Jinze / Zhang, Baotan / Zhu, Pengli / Gao, Yuan / Sun, Rong et al. | 2017
- 1107
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Liquid epoxy molding compound with high glass transition temperature and high thermal conductivityLi, Jinze / Zhang, Baotan / Zhu, Pengli / Li, Gang / Sun, Rong / Wong, Chingping et al. | 2017
- 1113
-
Design of a modulator based on hybrid SPPs structureQuan, Wang / Jing, Xiao / Qiqin, Wei / Ping, Liu et al. | 2017
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The waveguide coupler between fiber and slab waveguideLiu, Ping / Xiao, Jing / Yang, Dao-Guo et al. | 2017
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A low cost method to synthesize silver nanoparticles for the screen printing conductive inksWang, Zhuang / Zhao, Tao / Liang, Xiangwen / Zhu, PengLi / Sun, Rong et al. | 2017
- 1125
-
Fatigue life prediction of a board-level assembly for random vibrationsYang, Chen / Wang, Jun et al. | 2017
- 1130
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A 3D interconnection model and its applications in Package on PackageZhou, Yang / Wang, Bo / Liu, Jianfeng / Wu, Bowen / Ma, Qiang et al. | 2017
- 1133
-
Electromigration simulation of flip chip CSP LEDMa, Rui / Qin, Fei / Fan, Jiajie / Fan, Xuejun / Qian, Cheng et al. | 2017
- 1138
-
A first-principle study of the adsorption behavior of NO gas molecules on pristine and Al-doped penta-grapheneFeng, Chuang / Luan, Xing-He / Zhang, Ping / Xiao, Jing / Yang, Dao-Guo / Qin, Hong-Bo et al. | 2017
- 1143
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A hybrid genetic algorithm for automatic layout design of power moduleHao, Baisen / Mei, Yunhui / Ning, Puqi et al. | 2017
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Elimination the CMP defects for TSV process by optimizing the copper electrodepositionJiang, Chuang / Li, Ming / Wang, Su / Li, Yanyan / Yu, Xianxian et al. | 2017
- 1152
-
On-line monitoring flip LED chip performance degradation and failure analysisZhou, Lin / Jing, Gang / Liu, Yan / Luo, Haimei et al. | 2017
- 1157
-
Drop analysis of 3D SiP with Through Silicon ViaYao, Ruixia / Li, Tenghui / Huang, Pengfei / Su, Fei et al. | 2017
- 1163
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System level mechanical shock reliability of BGA packages: Experimental and numerical analysisGu, Jianghai / Xie, Weidong / Guirguis, Cherif / Ahmad, Mudasir / Pang, Yaoyu et al. | 2017
- 1169
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Research on failures of a microwave transmission line striding over structureWu, Yilong / Zeng, Yuanqi / Lu, Yinquan / Chen, Chunmei et al. | 2017
- 1173
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A conceivably stable non-cyanide electroless gold plating for electronic packaging applicationHuang, Mingqi / Li, Xiantang / Xia, Jianwen / Li, Xiaohai / Qiu, Wenyu / Zhang, Guoping / Sun, Rong / Mu, Yong et al. | 2017
- 1179
-
The degradation investigation of Al wire bonding strength in power device under thermal shock testFei, Jingming / Ren, Ping / Wang, Ningning / Zhang, Binbin et al. | 2017
- 1184
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Creep fracture analysis and control measures of aerospace electronic productsZhang, Binbin / He, Zongpeng / Zhang, Zhenming / Zhang, Jun / Wang, Ningning / Fei, Jingming et al. | 2017
- 1188
-
Research on SnSbNi solder joints between light emitting diode chip and heat sinkLiu, W. / Zhang, M. / Lin, Q.P. / Gao, Y.C. / Zhang, Z.Y. / Zhang, T.Z. / Zi, C.F. / Guo, L.C. et al. | 2017
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Effect of chips surface morphology on optical performance of remote and conformal phosphor-converted light-emitting diodesLi, Jiasheng / Yan, Caiman / Li, Zongtao / Yu, Binhai / Tang, Yong / Yuan, Dong et al. | 2017
- 1196
-
Simulation and optimization of X-band microstrip filters based on high-resistance silicon wafer with BCB dielectric and new shielding TSV structureWang, Wenhua / Zheng, Tao / Zhang, Weibo / Gai, Wei / Luo, Le / Xu, Gaowei et al. | 2017
- 1201
-
Low temperature liquid bonding using Cu@Sn preform for high temperature die attachXu, Hongyan / Wu, Qilong / Ning, Puqi / Xu, Ju et al. | 2017
- 1207
-
The study on elastic properties of Cu3Sn under pressure via first-principle calculationsNiu, Fan-Fan / Luan, Xing-He / Feng, Chuang / Zhang, Ying-Hong / Yang, Dao-Guo / Qin, Hong-Bo / Jiang, Hong-Jie / Liu, Feng-Mei et al. | 2017
- 1212
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Dielectric properties of epoxy nanocomposites filled with copper oxidesYang, Wenhu / Liao, Wei-Hsin / Yu, Shuhui / Sun, Rong et al. | 2017
