Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06). (Englisch)
Paper
- Neue Suche nach: Bin Zhang
- Neue Suche nach: Xiaokuo Yang
- Neue Suche nach: Jiahao Liu
- Neue Suche nach: Weiwei Li
- Neue Suche nach: Jie Xu
- Neue Suche nach: Bin Zhang
- Neue Suche nach: Xiaokuo Yang
- Neue Suche nach: Jiahao Liu
- Neue Suche nach: Weiwei Li
- Neue Suche nach: Jie Xu
In:
Journal of Semiconductors
;
39
, 2
;
024004
;
2018
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).
-
Untertitel:Paper
-
Weitere Titelangaben:Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections
-
Beteiligte:Bin Zhang ( Autor:in ) / Xiaokuo Yang ( Autor:in ) / Jiahao Liu ( Autor:in ) / Weiwei Li ( Autor:in ) / Jie Xu ( Autor:in )
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Erschienen in:Journal of Semiconductors ; 39, 2 ; 024004
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Verlag:
- Neue Suche nach: Institute of Physics
-
Erscheinungsdatum:01.02.2018
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Format / Umfang:6 pages
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ISSN:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 39, Ausgabe 2
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