Low Resistance Cu Vias for 24nm Pitch and Beyond (Englisch)
- Neue Suche nach: van der Veen, Marleen H.
- Neue Suche nach: Pedreira, O. Varela
- Neue Suche nach: Jourdan, N.
- Neue Suche nach: Park, S.
- Neue Suche nach: Struyf, H.
- Neue Suche nach: Tokei, Zs.
- Neue Suche nach: Cerantes, C. Leal
- Neue Suche nach: Chen, F.
- Neue Suche nach: Xie, X.
- Neue Suche nach: Wu, Z.
- Neue Suche nach: Jansen, A.
- Neue Suche nach: Machillot, J.
- Neue Suche nach: Cockburn, A.
- Neue Suche nach: van der Veen, Marleen H.
- Neue Suche nach: Pedreira, O. Varela
- Neue Suche nach: Jourdan, N.
- Neue Suche nach: Park, S.
- Neue Suche nach: Struyf, H.
- Neue Suche nach: Tokei, Zs.
- Neue Suche nach: Cerantes, C. Leal
- Neue Suche nach: Chen, F.
- Neue Suche nach: Xie, X.
- Neue Suche nach: Wu, Z.
- Neue Suche nach: Jansen, A.
- Neue Suche nach: Machillot, J.
- Neue Suche nach: Cockburn, A.
In:
2022 IEEE International Interconnect Technology Conference (IITC)
;
129-131
;
2022
-
ISBN:
-
ISSN:
- Aufsatz (Konferenz) / Elektronische Ressource
-
Titel:Low Resistance Cu Vias for 24nm Pitch and Beyond
-
Beteiligte:van der Veen, Marleen H. ( Autor:in ) / Pedreira, O. Varela ( Autor:in ) / Jourdan, N. ( Autor:in ) / Park, S. ( Autor:in ) / Struyf, H. ( Autor:in ) / Tokei, Zs. ( Autor:in ) / Cerantes, C. Leal ( Autor:in ) / Chen, F. ( Autor:in ) / Xie, X. ( Autor:in ) / Wu, Z. ( Autor:in )
-
Erschienen in:
-
Verlag:
- Neue Suche nach: IEEE
-
Erscheinungsdatum:27.06.2022
-
Format / Umfang:1546647 byte
-
ISBN:
-
ISSN:
-
DOI:
-
Medientyp:Aufsatz (Konferenz)
-
Format:Elektronische Ressource
-
Sprache:Englisch
-
Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 5
-
Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image SensorTanida, K. / Suzuki, S. / Seo, T. / Morinaga, M. / Korogi, H. / Tetani, M. / Hamada, M. / Eto, R. / Yamashita, T. / Kato, Y. et al. | 2022
- 10
-
TSV fabrication technology using direct electroplating of Cu on the electroless plated barrier metalShingubara, Shoso / Shimizu, Tomohiro / Matsui, Kosuke / Miyake, Yuko / Torinari, Yuichiro / Motoyoshi, Makoto / Watariguchi, Shigeru / Watanabe, Hideki et al. | 2022
- 16
-
Carbon Plug Application in 3D NAND FabricationChang, Yu-Chih / Chen, Liang-Yu / Chen, Kuang-Wei / Luoh, Tuung / Yang, Ling-Wuu / Yang, Ta-Hone / Chen, Kuang-Chao et al. | 2022
- 19
-
Investigations at low temperature of 90 nm pitch BEOL for quantum applicationsSegaud, R. / Gergaud, P. / Minoret, S. / Neumann, P. / Gustavo, F. / Royer, A. / Licitra, C. / Mariolle, D. / Nemouchi, F. et al. | 2022
- 22
-
Effects of composition deviation of CuAl2 on ElectromigrationKuge, Toshihiro / Yahagi, Masataka / Koike, Junichi et al. | 2022
- 25
-
Dynamics of electromigration voids in Cu interconnects: investigation using a physics-based model augmented by neural networksSaleh, A. S. / Zahedmanesh, H. / Ceric, H. / Croes, K. / De Wolf, I. et al. | 2022
- 28
-
Reliability Evaluation of Semi-damascene Ru/Air-Gap interconnect with Metal Pitch down to 18 nmLesniewska, A. / Pedreira, O. Varela / Roussel, Ph. J. / Marti, G. / Pokhrel, A. / van der Veen, M. / Decoster, S. / O'Toole, M. / Murdoch, G. / Ciofi, I. et al. | 2022
- 31
-
Reliability benchmark of various via prefill metalsPedreira, O. Varela / Simons, V. / van der Veen, M.H / Ciofi, I. / Park, S. / Tokei, Zs. / Croes, K. / Pethe, S. / Lei, W. / Hwang, S. et al. | 2022
- 34
-
Failure Mode Analysis in Microsecond UV Laser Annealing of Cu Thin FilmsDemoulin, Remi / Daubriac, Richard / Thuries, Louis / Scheid, Emmanuel / Roze, Fabien / Cristiano, Fuccio / Tabata, Toshiyuki / Mazzamuto, Fulvio et al. | 2022
- 37
-
Recent Progress in Graphene Processes for Metallization and RF ApplicationsUeno, Kazuyoshi et al. | 2022
- 40
-