- 1216
-
The reliability study of a kind of solid state power controller (SSPC)Sun, Xiaofeng / Zhang, Jun / Zhang, Baolin / Li, Songling / Zhang, Binbin / He, Zongpeng et al. | 2017
- 1219
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Method of fault analysis on typical hybrid Integrated circuit based on nondestructive testing technologyChen, Tao / Fei, Jingming / Sun, Xiaofeng / Guo, Kun / Rong, Nana / Zhang, Yingwei et al. | 2017
- 1223
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Rapid formation of intermetallic joints with Sn/metal composite alloys by ultrasonic-assisted soldering for high-temperature chip attachmentMa, Shu / Ji, Hongjun / Zhou, Junbo / Lu, Huajun / Liang, Meng / Li, Minggang / Li, Mingyu et al. | 2017
- 1229
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Overview of the assembly and packaging of wide band gap semiconductor technologiesZhao, Wenzhong / Yao, Quanbin et al. | 2017
- 1233
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The mechanism study of low-temperature brittle fracture of bulk Sn-based solderAn, Qi / Wang, Chunqing / Zhao, Xiangxi / Wang, Hong et al. | 2017
- 1238
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Improved permittivity and breakdown strength of PVDF composites filled with TiO2-SrTiO3 hybridsZhu, Xiaodong / Luo, Suibin / Ding, Shanjun / Wang, Cao / Song, Zijie / Yu, Shuhui / Sun, Rong / Wong, Ching-Ping et al. | 2017
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A new fabrication method of RF interposer applied in the integration of band pass filter in the frequency range of X bandZhang, Weibo / Wang, Wenhua / Xu, Gaowei / Luo, Le et al. | 2017
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Low temperature sintering of nanosilver paste for super-large-area substrate bondingJiang, Han-Ning / Li, Xin / Mei, Yun-Hui et al. | 2017
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Electro-deposition of Co-Ni sulfide nanosheet arrays on nickel foam and investigation of the pseudocapacitive performanceWang, Chao / Shen, Yanbin / Song, Zijie / Zhu, Xiaodong / Yu, Shuhui / Sun, Rong / Wong, Ching-Ping et al. | 2017
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Corrosion process study of Zn-30Sn high-temperature lead-free solderWang, Zhenghong / Zhang, Gong / Chen, Chuantong / Suganuma, Katsuaki et al. | 2017
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Failure analysis on SAC305 large-size BGA components attached with SnPb solderCong, S. / Han, Y. N. / Dong, Y. / Yang, J. / Zhang, W. W. et al. | 2017
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Influence of the QFN creep property through the thermal cycling reliabilityHe, Xiaobin / Xu, Yanming et al. | 2017
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Scalable synthesis of mono-dispersed nickel nanoparticles and their application as thermal conductive fillersLiu, Jiaxing / Wu, Dang / Zou, Peichao / Luo, Yingying / Wang, Min / Wang, Ronghe / Yang, Cheng et al. | 2017
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Scalable synthesis of monodispersed branched submicron silver particles as the printed electrically conductive adhesives fillersDeng, Yubin / Yang, Rui / Wu, Dang / Wang, Ronghe / Yang, Cheng et al. | 2017
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All-printed paper based supercapacitorsShi, Lu / Wang, Yang / Lai, Wenhui / Jiang, Zhi / Wang, Ronghe / Yang, Cheng et al. | 2017
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Silver pastes with excellent thermal conductivityLuo, Yingying / Wu, Dang / Yang, Rui / Liu, Jiaman / Su, Songyang / Cui, Xiaoya / Wang, Ronghe / Yang, Cheng et al. | 2017
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Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnectsKuang, Jiameng / Yang, Fan / Huang, Mingliang et al. | 2017
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Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigrationLiu, XingBo / Huang, Mingliang et al. | 2017
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Dominant effect of Sn grain orientation on electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder interconnectsSun, Hongyu / Huang, Mingliang et al. | 2017
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The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermomechanical propertyGao, Yuan / Zhu, Pengli / Li, Gang / Sun, Rong / Wong, Chingping et al. | 2017
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Warpage analysis of the fingerprint module with a thin-core substrateZhang, Bo / Yang, Chen / Lin, Yu / Xiao, Fei / Wang, Lei / Xie, Tianhua / Zhu, Kai et al. | 2017
