Study on the mechanism of glass-SiC-glass anodic bonding process (Englisch)
- Neue Suche nach: Cheng, Xiao
- Neue Suche nach: Hu, Lifang
- Weitere Informationen zu Hu, Lifang:
- https://orcid.org/0000-0002-9501-0951
- Neue Suche nach: Liu, Wei
- Neue Suche nach: Chou, Zhao
- Neue Suche nach: Jia, Weijie
- Neue Suche nach: Mu, Wenjin
- Neue Suche nach: Cheng, Xiao
- Neue Suche nach: Hu, Lifang
- Weitere Informationen zu Hu, Lifang:
- https://orcid.org/0000-0002-9501-0951
- Neue Suche nach: Liu, Wei
- Neue Suche nach: Chou, Zhao
- Neue Suche nach: Jia, Weijie
- Neue Suche nach: Mu, Wenjin
In:
Journal of Micromechanics and Microengineering
;
34
, 4
;
2024
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Study on the mechanism of glass-SiC-glass anodic bonding process
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Beteiligte:Cheng, Xiao ( Autor:in ) / Hu, Lifang ( Autor:in ) / Liu, Wei ( Autor:in ) / Chou, Zhao ( Autor:in ) / Jia, Weijie ( Autor:in ) / Mu, Wenjin ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: IOP Publishing
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Erscheinungsdatum:01.04.2024
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Format / Umfang:9 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 34, Ausgabe 4
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