Compact thermal models for thermally aware design of VLSI circuits (Englisch)
- Neue Suche nach: Singh, S.
- Neue Suche nach: Bansal, A.
- Neue Suche nach: Meterelliyoz, M.
- Neue Suche nach: Choi, J.H.
- Neue Suche nach: Roy, K.
- Neue Suche nach: Murthy, J.Y.
- Neue Suche nach: Singh, S.
- Neue Suche nach: Bansal, A.
- Neue Suche nach: Meterelliyoz, M.
- Neue Suche nach: Choi, J.H.
- Neue Suche nach: Roy, K.
- Neue Suche nach: Murthy, J.Y.
In:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
;
671-677
;
2006
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ISBN:
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ISSN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Compact thermal models for thermally aware design of VLSI circuits
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Beteiligte:Singh, S. ( Autor:in ) / Bansal, A. ( Autor:in ) / Meterelliyoz, M. ( Autor:in ) / Choi, J.H. ( Autor:in ) / Roy, K. ( Autor:in ) / Murthy, J.Y. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsdatum:01.01.2006
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Format / Umfang:844636 byte
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ISBN:
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ISSN:
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DOI:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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- 928
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Experimental characterization of the temperature dependence of the piezoresistive coefficients of siliconCho, C.H. / Jaeger, R.C. / Suhling, J.C. et al. | 2006
- 936
-
Impact of Enabling solution design on SLI reliability during Temperature Cycling using Shadow MoireMeyyappan, K. / Geng, P. / Ife Hsu, et al. | 2006
- 946
-
An experimental study of degradation of anisotropic conductive adhesive jointsLin, Y.C. / Xu Chen, / Wang, Z.P. et al. | 2006
- 953
-
Thermally-induced warpage measurement on small packages by a microscopic fringe projection systemJiahui Pan, / Zwemer, D.A. / Petriccione, G. / Curry, R. et al. | 2006
- 961
-
Effects of aging on the stress-strain and creep behaviors of lead free soldersHongtao Ma, / Suhling, J.C. / Lall, P. / Bozack, M.J. et al. | 2006
- 977
-
Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloysBhate, D. / Chan, D. / Subbarayan, G. / Chiu, T.C. et al. | 2006
- 984
-
Simulation of Sn-0.7Cu solder with bodner partom constitutive modelYing He, / Xu Chen, / Ning Bai, et al. | 2006
- 990
-
Creep life assessment of tin based lead free solders based on the imaginary initial strain rateMonden, K. et al. | 2006
- 997
-
Reliability and die stress measurements in flip chip assemblies with carbon fiber core laminate substratesCopeland, D.S. / Rahim, M.K. / Suhling, J.C. / Jaeger, R.C. / Lall, P. / Hongtao Ma, / Vasoya, K. et al. | 2006
- 1011
-
Isothermal cyclic bend fatigue test method for lead free solder jointsPang, J.H.L. / Fa-Xing Che, et al. | 2006
- 1018
-
IMC consideration in FEA simulation for PB-free solder joint reliabilityFa-Xing Che, / Pang, J.H.L. / Xu, L.H. et al. | 2006
- 1024
-
The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting StandardQiang Yu, / Shibutani, T. / Kobayashi, Y. / Shiratori, M. et al. | 2006
- 1031
-
A FE-study of solder fatigue compared to microstructural damage evaluation by in-SITU laser scanning and FIB microscopyDudek, R. / Faust, W. / Gollhard, A. / Michel, B. et al. | 2006
- 1038
-
Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loadingHossain, M.M. / Zahedi, F. / Agonafer, D. / Viswanadham, P. / Dunford, S.O. et al. | 2006
- 1049
-
Dynamic response of a portable electronic product subjected to an impact loadSharan, K. / Lahoti, S. / Jiang Zhou, et al. | 2006
- 1056
-
Design parameters influencing reliability of CCGA assembly: a sensitivity analysisTasooji, A. / Ghaffarian, R. / Rinaldi, A. et al. | 2006
- 1064
-
Evaluation Method of Board Level Drop Reliability for Electronic Component and Parametric AnalysisQiang Yu, / Tsurusawa, T. / Shibata, T. / Shiratori, M. / Katahira, T. et al. | 2006
- 1070
-
Development of ball impact test systemChang-Lin Yeh, / Yi-Shao Lai, et al. | 2006
- 1077
-
The effect of varying heat sink fin distances from cooling fan blade tip on noise emissionsUle, H. / Novak, C. / Gaspar, R. / Wiley, R. / Refai-Ahmed, G. et al. | 2006
- 1082
-
Reliability analysis on epoxy based thermal interface subjected to moisture environmentWei Zou, / Coffin, J. / Arvelo, A. et al. | 2006
- 1088
-
Computational Modeling of the Reliability of Stacked Low Density Interconnects DevicesHossain, M.M. / Yongje Lee, / Akhter, R. / Agonafer, D. / Dishongh, T. et al. | 2006
- 1097
-
Determination of Device Lifetime Under Pulsed Operating ConditionsBillups, A.J. / O'Haver, K.W. / Kopp, B.A. et al. | 2006
- 1102
-
Accelerated Active High-Temperature Cycling Test for Power MOSFETsSchacht, R. / Wunderle, B. / Auerswald, E. / Michel, B. / Reichl, H. et al. | 2006