Advanced process technologies for continuous logic scaling towards 2nm node and beyond (Invited)Yamamoto, Tomonari et al. | 2022
- 42
-
Computational Analysis of the Role of Nanoconfinement on the Reliability of ULK GlassesKilic, Karsu I. / Dauskardt, Reinhold H. et al. | 2022
- 45
-
Improvement of Line-to-line TDDB by Cu and Barrier-metal Recess Structure for high voltage circuit in 3D Flash MemoryNoda, Mitsuhiko / Fujii, Kotaro / Yanai, Naomi / Watanabe, Tsubasa / Kato, Atsushi / Horibe, Kosuke / Yoshida, Eiru / Koide, Tatsuhiko / Fujita, Hiroshi / Nakajima, Yumi et al. | 2022
- 48
-
Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and belowMontero, D. / Vega-Gonzalez, V. / Feurprier, Y. / Pedreira, O. Varela / Oikawa, N. / Martinez, G.T. / Batuk, D. / Puliyalil, H. / Versluijs, J. / Decoster, H. et al. | 2022
- 51
-
Galvanic Corrosion Effect of Co Liner on ALD TaN BarrierJang, Junki / Kim, Changhyun / Yoon, Youngsoo / Choi, Yunki / Kim, Hoon / Park, Jungil / Park, Jaehyeong / Kang, Minguk / Kim, Youngwoo / Jang, Seonguk et al. | 2022
- 55
-
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnectsMotoyama, K. / Lanzillo, N. / Mukesh, S. / Peethala, B. / Spooner, T. / Edelstein, D. / Choi, K. et al. | 2022
- 58
-
Barrierless ALD Molybdenum for Buried Power Rail and Via-to-Buried Power Rail metallizationGupta, Anshul / Maes, Jan Willem / Jourdan, Nicolas / Zhu, Chiyu / Datta, Sukanya / Pedreira, Olalla Varela / Le, Quoc Toan / Radisic, Dunja / Heylen, Nancy / Pacco, Antoine et al. | 2022
- 61
-
MP18–26 Ru Direct-Etch Integration Development with Leakage Improvement and Increased Aspect RatioPokhrel, Ankit / Marti, Giulio / O'Toole, Martin / Murdoch, Gayle / Gupta, Anshul / Decoster, Stefan / Kundu, Souvik / Camerotto, Elisabeth / Le, Quoc Toan / Thiam, Arame et al. | 2022
- 64
-
Balancing Interconnect Resistance and Capacitance at the Advanced Technology Nodes based on Full Chip AnalysisShim, Da Eun / Naeemi, Azad et al. | 2022
- 67
-
A new methodology for modeling Air-Gap TDDBFang, Yu / Ciofi, I. / Roussel, Ph. / Lesniewska, A. / Degraeve, R. / Tierno, D. / De Wolf, I. / Croes, K. et al. | 2022
- 70
-
Stress and thermal stress evolution in Mo and Ru thin filmsFounta, Valeria / Soulie, Jean-Philippe / Dutta, Shibesh / De Wolf, Ingrid / Van de Vondel, Joris / Swerts, Johan / Tokei, Zsolt / Adelmann, Christoph et al. | 2022
- 73
-
Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallizationSoulie, Jean-Philippe / Tokei, Zsolt / Swerts, Johan / Adelmann, Christoph et al. | 2022
- 76
-
Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition with TiCl4 and Metal-Organic Precursors in Horizontal ViasKuo, Cheng-Hsuan / Mcleod, Aaron J / Huang, James / Wang, Victor / Yun, SeongUK / Zhang, Zichen / Spiegelman, Jeffrey / Kummel, Andrew C. et al. | 2022
- 79
-
Integration of Al2O3 Etch Stop Layer in 21nm Pitch Dual-Damascene BEOL interconnectsWu, C. / Vega-Gonzalez, V. / De Coster, H. / Le, Q. T. / Schleicher, F. / Lesniewska, A. / Murdoch, G. / Park, S. / Tokei, Zs. et al. | 2022
- 82
-
Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics DevicesKino, Hisashi / Fukushima, Takafumi / Tanaka, Tetsu et al. | 2022
- 85
-
Effect of Current on Ni Catalyst Layer Used for Current-Enhanced CVD of Multilayer GrapheneTokida, Jumpei / Hasumi, Reno / Ueno, Kazuyoshi et al. | 2022
- 87
-
Selective and Tunable Slurry for Advanced Packaging Epoxy Mold CompoundArata, Shogo / Noda, Chiaki / Ichige, Yasuhiro / Nomura, Satoyuki / Widodo, T. S. / Tsunoda, N. / Brun, X. F. et al. | 2022
- 90
-
Schottky barrier height reduction by oxide layer insertion in Al/n-GaN structureKoba, Jiro / Yahagi, Masataka / Koike, Junichi et al. | 2022
- 93
-
A Novel Air-gap Formation Method for Metal InterconnectChoi, Youngjoon / Cho, Sungsik et al. | 2022