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Optimization of reflow soldering process for white LED chip-scale-packages on substrateJiang, Chengshuo / Guo, Weiling / Fan, Jiajie / Qian, Cheng / Fan, Xuejun / Zhang, Guoqi et al. | 2017
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Study on temperature distribution of IGBT moduleFang, Chao / An, Tong / Qin, Fei / Bie, Xiaorui / Zhao, Jingyi et al. | 2017
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CNT-graphene heterostructures: First-principle study of electrical and thermal conductionsYan, Wei / Li, Guoyuan / Li, Bin / Zhou, Changjian / Tian, Ren-Yu / Yang, Xiao-Bao / Yang, Cary Y. et al. | 2017
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The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflowsMa, H.R. / Li, S. / Yao, M. J. / Wang, Y.P / Chen, J. / Zhao, N. / Ma, H.T. et al. | 2017
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Effect of cryogenic treatment on mechanical properties and microstructure of solder jointLi, Xiao / Yao, Yao et al. | 2017
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Degradation mechanism analysis for phosphor/silicone composites aged under high temperature and high humidity conditionLuo, Xiao / Fan, Jiajie / Zhang, Mengni / Qian, Cheng / Fan, Xuejun / Zhang, Guoqi et al. | 2017
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DDR4 dual-contact interconnect methodology, component, and board level reliabilityWang, Paul / Takizawa, Shigeyuki / He, David / Ge, Fred / Wang, Orson / Ye, Fred / Liang, Park / Tan, KG et al. | 2017
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Void risk prediction for Molded Underfill technology on flip chip packagesXu, Cheng / Liu, Jun / Xu, Jian / Sun, Peng / Hsu, Chih-Chung / Huang, Chao-Tsai et al. | 2017
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Application of orthogonal experimental design for the interfacial reliability of Through-Silicon Vias structureLi, Ganglong / Luo, Honglong / Zhu, Wenhui et al. | 2017
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Numerical analysis of thickness uniformity of thin film deposited by rectangular planar targetZhu, Guo / Sun, Jiangping / Guo, Xiongxiong / Zou, Xixi / Zhang, Libin / Gan, Zhiyin et al. | 2017
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A printable and flexible conductive polymer composite with sandwich structure for stretchable conductor and strain sensor applicationsHu, Yougen / Zhao, Tao / Zhu, Pengli / Zhang, Yuan / Liang, Xianwen / Sun, Rong / Wong, Ching-Ping et al. | 2017
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A highly sensitive flexible pressure sensor based on multi-scale structure and silver nanowiresMa, Longquan / Shuai, Xingtian / Zhu, Pengli / Sun, Rong et al. | 2017
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Packaging structure design for metal oxide gas sensorsWang, Xiyou / Zhang, Maofen / Yang, Daoguo et al. | 2017
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Effects of bonding parameters on the drop impact reliability of microbumps in chip on chip interconnectionLuo, Honglong / Li, Ganglong / Su, Qi / Zhu, Wenhui / Chen, Zhuo et al. | 2017
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Short-term life prediction based on field reliability data and combined life stress modelYao, Li / Hu, Yingjun / Zhang, Jiangming / Shen, Jianliang / Wang, Jun et al. | 2017
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Electrical transmission characterization of IPD microstrips up to 30GHzYang, Xiaodong / Xing, Mengjiang / Wang, Erfan / Zhang, Lei / Li, Nan / Qian, Zhouqiang et al. | 2017
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Luminous flux modeling for high power LED automotive headlamp moduleYu, Chaohua / Fan, Jiajie / Qian, Cheng / Fan, Xuejun / Zhang, Guoqi et al. | 2017
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Numerical simulation of the wire bonding reliability of IGBT module under power cyclingBie, Xiaorui / Qin, Fei / An, Tong / Zhao, Jingyi / Fang, Chao et al. | 2017
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The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflowsMa, H.R. / Wang, Y.P / Chen, J. / Ma, H.T. / Zhao, N. et al. | 2017
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Fabricating high temperature used solders with Cu@Ag core-shell micro-nano particle additionZhang, Tao / Liu, Yang / Zhao, Kai / Sun, Fenglian et al. | 2017
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A kind of LGA device assembly process and its reliability analysisMei, Zhu / Xuesi, Wen et al. | 2017