- 1111
-
Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold PlatingKejun Zeng, / Stierman, R. / Abbott, D. / Murtuza, M. et al. | 2006
- 1120
-
Thermo-mechanical simulation of stacked chip scale packages with moire interferometry vaildationJohnson, Z.E. / Schneck, N.R. / Thoreson, A.R. / Stone, J.J. et al. | 2006
- 1126
-
Thermomechanical reliability of low-temperature sintered silver die-attachmentBai, J.G. / Calata, J.N. / Guangyin Lei, / Guo-Quan Lu, et al. | 2006
- 1137
-
Material behavior changes in underfill encapsulants exposed to isothermal agingChang Lin, / Islam, S. / Suhling, J.C. / Lall, P. et al. | 2006
- 1147
-
Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched SystemSong, G.Q. / Shi, X.Q. / Qin, F. / He, C.F. et al. | 2006
- 1153
-
Thermal Fatigue Reliability Evaluation for Micro-Sintered Compact Joints Made from Sub-Micron Gold PowderFujisawa, Y. / Qiang Yu, / Shibutani, T. / Tsurumi, K. / Ogashiwa, T. / Miyairi, M. et al. | 2006
- 1171
-
Thermal and electrical characterization and modeling of thin copper layersWenjun Liu, / Yizhang Yang, / Asheghi, M. et al. | 2006
- 1177
-
Analysis and simulation of refrigeration by electron emissionWestover, T.L. / Fisher, T.S. et al. | 2006
- 1185
-
Phonon relaxation rates in silicon thin films determined by molecular dynamicsGoicochea, J.V. / Madrid, M. / Amon, C.H. et al. | 2006
- 1199
-
A thermal conductivity model for micro-nanoscale diamond thin films using dispersion curve dataKalisik, T. / Majumdar, P. et al. | 2006
- 1208
-
Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreadersGerlach, D.W. / Joshi, Y.K. et al. | 2006
- 1220
-
A nonlinear fracture mechanics prespective on solder joint failure: going beyond the coffin-manson equationBhate, D. / Subbarayan, G. et al. | 2006
- 1226
-
Optimization of packaging materials and design for thermal management in stacked-die packagesSung-won Moon, / Dizon, M. / Chia-pin Chiu, / Garcia, E. et al. | 2006
- 1232
-
Durability of Pb-Free solder connection between copper interconect wire and crystalline silicon solar cellsCuddalorepanal, G. / Dasgupta, A. / Sealing, S. / Moyer, J. / Tolliver, T. / Loman, J. et al. | 2006
- 1257
-
Impact of Scaling on Thermal Behavior of Silicon-on-Insulator TransistorsEtessam-Yazdani, K. / Hussin, R. / Asheghi, M. et al. | 2006
- 1276
-
Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial ResistanceKanuparthi, S. / Zhang, X. / Subbarayan, G. / Sammakia, B. / Gowda, A. / Tonapi, S. et al. | 2006
- 1283
-
Computational thermal model for nanotube based electronic displayKumar, S. / Alam, M.A. / Murthy, J.Y. et al. | 2006
- 1292
-
Size effect in micro and nano structuresWenjun Liu, / Sadeghipour, S.M. / Asheghi, M. et al. | 2006
- 1299
-
Effect of Quantum Confinement on the Thermoelectric Properties of Semiconductor 2D Thin Films and 1D WiresBulusu, A. / Walker, D.G. et al. | 2006
- 1306
-
Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube FilmsPanzer, M. / Zhang, G. / Mann, D. / Hu, X. / Pop, E. / Dai, H. / Goodson, K.E. et al. | 2006
- 1314
-
Simultaneous electro-thermal test method for pyroelectric microsensorsSmith, B. / Vanderbeek, A. / Amon, C. et al. | 2006
- 1330
-
Thermal Performance Analysis of a Silicon Microreactor for Rapid DNA AnalysisGnanappa, A.K. / Cathy Ke, / Slattery, O. / Sheehan, M. et al. | 2006
- 1336
-
Accurate assessment of packaging stress effects on MEMS devicesZhang, X. / Park, S.B. / Navarro, R. / Judy, M.W. et al. | 2006
- 1343
-
Fracture mechanical life-time investigation of glass frit-bonded sensorsPetzold, M. / Dresbach, C. / Ebert, M. / Bagdahn, J. / Wiemer, M. / Glien, K. / Graf, J. / Muller-Fiedler, R. / Hofer, H. et al. | 2006
- 1358
-
Line bonding of wafers using transmission laser bonding technique for microsystem packagingPark, J. / Tseng, A.A. et al. | 2006
- 1371
-
Dynamic Circuit Analysis and Testing for International Space Station Science ExperimentsHoang, H. / Fu, S.J. et al. | 2006
- 1379
-
Reliability of flip chip assemblies subjected to extreme low temperaturesRahim, M.K. / Suhling, J.C. / Jaeger, R.C. / Lall, P. / Knight, R. et al. | 2006
- 1390
-
Cots in space: Developing an Environmental Control System for Balloon-Borne Air-Cooled ElectronicsMinichiello, A. et al. | 2006
- 1406
-
Indium Assisted Multiwalled Carbon Nanotube Array Thermal Interface MaterialsTao Tong, / Majumdar, A. / Yang Zhao, / Kashani, A. / Delzeit, L. / Meyyappan, M. et al. | 2006
- 1412
-
A Statistical Analysis of Thermal Interface Materials Enhanced by Vertically Aligned Carbon NanotubesDesai, A. / Geer, J. / Sammakia, B. et al. | 2006
- 1417
-
Design, Fabrication and testing of quantum well thermoelectric generatorJovanovic, V. / Ghamaty, S. / Elsner, N.B. et al. | 2006
- 1424
-
Author index| 2006
- i
-
Welcome| 2006
- iv
-
Breaker page| 2006
- vi
-
List of Conference Committees| 2006
- xxiv
-
Table of Contents| 2006