- 96
-
Wet processes deposition for HAR TSV metallization using electroless Co liner and alkaline Cu seed layerQiu, Li-Na / Ni, Zi-Hong / Qu, Xin-Ping et al. | 2022
- 99
-
Ru electrodeposition and behaviors of additives for advanced technology nodesKim, Youjung / Han, Haneul / Lee, Jinhyun / Yoo, Bongyoung et al. | 2022
- 102
-
Electromigration Degradation of Gold Interconnects: A Statistical StudyCeric, H. / de Orio, R. L. / Selberherr, S. et al. | 2022
- 105
-
Scaling Down Diffusion Barriers: Performance and Thickness Dependence of TaN and Two-Dimensional-Material-Based Barrier LayersAstier, Hippolyte P.A.G. / Juvaid, M.M. / Sinha, Soumyadeep / Chung, Jing Yang / Srivastava, Saurabh / Das, Chandan / Sudijono, John / Gradecak, Silvija et al. | 2022
- 108
-
Change in resistivity of fine metal line by KrF excimer laser annealingUsami, Yasutsugu / Imokawa, Kaname / Nohdomi, Ryoichi / Kakizaki, Kouji / Mizoguchi, Hakaru et al. | 2022
- 111
-
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copperHan, Hanuel / Lee, Chaerin / Park, Sangwoo / Kim, Youjung / Yoo, Bongyoung et al. | 2022
- 114
-
Conformal Copper ECD Metallization Process for deep TSVWeidner, Thomas / Goetz, Volker / Roesch, Theresa / Bouhlal, Asmaa / Wunder, Nik / Reinert, Stephan / Griesbach, Kerst / Goebelt, Manuela / Mehner, Hannes et al. | 2022
- 117
-
Recent Advances in Ni-based GeSn MetallizationQuintero, Andrea / Gergaud, Patrice / Hartmann, Jean-Michel / Reboud, Vincent / Rodriguez, Philippe et al. | 2022
- 120
-
Ru ALD With Bulk-Like Resistivity for InterconnectsBreeden, Michael / Wang, Victor / Kanjolia, Ravindra / Moinpour, Mansour / Woodruff, Jacob / Simka, Harsono / Kummel, Andrew et al. | 2022
- 123
-
Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect ArchitecturesWilson, Janet M. / Lanzillo, Nicholas A. et al. | 2022
- 126
-
Performance improvement for Cu interconnects by SAM and ELD technologiesKikuchi, Y. / Iwashita, M. / Nagai, H. / Komatsu, H. / Ozaki, Y. / Fujita, K. / Pattanaik, G. / Kawasaki, H. / Iwai, K. et al. | 2022
- 129
-
Low Resistance Cu Vias for 24nm Pitch and Beyondvan der Veen, Marleen H. / Pedreira, O. Varela / Jourdan, N. / Park, S. / Struyf, H. / Tokei, Zs. / Cerantes, C. Leal / Chen, F. / Xie, X. / Wu, Z. et al. | 2022
- 133
-
EUV Minimum Pitch Single Patterning for 5nm Node ManufacturingPark, Jungil / Choi, Yunki / Ahn, Jeong Hoon / Jung, Byung Je / Lee, Hoyoun / Kim, Jinho / Park, Eunyoung / Park, Jaehyeong / Song, Hyun-Ji / Lee, Miji et al. | 2022
- 136
-
Evaluation of BEOL scaling boosters for sub-2nm using enhanced-RO analysisFarokhnejad, Anita / Esposto, Simone / Ciofi, Ivan / Zografos, Odysseas / Weckx, Pieter / Ryckaert, Julien / Schuddinck, Pieter / Xiang, Yang / Tokei, Zsolt et al. | 2022
- 139
-
Cryogenic CMOS Performance Analysis Including BEOL Characteristics at 4K for Quantum Controller ApplicationOkamoto, K. / Tanaka, T. / Miyamura, M. / Ishikuro, H. / Uchida, K. / Sakamoto, T. / Tada, M. et al. | 2022
- 142
-
Dual Damascene 28nm-Pitch Single Exposure EUV Design Rules Evaluation by Voltage Contrast CharacterizationCarballo, V.M. Blanco / Cerbu, D. / Schleicher, F. / van de Kerkhove, J. / Leray, P. / Kissoon, N. N. / De Poortere, E. P. et al. | 2022
- 145
-
ALD Mo for Advanced MOL Local InterconnectsHosseini, Maryamsadat / Tierno, Davide / Maes, Jan Willem / Zhu, Chiyu / Datta, Sukanya / Byun, Young / Mousa, Moataz / Jourdan, Nicolas / Litta, Eugenio Dentoni / Horiguchi, Naoto et al. | 2022
- 148
-
Low Resistivity Tungsten and Ruthenium through Textural Control Using Ion Beam DepositionMehta, Rutvik J. / Cerio, Frank / Wang, Yuejing Crystal / Turner, Paul / Kim, Jinho / Kulkarni, Ashish / Saghayezhian, Mohammad / Caldwell, Robert et al. | 2022