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Modelling for electric devices: A hydrogen sulfide gas sensor based on born phosphide monolayerLin, Zhongkang / Shi, Hao / Han, Ronggang / Wang, Liming / Cheng, Yongfa / Tan, Chunjian / Ye, Huaiyu / Chen, Xianping et al. | 2017
- 1417
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Modelling for electric devices: Adsorption of polluted gases on g-ZnO monolayerTian, Lifen / Shi, Hao / Lin, Zhongkang / Meng, Ruishen / Tan, Chunjian / Ye, Huaiyu / Chen, Xianping et al. | 2017
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Modulation of the electric properties of SnSe bi/mono-layer by strain and electrical fieldHan, Ronggang / Zhang, Zhe / Zhang, Peng / Sun, Xiang / Tan, Chunjian / Ye, Huaiyu / Chen, Xianping et al. | 2017
- 1425
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Study EOS of a gold wire by experiments and the finite element analysisTao, Xin / Zeng, Yuanhong / Wang, Jun / Wu, Xiaojing et al. | 2017
- 1429
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Study on the solder joint reliability of plastic ball grid array package for high reliability applicationLin, Pengrong / Lv, Xiaorui / Ding, Yajun et al. | 2017
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The investigation of interface effect on the properties of nanosilica-based underfillLu, Tianhao / Zheng, Peng / Cheng, Yuanrong / Li, Zhuo / Zhu, Pengli et al. | 2017
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Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradientZhong, Yi / Zhao, Ning / Dong, Wei / Ma, Haitao / Wang, Yunpeng / Wong, Ching-Ping et al. | 2017
- 1442
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Failure case analysis of quartz crystal based on failure mechanismZhong, Jia-yong / Zhang, You-qiang / Liu, Zu-jian / Yu, Hongxin / Chen, Tie-zhu / He, Sheng-zong / Hu, Lin / Sheng-jun, Yuan / Zhi-fan, Yang et al. | 2017
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Integrated process for high aspect ratio through glass viasXue, Kai / Jiang, Feng / Wu, Heng / Zhou, Xiufeng / Ming, Xuefei et al. | 2017
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Comparison on microstructure and mechanical property of composite solder joints with different reinforcementsZou, Zhouling / Wu, Fengshun / Mo, Liping / Zhou, Zheng / Liu, Hui et al. | 2017
- 1461
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Study on cracking failure of MLCC body based on mechanical stressLu, Tao / He, Xiao / Zou, Yabin / Wang, Hongqin / Zhou, Bin et al. | 2017
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Study of Cu-Cu low temperature direct bonding and contact resistance measurement on bonding interfaceYang, Wenhua / Lu, Yangting / Zhou, Chenggong / Zhang, Jian / Tadatomo, Suga et al. | 2017
- 1470
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Conductivity of silver and copper film printed by particle-free reactive inksXu, Hongbo / Tang, Xingming / Sun, Hailin / Zhao, Hongyun / Li, Mingyu et al. | 2017
- 1474
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Comparison of Darveaux model and Coffin-Manson model for fatigue life prediction of BGA solder jointsJiang, Liulu / Zhu, Wenhui / He, Hu et al. | 2017
- 1478
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Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradientZhao, Ning / Wang, Mingyao / Zhong, Yi / Ma, Haitao / Wang, Yunpeng / Wong, Ching-Ping et al. | 2017
- 1483
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The electronic properties of zinc-blende GaN, wurtzite GaN and pnma-GaN crystals under pressureLuan, Xing-He / Feng, Chuang / Qin, Hong-Bo / Niu, Fan-Fan / Yang, Dao-Guo et al. | 2017
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The process and reliability research of glass tube sealed diodeDai, Chenyi / Wu, Peng / Mu, Ruiqiang et al. | 2017
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Thermal effect on material properties of sintered porous silver during high temperature ageingChoe, Chanyang / Noh, Seungjun / Chen, Chuantong / Ishina, Toshiyuki / Nagao, Shijo / Suganuma, Katsuaki et al. | 2017
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Preparation of nano Cu@Ag core shell powder for electronic packagingZhao, Kai / Zhang, Tao / Liu, Yang / Sun, Fenglian et al. | 2017
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Quantitative polynomial free energy based phase field model for void motion and evolution in Sn under thermal gradientKunwar, Anil / Tonks, Michael R / Shang, Shengyan / Song, Xueguan / Wang, Yunpeng / Ma, Haitao et al. | 2017
