Modelling and application of silicon microphone systems (Englisch)
- Neue Suche nach: Mammen, H.-T.
- Neue Suche nach: Sturmer, U.
- Neue Suche nach: Koch, M.
- Neue Suche nach: Kohne, H.
- Neue Suche nach: Becker, K.-F.
- Neue Suche nach: John, W.
- Neue Suche nach: Reichl, H.
- Neue Suche nach: Mammen, H.-T.
- Neue Suche nach: Sturmer, U.
- Neue Suche nach: Koch, M.
- Neue Suche nach: Kohne, H.
- Neue Suche nach: Becker, K.-F.
- Neue Suche nach: John, W.
- Neue Suche nach: Reichl, H.
In:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
;
183-188
;
2004
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Modelling and application of silicon microphone systems
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Beteiligte:Mammen, H.-T. ( Autor:in ) / Sturmer, U. ( Autor:in ) / Koch, M. ( Autor:in ) / Kohne, H. ( Autor:in ) / Becker, K.-F. ( Autor:in ) / John, W. ( Autor:in ) / Reichl, H. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2004
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Format / Umfang:473273 byte
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ISBN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)| 2004
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Through wafer interconnection technologies for advanced electronic devicesde Samber, M. / Nellissen, T. / van Grunsven, E. et al. | 2004
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- 13
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Through-substrate trenches for RF isolation in wafer-level chip-scale packageSinaga, S.M. / Polyakov, A. / Bartek, M. / Burghartz, J.N. et al. | 2004
- 18
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High power planar interconnect for high frequency convertersFillion, R. / Delgado, E. / Beaupre, R. / McConnelee, P. et al. | 2004
- 25
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Assembly process development of stacked multi-chip leadframe packageYao, Y.F. / Njoman, B. / Chua, K.H. / Lin, T.Y. et al. | 2004
- 30
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Thermal qualification of 3D stacked die packagesRencz, M. / Farkas, G. / Szekely, V. / Poppe, A. / Courtois, B. et al. | 2004
- 36
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Examination of thermal performance of board-level QFP with unattached drop-in heat spreaderTong Hong Wang, / Chang-Chi Lee, / Yi-Shao Lai, et al. | 2004
- 41
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Voids in thermal interface material layers and their effect on thermal performanceGowda, A. / Esler, D. / Tonapi, S. / Nagarkar, K. / Srihari, K. et al. | 2004
- 47
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Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing techniqueLee, W.S. / Han, I.Y. / Jin Yu, / Kim, S.J. / Lee, T.Y. et al. | 2004
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Thermal management and characterization of flip chip BGA packagesKrishnamoorthi, S. / Chong, D.Y.R. / Sun, A.Y.S. et al. | 2004
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Modelling and application of silicon microphone systemsMammen, H.-T. / Sturmer, U. / Koch, M. / Kohne, H. / Becker, K.-F. / John, W. / Reichl, H. et al. | 2004
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Novel board level drop test simulation using implicit transient analysis with input-G methodJing-en Luan, / Tong Yan Tee, et al. | 2004
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Modeling of solder joint failure due to PCB bending during drop impactGu Jie, / Lim, C.T. / Tay, A.A.O. et al. | 2004
- 684
-
Finite element modeling of CSP package subjected to board level drop testWang, Y.Y. / Wang, F. / Chai, T.C. et al. | 2004
- 689
-
Transient simulation of solder joint fracturing under impact testChang-Lin Yen, / Yi-Shao Lai, et al. | 2004
- 695
-
Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verificationsChang-Lin Yeh, / Yi-Shao Lai, et al. | 2004
- 701
-
Gold ball-bond mechanical reliability at 40/spl mu/m pitch: squash height and bake temperature effectsBeleran, J. / Wulff, F. / Breach, C.D. et al. | 2004
- 707
-
Reliability improvement in low loop nailhead wirebonding for long Au wire in a high stress encapsulant materialYahya, A.K. / Lim Huey Ling, / Toh Ling Hoe, et al. | 2004
- 711
-
Modelling of free air ball for copper wire bondingTan, J. / Boon Hoe Toh, / Hong Meng Ho, et al. | 2004
- 718
-
Nonlinear elasto-plastic analysis of wire bond reliability for optical LQFP packageXueren Zhang, / Tong Yan Tee, / Cachia, C. et al. | 2004
- 723
-
Looping behaviour of gold ballbonding wireSaraswati, / Ei Phyu Phyu Theint, / Stephan, D. / Wulff, F.W. / Breach, C.D. / Calpito, D.R.M. et al. | 2004
- 729
-
Techniques for nano-scale deformation measurementSu Fei, / Sun Yaofeng, / Shi Xunqing, / Wong Chee Khuen Stephen, et al. | 2004
- 735
-
Effects of ball pad configuration on joint reliability in BGA chip-scale packagesChong, V. / Lee Teck Kheng, / Dewi Kartika Gunawan, / Lim Chwee Teck, et al. | 2004
- 740
-
Silicon steel core printed wiring board for a highly efficient low profile spindle motor for mobile storage devicesFujita, Y. / Amano, Y. / Yamaguchi, Y. et al. | 2004
- 743
-
Design analysis of touch chip for enhanced package and board level reliabilityTong Yan Tee, / Hun Shen Ng, / Siegel, H. / Bond, R. / Zhaowei Zhong, et al. | 2004
- 748
-
Integrated waveguides for optical interconnectsSweatman, D. / Powell, O. / Francis, S. et al. | 2004
- 753
-
Characterization of organic multi-mode optical waveguides for the electro-optical printed circuit board (EOPCB)Li-Cheng Shen, / Wei-Chung Lo, / Hsiang-Hung Chang, / Huan-Chun Fu, / Yuan-Chang Lee, / Yu-Chih Chen, / Shu-Ming Chang, / Wun-Yan Chen, / Ming-Chieh Chou, et al. | 2004
- 759
-
Low-cost plastic package transceiver components for large core fiber systemsHo, F. / Lui, B. / Wai Hung, / Fu-Wa Tong, / Choi, T. / Shu-Kin Yau, / Egnisaban, G. / Mangenete, T. / Ng, A. / Cheung, E. et al. | 2004
- 764
-
Time domain characterization of planar photonic crystal structuresPopov, A.P. et al. | 2004
- 767
-
Link simulation of four channel CWDM transceiver modulesPriyadarshi, A. / Ramana, P.V. / Leo, C.J. / Mhaisalkar, S.G. / Kripesh, V. et al. | 2004
- 772
-
Virtual prototyping and qualification of board level assemblyvan Driel, W.D. / Zhang, G.Q. / de Vries, J.W.C. / Jansen, M. / Ernst, L.J. et al. | 2004
- 776
-
Design of double layer WLCSP using DOE with factorial analysis technologyChang-Chun Lee, / Shu-Ming Chang, / Kuo-Ning Chiang, et al. | 2004
- 782
-
Weibull statistics of silicon die fractureBohm, C. / Hauck, T. / Juritza, A. / Muller, W.H. et al. | 2004
- 787
-
Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder jointsChe, F.X. / Pang, J.H.L. et al. | 2004
- 793
-
Design for standard impact pulses of drop tester using dynamic simulationHun Shen Ng, / Tong Yan Tee, / Jing-en Luan, et al. | 2004
- 800
-
Author's index| 2004
- 808
-
[Back cover]| 2004
- i
-
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Title page| 2004
- ii
-
Copyright| 2004
- iii
-
Foreward| 2004
- iv
-
Organising Committee| 2004
- v
-
Technical Committees| 2004
- vi
-
Table of Contents| 2004