- 1508
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Failure analysis on interconnection fault for BGA module after board assemblyXiao, Hui / Luo, Daojun / Sun, Zhe et al. | 2017
- 1513
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The conductive oxide impact on Aluminum alloy of YAG pulse laser weldingHai, Yang / Zhu, Jing et al. | 2017
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Study on the electrical performance of Au bump in FC ceramic packageLu, Feng / Hu, Peifeng / Ding, Yajun / Cao, Yusheng / Lian, Binhao / Wang, Yong et al. | 2017
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High reliable wire bonding consistency control in MMCMZongjie, Han / Wei, Yan / Yongfang, Hu / Xiaoxuan, Li et al. | 2017
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Study on preparation and rapid laser sintering process of nano silver pastesLiu, Wei / Xu, Ronglin / Wang, Chunqing / Tian, Yanhong et al. | 2017
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Influence of packaging effects on the mobile noise of planar SQUID gradiometer for airborne magnetic measurementsXu, Gaowei / Gai, Wei / Luo, Le / Zhang, Shulin / Xie, Xiaoming et al. | 2017
- 1533
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The effect of curing process on laser releasable debonding temporary material for 3D packagesXia, Jianwen / Zhang, Guoping et al. | 2017
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Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon viasLiu, Qiang / Zhang, Guoping / Sun, Rong / Lee, S. W. Ricky / Wong, C. P. et al. | 2017
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Delamination behavior of an end-linked PDMS/copper interface: A molecular dynamics studyWang, Wenjia / Pan, Kailin / Li, Tingting / Han, Xufeng / Cao, Weiwu / Gong, Siming / Wang, Wenhui / Fan, Kai et al. | 2017
- 1547
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Size effect of Sn3.0Ag0.5Cu solder joint on intermetallic layer growthWang, Shaobin / Yao, Yao et al. | 2017
- 1552
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The design of multilayer IC test board based on ATELiu, Jianhui / Pan, Fei / Zhou, Dexiang et al. | 2017
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The effects of encapsulation on fatigue lifetime of stretchable interconnects under uniaxial cyclic tensile loading by finite element methodsLi, Tingting / Pan, Kailin / Wang, Wenjia / Han, Xufeng / Cao, Weiwu et al. | 2017
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Effect of multilayer films and current on IMC formation in solder jointsLiu, Wei / Nie, Yuzhuo / Wang, Chunqing / Tian, Yanhong et al. | 2017
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The Cu@SiO2 core-shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysisDu, Jianying / Yang, Wenhu / Liao, Wei-Hsin / Xiong, Zhengye / Li, Feng / Yu, Shuhui / Sun, Rong et al. | 2017
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Study on the pre-tinned effect in the electroless tin plating processZheng, Zhen / Qiao, Zhen / Zhou, Wei / Wang, Chunqing et al. | 2017
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Processing and electrical properties of sodium citrate capped silver nanoparticle based inks for flexible electronicsYin, Can / Jin, Hong / Zhou, Zhou / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2017
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Effects of Cu nanoparticles doped flux on the microstructure of IMCs between Sn solder and Cu substrateShang, Shengyan / Kunwar, Anil / Wu, Yingchao / Ma, Haitao et al. | 2017
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Mechanical properties and microstructure of mixed SnAgCu-SnPb solder joints at cryogenic temperatureMa, Bin / Zhou, Bin / Wang, Shanlin / Li, Xunping et al. | 2017
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Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloyZhou, Zhou / Ma, Xiao / Zhou, Min-Bo / Yin, Can / Zhang, Xin-Ping et al. | 2017
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Copper-tin reaction and preparation of microsolder joints under high frequency alternating magnetic fieldLiu, Wei / Wang, Yiping / Wang, Chunqing / Tian, Yanhong et al. | 2017
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Rapid fabrication of joints using low temperature sintered silver nanoparticlesYang, Fan / Yang, Shihua / Bo Hu, / Lingyue Zeng, / Liu, Zhongyang / Gu, Jiahui / Zhao, Weiwei / Ma, Xing / Zhang, Jiaheng / Li, Mingyu et al. | 2017
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A novel method for bonding strength evaluationXu, Jikai / Wang, Chenxi / Qi, Xiaoyun / Jia, Yongheng / Ji, Xiaoliang / Tian, Yanhong / Wang, Chunqing et al. | 2017
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Investigation of bonding front propagation for wafer direct bondingLi, Yue / Wang, Chenxi / Wang, Yuan / Qi, Xiaoyun / Tian, Yanhong et al. | 2017
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Preparation of core-shell structured SiO2@Ag spheres and their role in improving micro-sized Ag flake filled electrically conductive adhesive for LED packagingJiang, Han / Zhou, Min-Bo / Zhu, Jie-Fei / Zhang, Xin-Ping et al. | 2017
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Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealingCai, Chongyang / An, Rong / Wang, Chunqing / Tian, Yanhong et al. | 2017
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Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element methodLiang, Shui-Bao / Wei, Cheng / Ke, Chang-Bo / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2017
- 1623
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The Fabrication of the Cu/Ni/Cu surface multilayer nano-array and the interconnection with the SAC305 solderZheng, Zhen / Yang, Fan / Yang, Ludong / Wang, Chunqing et al. | 2017
- 1626
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Investigation of moisture diffusion in plastic electronic packages by molecular dynamics simulationZhang, Yue / Wang, Chenxi / Yuan, Zhitian / Tian, Yanhong / Fan, Guoliang / Guo, Jason et al. | 2017
- 1631
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Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress fieldLiang, Shui-Bao / Ke, Chang-Bo / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2017
- 1637
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Thermal analysis and optimization of ytterbium doped double clad fiber laser based on a general analytic methodLv, Yi / Zheng, Huai / Liu, Sheng et al. | 2017
- 1642
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Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loadsLi, Wang-Yun / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2017
- 1649
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Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packagingHuang, Jia-Qiang / Zhou, Min-Bo / Zhao, Xing-Fei / Zhang, Xin-Ping et al. | 2017
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A significant blocking effect of Ni plating layer on the diffusion of Zn element of brass substrateDong, YunSong / Ding, Ying / Wang, Xiuli / Wu, Guangdong / Xiao, Bo / Tian, Yanhong et al. | 2017
- 1658
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Reliability and failure analysis of electronic components induced by the reflection of laser beam in the laser jet solder ball bonding processWu, Yue / Zhou, Min-Bo / Zhang, Xin-Ping et al. | 2017
- 1663
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Microstructure and properties of in - situ high entropy alloy matrix composites for electronic packaging shellRen, Mingxing / Wang, Guotian / Li, Bangsheng et al. | 2017
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Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump jointsZhou, Min-Bo / Zhao, Xing-Fei / Yue, Wu / Ke, Chang-Bo / Zhang, Xin-Ping et al. | 2017
- 1672
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Copper and graphene composite material prepared by electrodeposition and its potential application for 3D integrationWang, Xin / Wang, Qian / Hu, Yang / Lin Tan, / Cai, Jian et al. | 2017
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Drop performance evaluation for application of different underfill processesWu, Zhichao / Cai, Jian / Chen, Yu / Li, Jinwei et al. | 2017
- 1682
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A wearable bone-conducted speech enhancement system for strong background noisesHuang, Boyan / Yihan Gong, / Sun, Jinwei / Yi Shen, et al. | 2017
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Assessment of solder paste technology limitation at miniaturization for SIP and SMT applicationKeck, Joanna / Lee, Ning-Cheng et al. | 2017
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Nano-Cu sintering paste for high power devices die attach applicationsZhao, Jinjin / Yao, Min / Lee, Ning-Cheng et al. | 2017
- 1700
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Novel solder ally with wide service temperature capability for automotive applicationsGeng, Jie / Zhang, Hongwen / Mutuku, Francis / Lee, Ning-Cheng et al. | 2017
- c1
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[Front cover]| 2017